OE-8001 die attach adhesive is a one-part heat curable methyl silicone resin adhesive for LED manufacturing. Reportedly offers better adhesion strength than conventional silicone DA and better thermal stability than conventional epoxy DA. Is formulated for good pin transfer.

Dow Corning, www.dowcorning.com

LS60V-LED automated SMT pick-and-place machine handles longer LED panel lengths and LED package nozzle dimensions and material selection. Uses touchless centering system, providing placement rates of up to 4,800 cph. Handles panels up to 800 mm. Comes with an array of nozzles for common LED packages. Custom nozzles available. Is capable of placing 0201s, SOICs, 0.0015" pitch QFPs and CSPs, BGAs, and µBGAs. 

APS Novastar, www.apsgold.com

Trident eSPC software is available on all PC-equipped Trident defluxing systems. Permits scanning (or manually entering) individual assembly barcodes as they are loaded. All process parameters are stored and can be viewed either on-screen or via a wireless printer. All relevant process data are stored and associated with specific assembly serial numbers. Automatically captures assembly serial number; date/time of batch (start and completion); programmed wash solution temperature; actual wash solution temperature; maximum quantity of programmed rinse cycles; actual quantity of rinse cycles; programmed cleanliness value; actual cleanliness value; pass/fail cleanliness status; programmed drying time; actual drying time; programmed drying temperature; actual drying temperature; operator name; operator notes, and equipment notifications (if any). Advanced search capability for specific assemblies that have been cleaned and tested.

Aqueous Technologies Corp., www.aqueoustech.com