Jumbo Elephant surface cleaner removes electrically charged particles on electronic assemblies. Combines ionization, compressed air cleaning, extraction and filtration technologies. Ionization neutralizes surface charges. Integrated compressed air nozzle removes fine particles from wells or indentations. Particles are exhausted and filtered. Particle-free purified air can be fed back to the working area. Portable. Max. noise level is 49 dB.

Ult, www.ult.de

Vario AOI line has a new camera module. Compact housing includes one orthogonal and four angled-view cameras with 360° inspection, along with multispectral lighting. All cameras have large and congruent field of view and short image acquisition time. Telecentric optical system for orthogonal camera works in conjunction with adapted focal plane of angled-view modules for fault detection. Has axis system based on linear actuators. Optional 3D module features shadow-free measurement of components and solder joints, as well as circumference inspection, inspection for pins bent in x-y axis and measurement of pin height.

Goepel electronic, www.goepel.com

EVO Cam digital microscope has magnification up to 300x and auto focus. Is designed for precision inspection tasks, rework, and repair. Includes live video streaming, full-HD 1080p/60fps image quality, and an 8-point LED ring light. A 30:1 optical zoom provides ability to view whole samples or smallest details. Is reportedly ideal for inspecting printed circuit boards, wafers, connectors, and SMT products.

Vision Engineering, www.visioneng.us

YSi-V 5M comes with 5Mp cameras for 2D AOI. Is field upgradeable for high-speed 3D inspection and 4D capability, the latter by employing four additional off-axis cameras along with its main downward-looking camera.

Yamaha IM, yamaha-motor-im.com

i1000 19-inch, rack-mounted in-circuit test handlers have dual-lane conveyors. Can run multiple ICT tests serially and with two 1,664-node boards in parallel.

Keysight Technologies, www.keysight.com/find/ict

Spectrum II Premier with IntelliJet jetting is for dispensing small dot sizes at high frequencies for advanced packaging applications. Incorporates two-piece ReadiSet jet cartridge. Jets fluids in dot sizes from one to hundreds of nL. Closed-loop process controls integrate features for IntelliJet setup, calibration, and control. Is built on Spectrum II fluid dispensing platform. Has self-calibration features. Only wetted fluid path parts are changed on ReadiSet jet cartridge.

Nordson Asymtek, www.Nordsonasymtek.com

planarCT module is for phoenix microme|x and nanome|x x-ray inspection systems to inspect solder joints and packages in printed circuit board assemblies. Non-destructive planar CT scan technology is for slice-based and volume inspection. Can adjust scan parameters, place the board on the inspection table, close the door and start the CT scan. High-precision manipulation table rotates region of interest in the x-ray beam; DXR detector captures 2D x-ray image series for slice reconstruction. Reconstructed slice or multislice view allows inspection results of a single plane or a whole package without overlaying structures from other board areas.

GE Measurement & Control, www.ge-mcs.com

Alpha mult-level Precision Milled Stencils are designed to enable control of paste deposits when assembling printed circuit boards containing a variety of thicknesses. Reportedly provide flexibility in the transition from one thickness to another. Reduced pressure can be used when printing stepped stencils; have increased flexibility in design of the “keep-out” area. Enable use of closed-head printing systems.

Alpha, www.alpha.alent.com

MY600JD solder paste jet printer now has high-speed and high-precision capabilities. Suitable for semiconductor and SMT applications such as semiconductor chip encapsulation, cavity fill and conductive adhesive dispensing. Is said to achieve micrometer precision while delivering throughputs 2 to 10 times higher than those of traditional dispensers, depending on the application. 

Mycronic, www.mycronic.com

STS-202 determines solderability of component leads and terminations prior to being joined in a soldering operation. Uses dip and look test method in conformance with IPC, ANSI and MIL standards, including J-STD-002, MIL-STD-883 Method 2003 and MIL-STD-202 Method 208. Uses comparative analysis technique.  Can be used in receiving inspection or on a production floor, as well as in a testing laboratory. Is designed to automate physical testing process; uses high-precision motion control, touch screen programming, and PID temperature controls. Can also be used for manual component lead tinning for low-volume applications.

Ace Production Technologies, www.ace-protech.com

Tergo high performance flux remover is designed for cleaning printed circuit boards in automated vapor degreasing systems. Is a nonflammable, low-temperature cleaning fluid that features a nonvolatile additive engineered to clean challenging solder pastes and flux residues. Removes white residues. Effective on water-soluble fluxes. Has secondary applications as a degreaser and can remove slight oxidation and tarnish from finished surfaces. Is compatible with vapor degreasing procedures. No hardware modifications normally are required. Is compliant with current and proposed European environmental, health and safety regulations.

MicroCare, www.microcare.com

EVO Cam digital microscope offers magnification options up to 300x and full auto focus. Designed for quality control, testing, inspection and documentation. Features live video streaming and full-HD 1080p/60fps image quality. Image capture direct to USB memory stick (without a PC). Integral 8-point LED ring light is for optimum shadow-free illumination. A 30:1 optical zoom views whole samples or small details at the touch of a button. Range of stand options and objective lens options.

Vision Engineering, visioneng.us