VisionPro AP500 3-D solder paste inspection system is a vibration-free platform. Software includes one-click measurements, real-time SPC run charts, customized data reports, and onboard work instructions.
ASC International, www.ASCInternational.com
XM AOI camera module has an image capture rate of up to 1.8 gigapixel/sec.. Features four-color illumination from all spatial directions for optimum contrast for all recognizable solder defects as well as for special effects such as script, polarity marks or colored components. Switchable optical resolution of 16 or 8 µm for higher throughput requirements. Extension of the angled view, capture of additional images for the verification station, and additional illuminations are nearly cycle time-neutral, for operator flexibility. Inspects down to 01005 components. Comes on S6056 AOI.
Viscom, www.viscom.com
Konform Flexcoat conformal coating is said to be as flexible as an RTV silicone, but without the disadvantages of silicone. Provides a soft, rubbery protective coating. Is said to coat evenly and provide a flexible, durable protective barrier against humidity, salt, corrosive vapors and fungus. It for flexible and rigid printed circuit boards and electronics assemblies. Cured coating can be removed by cutting a small section and peeling the coating away from the surface, or by solvent immersion of the whole board. Meets IPC-CC-830B Class B. Contains a UV indicator for quality control inspection. Compliant with European RoHS and REACH directives and most other environmental standards.
Chemtronics, www.chemtronics.com
Smart-Release nano layer stencil coating is said to reduce the frequency required for under-screen cleaning on the printer. Test results demonstrated that over 40 prints before cleaning can be reached, reportedly with no deterioration in print quality or bridging. Helps solder paste separate more easily from the stencil, with less contamination on the underside. Apertures and component edges are cleaner. Comes on all types of stencils, including laser cut, electroformed, NicAlloy, and chemically etched.
Photo Stencil, www.photostencil.com/apex2013.php
SEC Conflict Mineral Compliance system permits companies to maintain trade secrets about products and raw materials while simultaneously providing supply chain traceability. Users can upload reporting templates such as EICC-GeSI and IPC templates to a central data set for regulatory risk assessments and compliance reporting.
Comes as part of the Material Disclosure software line.
Actio, www.actio.net
FactoryLogix MES suite supports all types of discrete manufacturing, from PCB assembly, to complex box-builds, large system integrations and high-speed consumer goods processing. Manages entire manufacturing information environment including product launch, material logistics, manufacturing execution, operations analytics and real-time dashboard systems. Ensures materials traceability, data fulfillment and visibility.
Aegis, www.aiscorp.com
Press Releases
- OKI Develops Ultracompact Photonic Integrated Circuit Chip Using Silicon Photonics Technology to Realize Various Optical Sensors
- AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
- Occam Strengthens Leadership Team with Addition of PCB Expert Dana Korf
- ITW EAE Expands Partnership with Etek Europe to Represent Despatch Products in the UK and Ireland.