Spectrum II Premier with IntelliJet jetting is for dispensing small dot sizes at high frequencies for advanced packaging applications. Incorporates two-piece ReadiSet jet cartridge. Jets fluids in dot sizes from one to hundreds of nL. Closed-loop process controls integrate features for IntelliJet setup, calibration, and control. Is built on Spectrum II fluid dispensing platform. Has self-calibration features. Only wetted fluid path parts are changed on ReadiSet jet cartridge.

Nordson Asymtek, www.Nordsonasymtek.com

planarCT module is for phoenix microme|x and nanome|x x-ray inspection systems to inspect solder joints and packages in printed circuit board assemblies. Non-destructive planar CT scan technology is for slice-based and volume inspection. Can adjust scan parameters, place the board on the inspection table, close the door and start the CT scan. High-precision manipulation table rotates region of interest in the x-ray beam; DXR detector captures 2D x-ray image series for slice reconstruction. Reconstructed slice or multislice view allows inspection results of a single plane or a whole package without overlaying structures from other board areas.

GE Measurement & Control, www.ge-mcs.com

Alpha mult-level Precision Milled Stencils are designed to enable control of paste deposits when assembling printed circuit boards containing a variety of thicknesses. Reportedly provide flexibility in the transition from one thickness to another. Reduced pressure can be used when printing stepped stencils; have increased flexibility in design of the “keep-out” area. Enable use of closed-head printing systems.

Alpha, www.alpha.alent.com

MY600JD solder paste jet printer now has high-speed and high-precision capabilities. Suitable for semiconductor and SMT applications such as semiconductor chip encapsulation, cavity fill and conductive adhesive dispensing. Is said to achieve micrometer precision while delivering throughputs 2 to 10 times higher than those of traditional dispensers, depending on the application. 

Mycronic, www.mycronic.com

STS-202 determines solderability of component leads and terminations prior to being joined in a soldering operation. Uses dip and look test method in conformance with IPC, ANSI and MIL standards, including J-STD-002, MIL-STD-883 Method 2003 and MIL-STD-202 Method 208. Uses comparative analysis technique.  Can be used in receiving inspection or on a production floor, as well as in a testing laboratory. Is designed to automate physical testing process; uses high-precision motion control, touch screen programming, and PID temperature controls. Can also be used for manual component lead tinning for low-volume applications.

Ace Production Technologies, www.ace-protech.com

Tergo high performance flux remover is designed for cleaning printed circuit boards in automated vapor degreasing systems. Is a nonflammable, low-temperature cleaning fluid that features a nonvolatile additive engineered to clean challenging solder pastes and flux residues. Removes white residues. Effective on water-soluble fluxes. Has secondary applications as a degreaser and can remove slight oxidation and tarnish from finished surfaces. Is compatible with vapor degreasing procedures. No hardware modifications normally are required. Is compliant with current and proposed European environmental, health and safety regulations.

MicroCare, www.microcare.com

EVO Cam digital microscope offers magnification options up to 300x and full auto focus. Designed for quality control, testing, inspection and documentation. Features live video streaming and full-HD 1080p/60fps image quality. Image capture direct to USB memory stick (without a PC). Integral 8-point LED ring light is for optimum shadow-free illumination. A 30:1 optical zoom views whole samples or small details at the touch of a button. Range of stand options and objective lens options.

Vision Engineering, visioneng.us

SpiderEye static AOI features eight high-frame-rate color cameras operating simultaneously, each with its own controlled LED light source.

ISO-Spector AOI offers full across-the-board inspection of components and solder joints.

URC high performance, low-odor urethane conformal coating adheres to a variety of substrates and has a fast touch-dry time. Chemically resistant coating has an operating temperature range of -40 to +130°C and meets IPC-CC-830 and MIL-1-46058C.

SC-102 100% solids silicone coating is suited to protecting delicate components. Soft, flexible coating has fast touch-dry time, and excellent thermal performance.

FPC fluorinated polymer coating has low surface energy and repels hydrocarbon and silicone oils, synthetic fluids and aqueous solutions. Is low solids and low film strength once cured, and does not require connectors to be masked prior to coating. Is nonflammable and contains a UV trace to aid visual inspection.

HFS is a nonflammable, high-performance fluorinated solvent for diluting fluorinated coatings. Fast touch-dry time.

Electrolube, www.electrolube.com

2K series two-part conformal coatings are fully IPC-CC-830 compliant. 2K100 is a low-stress general purpose coating for an operating temperature range of -40° to +100°C. Is hydrophobic, and resistant to salt mist, condensation and chemicals. 2K300 is hydrophobic and resistant to condensation, salt mist and chemicals, with a thermal performance range of -40° to +130°C.

2K500 is mechanically robust and offers good abrasion resistance along with increased thermal endurance (-40° to +140°C). Provides thermal shock performance. 

Electrolube, www.electrolube.com

Series 5002 Silver Zebra connector is for LCD to printed circuit board connections. For board-to-board connections where space is limited. Current carrying capacity up to 300 mA per square 0.040". Contact resistance of less than 500 mΩ. Creates redundant electrical contact through a unique product design that incorporates 240 alternating layers of silver-filled conductive elastomer and nonconductive silicone material per inch of connector. Provides a centerline pitch between layers of 0.004" (0.10mm) and permits 0.015" (0.381mm) pad spacing on the PCB.

Fujipoly America, fujipoly.com