mySelective 6745 selective soldering machine now features a new parallel processing design and dual-soldering nozzles said to nearly double throughput. Setup is quick using the Easyteach2 program.

XPM3 reflow oven now has an AUTOset fast setup feature capable of generating a preliminary reflow profile based on a PCB assembly’s physical characteristics. Also fine-tunes an optimized profile from the preliminary recipe if needed. Reportedly, 85% of the time, modification of the auto-created profile is not necessary.

AUTOset controls ramp-up heating rate, thermal soak, time above liquidus, peak temperature, and total heating time.

Vitronics Soltec, www.vitronics-soltec.com

Spectrum S-920N Series now comes with dual simultaneous jet dispensing, which uses two DispenseJet valves to jet fluid, reportedly reducing dispense time by 50%. Is for CSP underfill and LED silicone encapsulation on multi-up panelized or patterned parts. Ensures flow rates for both DispenseJets deliver the same mass per part. Automatically compensates for fluid viscosity changes over time, as well as batch-to-batch variations to keep the process under machine control. Ensures consistent Takt times. Jets feature flexible spacing options.

Nordson Asymtek, www.nordsonasymtek.com

Arlink 8000 modular workstation system is ergonomically designed for assembly, service, repair, research and technical work. Can be assembled and reconfigured quickly. Can be configured in a variety of heights and lengths to best suit specific needs. Comes in five standard industry widths and in three different heights up to 84".  Has a starter and adder system, with the option of back-to-back configurations; enables unlimited layout possibilities. The definite positioning system makes relocating or adjusting work surfaces, storage, shelving, lights, power beams, footrests, etc. easy. Has a virtually tool-free assembly and reconfiguration process. Work surfaces are available in standard laminate or static dissipative. Is available on casters to create mobile workstations or parts carts.

Lista International Corp., www.listaintl.com

X2825 silica-filled board-level underfill encapsulant has a CTE of 26 ppm/°C. Is said to enhance drop and shock test reliability and provide thermal cycle performance. In one trial, thermal cycling of a BGA between -20° and +85°C, an unfilled version, with a CTE of 60 ppm/°C, resulted in first failure at 500 cycles; had no failures after 1500 cycles. Said to be reworkable at temperatures of 170° to 180°C.

Zymet, www.zymet.com