Unity HiTemp syringe barrels are disposable 30cc barrels for reducing downtime and maintenance costs associated with aluminum barrels used in pneumatic dispensing of hot melt adhesives. Are said to withstand up to 180°C for 8 hr. for hot melt adhesive dispensing. Come in two models: a standard syringe barrel that withstands 125°C (257°F) for 8 hr. at up to 87 psi (6 bar) and an Extreme syringe barrel that withstands 180°C (356°F) for 8 hr. at up to 100 psi (7 bar). Standard barrels can be used with all hot melt adhesives, including moisture cure polyurethanes (PURs) and silyl modified polymers (SMPs). Extreme barrels can be used with polyamides and other types of hot melts, and block UV light between 200 and 500nm. Are compatible with all Nordson EFD Optimum metal dispense tips, adapters, and end caps; Unity IC Series and Unity PURJet 30 dispensing systems, and other standard industry hot melt dispensers.

Nordson EFD, www.nordsonefd.com/syringe_barrels

AKM600P warpage measurement system performs single shot warpage measurement of an entire Fan Out Wafer Level Processing (FOWLP) panel and individual die on panels up to 600 x 600 mm simultaneously. Provides z-resolution down to 1.25µm in under 2 sec. using patented Shadow Moiré technology. 

Conducts warpage measurements at room temperature, or up to 300°C if thermal profiles are needed.

Akrometrix LLC, akrometrix.com

TR7700QI stop-and-go 3D AOI system is for high-mix, high-volume manufacturing including mobile and PC applications.

LD-200P electronic load can be used for testing and evaluating a variety of DC power sources. Tests up to 200W. Can operate in CC, CV, CP, or CR mode while voltage/current or resistance/power values are measured and displayed in real time. Overvoltage and overcurrent protection help protect prototypes and printed circuit boards. Operates between 1-63V, 10mA-15A (200W max.); 20mV, 1mA, 0.1W, 0.1ohms.

Global Specialties, www.globalspecialties.com

Gap Filler 3500LV is a two-part liquid material that reportedly delivers high thermal conductivity and low volatility for reduced outgassing. Cures at room temp. with the option of accelerated curing through the addition of heat. Delivers thermal conductivity of 3.5 W/m-K and mechanical property benefits of silicone. Low volatile content is controlled lot to lot. Is beneficial in applications that require optics remain free of lens fogging, such as automotive headlamps, stadium lighting and high-intensity LEDs.  Once cured, it is a soft material that provides protection from shock and vibration. Has ability to fill tiny gaps and voids and has zero shrinkage.

Henkel, www.henkelna.com

Siplace BulkFeeder X eliminates component reels. Permits tapeless supply of components in sizes 0402, 0201 and 01005 for high-speed applications. Sets up like any classic feeder on changeover table, but holds up to 1.5 million components at a time. Coordinates interplay of shutter and vibration mechanisms, vision system, and placement heads. Eliminates splicing. Uses a vibrating mechanism to pour loose components from a container onto a pickup plate made of glass. Built-in camera takes a picture of the components from underneath the glass plate. The placement machine analyzes the image and determines which components are located on the plate in a position that is suitable for pickup and which are not, for example because they are upside down or too close to each other.

ASM Assembly Systems, www.siplace.com 

Mycronic 4.0 automated, intelligent factory software for just-in-time production enables visibility planning, material tracking, efficient changeovers, automated replenishment and intelligent storage solutions.

Mycronic, www.mycronic.com

DEK Nano Ultra Stencil  is said to improve solder paste transfer by up to 40% in fine-pitch applications with area ratios of less than 0.6. Benefits include volume stability; clean edges for improved print quality; higher process stability; lower underscreen cleaning frequency (reduced underscreen cleaning fabric and cleaning solvent consumption). Coating thickness of 2 to 4µm.

ASM Assembly Systems/DEK, www.dek.com

Siplace TX series placement machines place components down to 03015/0201 metric in high volumes.

RSV series convection reflow soldering ovens include vacuum to reduce voids to fewer than 1%. Come in five or six heating zone versions, each with one vacuum zone and two cooling zones. Footprint is 5,070mm up to 6,229mm. Handle PCBs from 100 x 150mm up to 330 x 250mm. Large flux collection unit is said to reduce flux cleanings to a few times per year.

Eightech Tectron, www.eightech.com

Maxrel solder alloy comes in solder paste, preform and wire formats. Maintains shear strength after 1,000 thermal cycles under high CTE mismatch conditions. For LED chip-on-board (COB) assembly where high CTE mismatch can exist between the die stack and substrate, and creep fatigue properties of the solder material are important.

Alpha, alpha.alent.com/Markets/LED

Two Part Mix solder pastes come in two compartment bags that keep flux and solder powder separate from each other until mixed.  Have two-year shelf life without refrigeration.  Mix inside bag by squeezing flux toward powder, causing seal to release. Knead bag end-to-end for two to three minutes to fully mix the paste.

Chip Quik, www.chipquik.com