X2825 silica-filled board-level underfill encapsulant has a CTE of 26 ppm/°C. Is said to enhance drop and shock test reliability and provide thermal cycle performance. In one trial, thermal cycling of a BGA between -20° and +85°C, an unfilled version, with a CTE of 60 ppm/°C, resulted in first failure at 500 cycles; had no failures after 1500 cycles. Said to be reworkable at temperatures of 170° to 180°C.

Zymet, www.zymet.com

BPM Microsystems, www.bpmicro.com

R6000 halogen-free printer ribbon is for circuit board ID. Comes with a variety of halogen-free polyimide labels. Is environmentally friendly. Reportedly has near identical performance characteristics as existing R6000 ribbons. Contains 45 halogen ppm – bromine and chlorine combined.

Brady Corporation, www.bradyid.com

Q Series 1500 mL cartridges have leak-free mixer connections and self-bleeding Quadro pistons. Are currently available in 1:1 ratio cartridges. Fit all common industry dispensers. Are pressure-tested for safe operation. Are available in polypropylene or Nylon and in 7/8-9 or 7/8-14 threads. Outlets available are side-by-side or cut-off tip.

Sulzer Mixpac USA Inc., www.sulzermixpacusa.com