Model 6100 stencil cleaner cleans 29" x 29" stencils in fewer than 2 min. Also cleans wave solder pallets, oven radiators, misprinted PCBs and associated tooling used in SMT printing process. Is compatible with EnviroGuard 100% closed-loop technology and 440-R SMT VOC-free stencil cleaning detergent. Is guaranteed to clean any type of SMT solder paste from any fine-pitch stencil.

Smart Sonic, www.smartsonic.com

DS-10 dip tester monitors temperature of preheat and solder temperature sensors, in addition to conventional management items, at 50ms sampling rate. Dedicated software implements process management. Features Dip Time Sensor for accurate measurement. Optional heat-resistant cover for high-heat loads, such as nitrogen ovens. Transmits data to a PC by USB cable, creating a profile function.

Malcom, http://www.malcom.co.jp/en/products/ds-10.php
Seika Machinery, www.seikausa.com

Delomonopox VE 72768 dual-curing epoxy resin offers bonding accuracy and is resistant to substances like oil, transmission fluid, gasoline, methanol and printing ink. Designed with hardeners, it is used where bonded or encapsulated components are exposed to extreme temperatures and harsh chemicals. Permits defined glob top encapsulation in tight spaces on a printed circuit board. With light curing, glob top forms a skin and can “freeze” its shape; adhesive doesn’t flow away during heat-curing process. Curing is a two-stage process: Adhesive is light-fixed in up to 5 sec. to achieve a die shear strength of more than 1N on the FR4 PCB material; then it is briefly heat cured (for example, 30 min. at 150°C) to obtain its full strength of 50MPa on FR4. Is offered in two viscosities, one for bonding applications and another for encapsulation.  Operating temperature range is from -65°C to 180°C.

Delo, www.delo.de/en/

NeoHorizon screen printer features a totally modular design. Can be equipped with various clamping systems, conveyors, sensors, camera systems and the latest version of the DEK ProFlow ATx printhead system at any time. Core cycles time 7.5 sec. and accuracy rating of up to 15µm @2 Cmk. New, robust cover makes it possible to perform all operations and maintenance from front of machine. Back-to-back configuration provides dual-track solution, or can be split and installed on separate lines. 03 iX model comes with DEK HawkEye 750 camera system, semiautomatic stencil alignment and new IUSC understencil cleaning system and has a core cycle times of 8 sec. and accuracy rating of 20µm @2 Cmk, for high-mix environments. 01 iX model has a core cycle time of 7.5 sec. and machine accuracy rating of 15µm @ 2 Cmk, HawkEye 1700 camera system, fully automatic stencil loading and DEK Cyclone understencil cleaning system.

ASM, asm-smt-solutions.com

Siplace E series placement machine features a long-board option, new feeder modules, and an improved user interface for faster programming. Comes in two configurations: Flex and Speed. Both are equipped with high-precision linear drives, high-end vision systems and placement force sensors. JTF tray feeder and stick feeder now accommodates Jedec tray feeders and bar magazines. Long-board option handles PCBs up to 1200mm long and 4.5mm high, for LED applications and industrial products. New S-Programming software interface for creating component descriptions and placement programs.

ASM Assembly Systems, siplace.com/

SB6NX58-M500SI solder paste is designed for high-stress environments such as automotive. Contains 6% indium to balance and optimize thermal stress and deformation characteristics. Is said to offer improved solder joint strength over SnAgBiIn paste, especially with AuNi plated components. Anti-shock resistance is five times greater than SB6N, at 150C x 500 hr. aging. Shear strength after T/C at -40/+125C equals that of OSP substrates. 

Koki Co., www.ko-ki.co.jp

RoboPlace is deployed in front of selective or wave soldering systems, and does not require any safety guards.

LMWS Laser Marking Workstation is designed for benchtop operation and features Class 1 industrial design. Offers wide range of marking capability for metals, ceramics, and many plastics; has cutting, drilling, and welding capabilities. Is suited for low-volume production and research and development environments in the automotive, medical, aerospace, electronic components, and battery industries.  Is powered by 10-50W LMF fiber laser markers. Includes motorized Z axis and rotary stage. Spring-loaded manual door opens for 180° access to parts and tooling. Comes with F 100, 160 and 254 lenses.

Amada Miyachi America, www.amadamiyachi.com

In-Sight Micro 8000 series cameras are ultra-compact, standalone vision systems with PC speeds. Use In-Sight Explorer software with EasyBuilder setup. Include PatMax RedLine technology. Measure 31 x 31 x 63mm and include Power over Ethernet, minimizing cabling. Are for integrating into tight spaces on robots and hard-to-reach machinery. Can be deployed almost anywhere on production line for guidance, inspection, gauging and industrial identification applications.

Cognex, www.cognex.com/In-SightMicro8000

Supreme 18TC is a single-component epoxy adhesive that contains thermally conductive fillers. Can be applied in bond lines as thin as 10 to 15µm. Offers thermal resistance of 5-7 x 10-6 K•m²/W and a thermal conductivity of 22-25 BTU•in/ft²•hr•°F [3.17-3.61 W/(m·K)]. Reportedly maintains high bond strength properties when exposed to hostile environmental conditions, including high or low temperatures. Bonds well to metals, composites, ceramics and plastics. Offers tensile lap shear strength of 2,200-2,400 psi, a tensile strength of 6,000-7,000 psi, and a compressive strength of 22,000-24,000 psi. Is a one-part system that doesn’t require mixing. Requires heat curing for 60-90 min. at 250-300°F. A post-cure of a few hours at 350°F optimizes performance properties. Features low shrinkage upon curing, low CTE and high degree of dimensional stability. Is a reliable electrical insulator. Is designed to withstand thermal cycling and shock. Is serviceable over the temperature range of 4K to +400°F. Passes NASA low outgassing tests.

Master Bond, www.masterbond.com

Versaflow 4/55 inline selective soldering system features motorized adjustable y-axis for fluxer- and solder module, y- and z-variability, full convection preheater and a 508 x 508mm usable process area for inline production.

Versaprint 3D-SPI combines stencil printing and 100% 3D solder paste inspection in one system.