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New Products

Q Series 600 mL cartridges have leak-free mixer connections and standard side-by-side outlets. Are currently available in 600 mL, 1:1 ratio cartridges. Are easy to open and close; fit common industry dispensers; are pressure-tested and sturdy. Are available in polypropylene or nylon. Have an optional flow restrictor for low viscosity materials.

Sulzer Mixpac USA Inc., www.sulzermixpacusa.com

 

Multicore LF620 is a no-clean, halide-free, Pb-free solder paste that has a broad process window for printing, reflow and humidity resistance. Has a consistent print performance with minimal hot slump, even with temperatures of 86°F or more and relative humidity of 80%. Exhibits extremely low voiding in CSP via-in-pad joints, good coalescence and excellent solderability over a wide range of surface finishes, including Ni/Au, Immersion Sn, Immersion Ag and OSP copper. Has good printability at low or high speeds. Is well suited for the automotive sector.  Delivers a high tack force for component stability during high-speed placement, an abandon time of four hours and a print work-life of up to 24 hours.

Henkel, www.henkel.com/electronics
The IS-450 selective soldering machine automatically solders through-hole components onto mixed technology PCBs using an under-board mini-wave; solders connectors, capacitors and high-power devices onto boards at Pb-free process temperatures of 250º to 330ºC. Conducts dip-and-drag selective soldering for post-reflow, through-hole components and odd forms. Is powered by closed-loop servo motors for X, Y & Z axis motion that articulate the fluxer and mini-wave. Maintains adjustable clearance of as little as 1.5 mm. Reportedly solders from 3X to 8X more quickly, and with higher accuracy, than hand soldering. Is programmable off-line to govern wave temperature and height, travel speed and dwell time at each point.

Manncorp, www.manncorp.com

Vectra G Series includes two halogen-free liquid crystal polymer grades with processing characteristics that avoid issues commonly encountered when using flame-retardant, high temperature nylons to mold components. Vectra G131 and G331 are LCPs designed to help meet Pb-free soldering and halogen-free requirements. Vectra G131 is 35% glass-filled; Vectra G331 is 35% mineral- and glass-filled. Both are flame resistant without additives; V-0 to 0.15 mm; potential drop-in solutions for small FR, HT nylon parts. Said to achieve dimensional stability in thin-wall parts at more than 260°C. Processing advantages reportedly include fast molding cycle; no flash and mold deposit; Pb-free reflow capable; no moisture-related blister issues; longer tool life (noncorrosive in water-heated molds).

Ticona Engineering Polymers, www.ticona.com 

IPC-A-610E, Acceptability of Electronic Assemblies, provides visual acceptance criteria for post-assembly mechanical and soldering assembly requirements. Now addresses additional technologies, including flexible circuits, board-in-board, package-on-package, depanelization and additional SMT terminations. Photos and drawings showing good and bad connections have been updated. Contains 165 new or updated illustrations (800 total). Sections have been reorganized so data and images are easier to find and use. Changes that have occurred in array packaging since the standard’s last revision are also addressed, as are changes to hot tear and filet lifting.

IPC, www.ipc.org

MD-F3000 fiber laser marker is for direct part marking. Delivers 30W of power directly on the target surface; dense, hard metals can be permanently marked and etched in milliseconds. Small head permits easy installation in tight spaces; has a fan-less design and is sealed from dirt and dust. Incorporates 3-axis beam control system that provides marking across a 300 x 300 mm area. Marking Builder-2 software has been upgraded with a new quality function that reduces setup time.

Keyence, www.keyence.com/PRMDF

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