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NEWS

Amphenol Posts Record Q2 Results

Amphenol Posts Record Q2 Results

WALLINGFORD, CT-- Amphenol Corporation reported record results for the second quarter of 2026, with sales of $8.8 billion. “Sales increased...  Read More...

North American PCB Shipments Rise 12% YoY as June Book-to-Bill Hits 1.49

North American PCB Shipments Rise 12% YoY as June Book-to-Bill Hits 1.49

WASHINGTON, DC -- North American PCB shipments in June 2026 rose 12.0% compared to the same month last year. But compared to the preceding m...  Read More...

Incap Group Quarterly Revenue Up 34% YoY; Half-Year Earnings Up 21%

Incap Group Quarterly Revenue Up 34% YoY; Half-Year Earnings Up 21%

HELSINKI, FINLAND -- Incap Group has reported a quarterly revenue increase of 34.1% year-on-year, as well as a half-year bump of 21.1% over ...  Read More...

Worldwide Silicon Wafer Shipments Rise 7% in Q2

Worldwide Silicon Wafer Shipments Rise 7% in Q2

MILPITAS, CA -- Worldwide silicon wafer shipments increased 7% year-over-year in the second quarter as AI demand continued to drive semicond...  Read More...

Celestica Raises 2026 Outlook on Record Second-Quarter Results

Celestica Raises 2026 Outlook on Record Second-Quarter Results

TORONTO -- Celestica reported record second-quarter revenue and raised its full-year outlook as demand for AI infrastructure and cloud compu...  Read More...

Sanmina Raises AI Infrastructure Profile Following Strong Q3

Sanmina Raises AI Infrastructure Profile Following Strong Q3

SAN JOSE, CA -- Sanmina reported strong third-quarter fiscal yearly results as demand for AI infrastructure and cloud computing continued to...  Read More...

Cicor to Acquire EDMI Malaysia Facility

Cicor to Acquire EDMI Malaysia Facility

BRONSCHHOFEN, SWITZERLAND -- Cicor Group has agreed to acquire EDMI Electronics, the Malaysian manufacturing subsidiary of Singapore-based s...  Read More...

Incap Lowers 2026 Profit Growth Outlook

Incap Lowers 2026 Profit Growth Outlook

HELSINKI, FINLAND – Incap has lowered its 2026 profit outlook, citing margin pressure in certain market segments and ongoing global material...  Read More...

TE Connectivity to Acquire Astrodyne TDI

TE Connectivity to Acquire Astrodyne TDI

GALWAY, IRELAND – TE Connectivity has entered into a definitive agreement to acquire Astrodyne TDI, expanding its portfolio of power managem...  Read More...

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FEATURES

Finding a Place in PCB Design

Finding a Place in PCB Design

Lauren Waslick and Kristen Aguiar discuss mentorship, visibility and the career few people know exists. One of the PCB design community’s greatest talents is h...  Read More...

SMT Pogo Pins Shifting (Post-Reflow)

SMT Pogo Pins Shifting (Post-Reflow)

A stencil aperture modification eliminated pogo pin tilt during reflow, maintaining alignment within customer specifications. Pogo pins are specialized, spring...  Read More...

From Chat to Workflow: Turning AI Habits into Automated Processes

From Chat to Workflow: Turning AI Habits into Automated Processes

Moving from personal AI habits to standardized workflows can help manufacturing teams save time, improve consistency and scale practical AI use across operation...  Read More...

PCB East 2026: Bigger Venue, Bigger Crowds

PCB East 2026: Bigger Venue, Bigger Crowds

PCB East 2026 celebrated its move to Worcester with an increase in conference classes, exhibitors and attendance. I’ve always enjoyed attending PCB East (http:...  Read More...

PCB East 2026: The Conversations Kept Going

PCB East 2026: The Conversations Kept Going

PCB East 2026 combined nonstop show-floor traffic, technical learning and after-hours networking into one of the event’s busiest and most connected years yet. ...  Read More...

Semiconductor Market: Supply, Costs and Sourcing

Semiconductor Market: Supply, Costs and Sourcing

What tight supply and rising costs mean for your sourcing strategy. The first quarter of 2026 made clear that the semiconductor market is no longer moving in a...  Read More...

Evaluation of Solder Paste Printability with Solder Paste Inspection Equipment After Extended Stencil Cleaning Cycle Intervals

Evaluation of Solder Paste Printability with Solder Paste Inspection Equipment After Extended Stencil Cleaning Cycle Intervals

Extending stencil cleaning intervals to 50 prints maintained consistent deposition while improving throughput and reducing downtime. Solder paste printing is a...  Read More...

Nine Hidden Cost Traps in the Product Design Process

Nine Hidden Cost Traps in the Product Design Process

How DfX eliminates the hidden costs in product design and development. OEMs outsource manufacturing to control costs and accelerate product delivery. But by th...  Read More...

Reflow AI - Before there was Artificial Intelligence

Reflow AI - Before there was Artificial Intelligence

AI is now helping engineers tame the “black art” of SMT reflow by optimizing oven recipes and process decisions. Artificial intelligence is a hot topic in many...  Read More...

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PRODUCTS

Dymax Launches 9310 Adhesive for High-Reliability PCB Reinforcement

Dymax Launches 9310 Adhesive for High-Reliability PCB Reinforcement

Designed for advanced electronics and AI hardware, the Dymax 9310 adhesive cures in seconds with light, delivering a streamlined alternative to traditional unde...  Read More...

Hirose Launches BK35 Hybrid FPC-to-Board Connector

Hirose Launches BK35 Hybrid FPC-to-Board Connector

Featuring a fully shielded design, the BK35 hybrid FPC-to-board connector supports data transmission up to 40Gbps and RF signal transmission up to 40GHz while m...  Read More...

Hirose Launches BK35 Hybrid FPC-to-Board Connector

Hirose Launches BK35 Hybrid FPC-to-Board Connector

Featuring a fully shielded structure, the BK35 hybrid FPC-to-board connector supports data transmission up to 40Gbps and RF signal transmission up to 40GHz whil...  Read More...

Stackpole Electronics Expands RMCA Series Automotive Grade Chip Resistors

Stackpole Electronics Expands RMCA Series Automotive Grade Chip Resistors

Available with new high-power (-HP) and ultra-high-power (-UP) options, the RMCA Series automotive grade thick-film chip resistors provide greater power density...  Read More...

Altus Group Adds LPKF CuttingMaster 3290 Laser Depaneling System

Altus Group Adds LPKF CuttingMaster 3290 Laser Depaneling System

Combining 90W laser power with LPKF's Tensor Technology, the CuttingMaster 3290 laser depaneling system processes FR-4 substrates 2.4 mm thick and greater, alon...  Read More...

Count On Tools Releases Custom IL7 Nozzle

Count On Tools Releases Custom IL7 Nozzle

Designed for placement of the Hirose DF40C-80DP-0.4V female socket, the Custom Universal IL7 Nozzle (Part No. 2026-5682) features a 0.70 x 4.0 mm blade for secu...  Read More...

Yamaha Robotics Releases 1 Stop Smart Solution Updates

Yamaha Robotics Releases 1 Stop Smart Solution Updates

Surface mount assembly and inspection platform enhancements that add AI-assisted programming, defect classification and inspection capabilities to the YRi-V AOI...  Read More...

Master Bond Releases UV16Med-FD Adhesive

Master Bond Releases UV16Med-FD Adhesive

One-part, epoxy-based UV-curable adhesive with an integrated fluorescent dye for visual inspection of bond lines, overflow and voids in medical device assemblie...  Read More...

Tagarno Releases T50 Firmware Version 1.9

Tagarno Releases T50 Firmware Version 1.9

Digital microscope firmware update that adds QR-based preset sharing, Spot Focus and expanded preset management to improve inspection consistency and setup effi...  Read More...

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