Circuits Assembly Online Magazine - New Products

New Products

Aquasol water-soluble solder paste can be used with any common soldering alloy. SnPb and Pb-free SAC and SN100C versions are available. Exhibits excellent performance in printing (including fine-pitch capability), placement, reflow and cleaning. There is efficient separation from the squeegee and good aperture release with long stencil life. Is possible to print at speeds high enough to meet or exceed the throughput of any SMD line. Features excellent slump resistance; residues can be removed with de-ionized water. Has extended tack time. Voiding is minimized in air and nitrogen processes. Post-soldering flux residue can be removed using hot de-ionized water with or without cleaning agents.

Cobar Solder Products, www.cobar.com

Fineplacer Core rework system is for a wide spectrum of SMT components, ranging in size from 0201 to 50 x 50 mm BGAs. Handles PCBs up to 300 x 400 mm. Semiautomated design includes force measurement with automatic component lift-off and placement. Is a compact, versatile hot-gas system that handles de-soldering, site dressing, paste print, reballing and component replacement.

Finetech, www.finetechusa.com

The suitcase-sized kit cart uses the single-package, single-location control feature. Provides non-dedicated, high-density, flexible component package storage and Web-based inventory control. Is designed to accommodate complete SMT kitting function for the production floor. With Web-based software, it provides location, inventory accuracy and correct component validation for feeder loading and replenishment. Displays the InoCart MSD unit, along with two versions of the InoCart material handling system.

Inovaxe, www.inovaxe.com

Anthem lead tinning system is ANSI, MIL, IEC and GEIA compliant. Is for high-precision, low- to mid-volume components and lead re-tinning. Features include two dynamic solder pots, preheat station, and flux station; high-precision ball screw drives; PID temperature control, and Windows PC. Programming control includes solder temperature; dynamic solder flow; emersion depth acceleration, deceleration, and feed rate; dwell time; X and Z axes, and optional rotary motion.

RPS Automation LLC, www.rpsautomation.com

Dual-VU inspection system delivers magnified real-time x-ray and optical component images simultaneously and at the same level of magnification. Can make direct, simultaneous comparisons between optical and x-ray images of a complex component. Reportedly reveals hidden solder bridges, voids and surface problems on BGAs in one pass. Simultaneously verifies solder joint integrity and placement accuracy of leaded IC components. Views component surface and interior at the same magnification, usually 15X. In failure analysis, signal traces on multilayer boards can be identified visually and tracked. Confirms electrical continuity of plating after drilling.

Glenbrook Technologies, www.glenbrooktech.com

TestWay reference coverage analysis tool quantifies and qualifies test coverage for a range of inspection and test equipments. Features probe analyzer, an interactive, rules-based routine to identify possible probe locations based on copper surface. Coordinates access constraints, spacing checks, test points assignment, use of largest probe size, pin offset and bead probes, and company-specific guidelines. Estimates ICT and FPT test coverage based on measurement capabilities of the targeted test equipment. Generates accessibility report that states whether adequate probe locations were identified for each net. Defines the test line and combines ICT or FPT with complementary test techniques, such as AOI, AXI, BST, FPT, ICT, MDA and functional test.

Aster Technologies, www.aster-technologies.com