IS-I-460 inline selective soldering system handles boards up to 460 x 460 mm (18 x 18"). Features SMEMA pass-through conveyor. ach solder pot comes with inert hot nitrogen atmosphere feature. Comes with micro jet fluxer for clean soldering results and low flux consumption. Optional large top and bottom side preheating system, controlled by pyrometer.

InterSelect, www.myInterSelect.de

ERO-500 reflow oven has five top and five bottom vertical heating zones, and one cooling zone. Uses plenum convection heating for uniform temperature profiling across the entire printed circuit board. Maximum temperature of 320°C. Compatible with most lead and lead-free solder paste profiles. For low- to medium-volume production runs. Status light tower included. Mesh belt or edge rail conveyor units available. Real-time graphic temperature profiler.

DDM Novastar, ddmnovastar.com

FuzionXC2-37 and FuzionXC2-60 reportedly have more than twice the feeder inputs of other surface mount machines. Have NPI software tools featuring icon-driven interface and efficiency tools, including online component auto-teach and on-the-fly production editing. Ion feeders have top-loading design that reportedly reduces replenishment and changeover times by 50%. Combine high-speed chip to odd-form placements – from 01005 passive components up to 150mm connectors – with 5kg placement force and parts up to 25mm tall. FuzionXC2-37 accommodates boards up to 1300mm x 610mm, 272 8mm feeder inputs, and input types including strip, tape, tube, odd-form, and tray. The FuzionXC2-60 has 264 8mm feeder inputs.

Universal Instruments, www.uic.com

RO-Control and RO-Soft 7 software simulate, control and document RO300 and RO400 series reflow and curing ovens and processes. RO-Control 7 controls and regulates oven parameters such as zone temperatures, feed rate and conveyor width. Automatically set up certain ovens and start production. Status messages displayed graphically, and incoming and outgoing boards are monitored. Auto-save feature regularly captures temperature and speed values in a CSV type file. Operator actions are logged, and software modules can be released to specific individuals. Based on temperature settings, product data and throughput expectations, RO-Control simulates expected temperature profile, and graphically compares to measured values and solder paste specifications. Both packages measure real temperature profiles directly on the PCB using thermocouples. Multiple measurements can be overlaid to detect deviations. All data can be exported as CSV and graphics. Both packages require Windows 7 and can be upgraded from older versions. Language support now includes Polish.

Essemtec, www.essemtec.com