MYCenter 2.1 software improves SMT production control and efficiency. Three modules cover machine programming, data import and material handling, all unified into a redesigned single user interface that tracks thousands of parts while handling engineering changes, component deliveries and machine program revisions.

Provides a live database connection, allowing multiple users to work in parallel with real-time overviews of machine libraries. Displays nozzle size, tape pitch and width and landing pad information, ensuring correct part handling, orientation and placement. Convert bill-of-material (BoM) and Gerber data into ready-to-run machine programs. Material handling module gives real-time information on every individual reel, stick and tray. This makes it possible to track each carrier’s exact location, quantity or feeding parameters as it is used in different parts of the factory. Can be used alone or integrated into an ERP system.

Micronic Mydata, www.mydata.com

PowerFlow N2 is said to reduce lead-free wave solder operating costs as much as 90%. Features include 16" board width, plug-and-play preheat design (medium IR, convection, short IR and topside convection) and 1.8 meters of preheating. Optional preheating up to 2.4 meters can be added. New nozzle configuration brings chip wave closer to the laminar wave for reduced solder defects. Pin & chain transport throughout the fluxer and preheater. Feeds into a finger conveyor in the wave section. Bar code scanner on the new fluxer permits selective flux and programming "keep out areas" for board cut-outs, where the fluxer will not spray a specific are of the board. Process gas cleaning system (similar to reflow machines) regulates tunnel temperature compensation. Low profile (1.57m) design.

Ersa, www.ersa.com

HTCX (Heat Transfer Compound Xtra) silicone-free thermal paste includes a dispersant in the formulation that reportedly increases thermally conductivity without increasing film thickness. Is smoother and provides higher thermal conductivity, lower oil bleed and lower evaporation weight loss. Is said to be humidity- and thermal cycling-resistant. For thermal coupling electrical and electronic components, and between surfaces for thermal conductivity and heat dissipation.

Electrolube, www.electrolube.com

Thermoset SC-303, SC-309 and SC-320 thermally conductive silicone encapsulants are designed for thermal conductivity for electrical/electronic encapsulating applications. Are two-component systems designed to retain properties associated with silicones. Exhibit low shrinkage and stress on components as they cure, and maintain low viscosity. Are environmentally resistant and UL-rated; are composed of an addition-curing polydimethyl siloxane polymer that will not depolymerize when heated in confined spaces.

Lord Corp., www.lord.com/electronicmaterials