iSpector v22x desktop AOI entry-level system is for low-volume, high-mix production.

Gap filler 1400SL thermal interface material is a two-part, silicone-based, liquid material with low viscosity for flowing in and around tight, uniquely shaped structures to fill small voids and provide thermal transfer. Thermal conductivity is 1.4W/m-K. Is soft when cured, permitting absorption of coefficient of thermal expansion (CTE) stresses and providing mechanical shock dampening. For applications such as high-power components such as FETs, industrial controllers with transient loads and automotive electronics like DC-DC converters for hybrid vehicles. Low VOC formulation. Cures at room temperature with no byproducts.

Henkel Adhesive Technologies, www.bergquistcompany.com

Q300 3D printer is 30% faster than the previous model, and features a build volume of 10 x 8 x 8" (255 x 205 x 205mm). Comes with HEPA filter to remove airborne contaminants and fumes, and an internal steel chassis and 100 micron resolution. Fully automatic platform leveling and height sensing. Features heated build platform, automatic platform leveling calibration and nozzle height calibration. Is compact -- fits on virtually any workbench or desk. One spool of premium ABS plastic (white) standard; many filament colors available.

Quant 3D, www.quant3d.com

RDS UV is a compact system for hardening UV coatings and adhesives, reportedly in seconds. Compact footprint. Low exhaust air flow rate and short warmup time make system ready for operation immediately after switching on. Can be equipped with undoped medium-pressure mercury lamps, doped UV lamps, UV LED arrays or special lamps that emit specific light spectrums.

Rehm Thermal Systems, www.rehm-group.com

RVDS vertical drying system achieves optimal drying of all kinds of protective coatings and casting compounds hardened by convection heating. Transports PCBs through the system vertically, and stacks loaded board carriers on top of each other in the tower during drying process. Automatic width setting of goods carrier enables boards of different sizes from different coating lines to be processed at the same time. Is flexible and space-saving. Features innovative control, blower, heating and sensor technologies. 

Rehm Thermal Systems, www.rehm-group.com

PF606-P133 is designed for selective laser soldering on solder joints sized 1.5mm or smaller, including temperature–sensitive components. Can be used in automatic laser soldering processes. Is said to produce well-formed solder joints with minimal flux residue and without splash or solder balls.

Shenmao America, www.shenmao.com

Unity HiTemp syringe barrels are disposable 30cc barrels for reducing downtime and maintenance costs associated with aluminum barrels used in pneumatic dispensing of hot melt adhesives. Are said to withstand up to 180°C for 8 hr. for hot melt adhesive dispensing. Come in two models: a standard syringe barrel that withstands 125°C (257°F) for 8 hr. at up to 87 psi (6 bar) and an Extreme syringe barrel that withstands 180°C (356°F) for 8 hr. at up to 100 psi (7 bar). Standard barrels can be used with all hot melt adhesives, including moisture cure polyurethanes (PURs) and silyl modified polymers (SMPs). Extreme barrels can be used with polyamides and other types of hot melts, and block UV light between 200 and 500nm. Are compatible with all Nordson EFD Optimum metal dispense tips, adapters, and end caps; Unity IC Series and Unity PURJet 30 dispensing systems, and other standard industry hot melt dispensers.

Nordson EFD, www.nordsonefd.com/syringe_barrels

AKM600P warpage measurement system performs single shot warpage measurement of an entire Fan Out Wafer Level Processing (FOWLP) panel and individual die on panels up to 600 x 600 mm simultaneously. Provides z-resolution down to 1.25µm in under 2 sec. using patented Shadow Moiré technology. 

Conducts warpage measurements at room temperature, or up to 300°C if thermal profiles are needed.

Akrometrix LLC, akrometrix.com

TR7700QI stop-and-go 3D AOI system is for high-mix, high-volume manufacturing including mobile and PC applications.

LD-200P electronic load can be used for testing and evaluating a variety of DC power sources. Tests up to 200W. Can operate in CC, CV, CP, or CR mode while voltage/current or resistance/power values are measured and displayed in real time. Overvoltage and overcurrent protection help protect prototypes and printed circuit boards. Operates between 1-63V, 10mA-15A (200W max.); 20mV, 1mA, 0.1W, 0.1ohms.

Global Specialties, www.globalspecialties.com

Gap Filler 3500LV is a two-part liquid material that reportedly delivers high thermal conductivity and low volatility for reduced outgassing. Cures at room temp. with the option of accelerated curing through the addition of heat. Delivers thermal conductivity of 3.5 W/m-K and mechanical property benefits of silicone. Low volatile content is controlled lot to lot. Is beneficial in applications that require optics remain free of lens fogging, such as automotive headlamps, stadium lighting and high-intensity LEDs.  Once cured, it is a soft material that provides protection from shock and vibration. Has ability to fill tiny gaps and voids and has zero shrinkage.

Henkel, www.henkelna.com

Siplace BulkFeeder X eliminates component reels. Permits tapeless supply of components in sizes 0402, 0201 and 01005 for high-speed applications. Sets up like any classic feeder on changeover table, but holds up to 1.5 million components at a time. Coordinates interplay of shutter and vibration mechanisms, vision system, and placement heads. Eliminates splicing. Uses a vibrating mechanism to pour loose components from a container onto a pickup plate made of glass. Built-in camera takes a picture of the components from underneath the glass plate. The placement machine analyzes the image and determines which components are located on the plate in a position that is suitable for pickup and which are not, for example because they are upside down or too close to each other.

ASM Assembly Systems, www.siplace.com