Circuits Assembly Online Magazine - New Products

New Products

No. 918 is a gas-heated, 350°F shelf oven currently used for lower temperature heat processing operations. Workspace dimensions measure 68" x 30" x 66". 100,000 BTU/hr. are installed in a modulating natural gas burner; a 1000 CFM, 1-HP recirculating blower provides horizontal airflow to the workload. Features an aluminized steel exterior and Type 430 stainless steel interior with 4" thick insulated walls, and a silicone rubber door gasket. Has 325 CFM and 1/3-HP powered forced exhauster. A digital indicating temperature controller displays actual and set point values. Two nickel-plated wire shelves are included with channel shelf supports.

The Grieve Corp., www.grievecorp.com

The 4000Plus multi-purpose bondtester is able to perform a wide range of shear and pull applications, as well as push functionality up to 50 kg. Is suitable for traditional bond tests, and meets the requirements of ribbon pull, hot bump pull and fatigue. Has anti-backlash system to aid the setting and control of step back. Is available with a range of XY stages, with a 160 mm XY stage as standard, and an image capture system. Has extended working envelope of 200 mm for testing oversize parts. Uses Paragon software.

Nordson Dage, www.nordsondage.com

PR1 BGA Solder Ball Checker is for inspection of BGA soldering and QFP lead sections. Provides inspection of soldered points and BGA surfaces; features a conductive body for ESD. Enables visual inspection of QFP leads and chip parts. The handheld tool is 50 x 30 x 15 mm. Weighs 25 g. Comes with a wrist strap. Is capable of inspecting the interior section of BGA packages using a battery-powered white LED lighting system. With an expanded lens, it is capable of up to 7X magnification.

Seika Machinery Inc., www.seikausa.com

SPC+ Software is a yield improvement tool for solder paste printing. Is a high-functionality statistical process control package that can be run on the system or offline. Analyzes images and data to track performance. Defect review, X Bars and S charts, Cp and CpK calculation, histograms, and other analytical tools can be calculated with Pareto charts and the ability to drill down on specific data points. Real-time capabilities permit immediate adjustment of solder paste printing parameters. Included free on all new Koh Young equipment.

Koh Young Technology, www.kohyoung.com

High-Throughput Flex Line includes twin MC-385 pick-and-place machines with a combined placement rate of 10,000 cph, each IPC-9850-rated at 5,500 cph, and capable of placing parts ranging from 0201 up to 150 mm x 100 mm. Includes MC-1400 automatic stencil printer, CR-8000 8-zone Pb-free reflow oven, and two conveyors to permit pre-reflow inspection.

Box Builder Line features MC-387 placer with 224-feeder capacity and IPC-9850-rated speed of 5,500 cph. Is for low-volume, high-mix runs. Can be programmed for multiple processing scenarios without changeovers and downtime. Line includes MC-1400 automatic stencil printer, CR-5000 5-zone Pb-free reflow oven and CT-90L inspection conveyor.

Manncorp, www.manncorp.com

MT9510XP tri-temp pick-and-place handler now offers a pressure booster option said to increase contact force. Enables testing of high pin count devices in up to eight contact sites in parallel. Reportedly doubles overall force available; twice as many pins can be contacted simultaneously.

Multitest, www.multitest.com/MT9510