Stamped Circuit Board thermal management draws heat away from beneath the chip quickly. Combines structured layers of metal and plastic for use in substrate assemblies. Is based on a reel-to-reel concept and offers possibilities to automate production. Possible solutions: with versatile stamping, materials can be inflected and stamped; the resulting shape stabilizes the substrate and fixates the lenses; open choice of many different materials and thicknesses; simpler operation, and quicker separation.
S2088BO-II automatic optical wirebond inspection desktop system is available. Was developed to inspect medium and small product runs, delivering defect detection on die, ball-wedge, wedge-wedge and security bonds. Reportedly guarantees reliable defect detection to cover typical bonds. During inspection, a high-res camera records all bond sites and wires. Inspects aluminum thick wire and aluminum, or gold thin wire connections, down to diameters of 17 μm. Inspection library includes inspection patterns for damaged and misplaced components. Is 100 % compatible with all Viscom inline systems; can be employed as a programming station.
PV-7010 potting agent is a fast room temperature or heat cure, as well as a thick section cure. Requires no solvents or cure byproducts. Is a translucent, tough dielectric gel with minimal shrinkage for protecting electronic devices in solar applications. Is used for coating, encapsulating or potting; seals and protects in applications requiring stronger adhesion or improved dimensional stability. Has a working time of 10 min. Is a 1:1, two-part silicone potting material used for junction box components. Is available in cartridges, pails and drums.
Tridak Model 475 diaphragm valves are designed to be used with low-to-medium viscosity fluids. Internal design prevents fluid contact with actuating components; reportedly ideal for reactive fluids such as cyanoacrylates and solvent-based adhesives and coatings. Minimal valve maintenance is required. Offer stroke adjustment. Are available in three configurations: Standard Model 475 features an UHMW polyethylene diaphragm, acetyl copolymer fluid body, and hard-coated aluminum air cylinder body; Model 475-T valve features a Teflon diaphragm and fluid body with a hard-coated aluminum air cylinder body; Model 475-SA valve incorporates an UHMW polyethylene diaphragm, passivated stainless steel fluid body, and hard-coated aluminum air cylinder body.
Trident OneShot automatic defluxing and cleanliness testing system is designed to provide automatic cleaning (de-fluxing), cleanliness testing, and drying of post-reflow circuit assemblies. Includes a 16" touch-screen interface, shadow-reducing focus-wash technology, unlimited recipe quantities, Windows PC control platform, networking capabilities, and real-time cleanliness testing. Features optional barcode scanning and SQL database searches. Is capable of removing all flux/paste residues (rosin, no-clean, water-soluble) from any alloy, and is designed to use a selection of pre-dosed defluxing chemistries. Boards are cleaned, cleanliness tested, and dried in less than 30 min.
Reflow Oven Cleaner is a micro-emulsion for cleaning reflow ovens and wave solder machines. Is a non-flammable, low toxicity, odor solvent designed to remove all types of flux residues; can prevent buildup of condensed flux residues. Can be used at temperatures between 20° C and 50 °C, with an optimum working temperature of 40°C. Can switch the oven on immediately after use. Contains inhibitors to prevent corrosion to ferrous and non-ferrous metals; is compatible with most plastics.