New Products
FR-830 compact hot air preheater is said to deliver consistent heat through closed-loop temperature control, permitting preheating temperature between 300° and 572°F. Optional extension pipe extends airflow an additional 27 mm. vertically and a port to permit the preheating cycle to be activated by remote foot switch or hand switch. Can be integrated with Hakko FR-803B, so the start of the preheating cycle is directly controlled by the FR-803B rework profile. ESD-safe.
American Hakko Products, www.hakkousa.com
Paraquda SMD pick-and-place machine uses new materials for high-speed control. Features short changeover times, an intuitive operation system (Eplace), and an integrated quality management system. Has 210 feeder capacity. Head can simultaneously hold and measure four components. Component range is 01005 up to 4" sq., up to 1" in height. Min. pitch is specified with 0.01". High-resolution fly-by vision system is equipped with latest Cognex SMD image processing technology.
Essemtec, www.essemtec.com
Offline teaching program II software has an XML data structure that enables a bidirectional data exchange; taking solder programs out of the offline teaching program and into the machine and vice versa is possible without further conversions. Differences between the original solder program and the program stored in the machine control system can be displayed automatically. Can process image data from cameras and scans. Automatically eliminates common picture distortions. Offers globally storing periodical process parameters for use with particular solder points or soldering passages when developing new solder programs. After teaching all solder points, the program computes the fastest way to minimize handling. This prospectively computed cycle time is displayed directly.
SEHO Systems GmbH, www.seho.de
The Grieve Corporation, www.grievecorp.com
NL932 no-clean, Pb-free, halide-free solder paste is said to feature good solderability, improves stencil life, and provide superior cosmetics, especially when using SN100C. Offers print consistency with high process capability index across all board designs. Provides print release down to 0.55 SAR when used with the Slic Stencil. Features excellent wetting on OSP, NiAu, NiPdAu, SN100C and HAL. Displays repeatability and consistency in a wide range of temperatures (65°-85°F) and relative humidity (25-65% RH). Reportedly stencil prints at up to 200 mm/sec.; voiding exceeds IPC Class III.
FCT Assembly, www.fctassembly.com
NL930PT no-clean, Pb-free, halide-free pin probable solder paste has clear residues and is said to be consistently printable to low surface area ratios. Can be used with SN100C and SAC 305. Has good pin probability, print release to 0.55 SAR when used with Slic Stencil, and wets to all surface finishes, including OSP, NiAu, NiPdAu, SN100C and HAL. Displays repeatability and consistency in a range of temperatures (65°-85°F) and relative humidity (25-65% RH). Stencil prints at up to 200 mm/sec.; voiding performance exceeds IPC Class III requirements. Features enhanced tack performance and printer open time, as well as shiny solder joints when used with SN100C.
FCT Assembly, www.fctassembly.com
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