K2 thermal profiler has plug-and-play hardware and a graphical user interface said to make profiling both quick and easy. Enables each thermocouple to use its own unique process window, while optimization software automatically suggests best oven setup to process the entire PCB and components in spec. Reportedly permits oven setup in a few seconds. Profile data measured can be viewed on a PC and authorized Android and Apple mobile devices. Mobile Profile Viewer App is WiFi and Bluetooth compatible. Features fail-safe software that reduces the opportunity for error, allowing pre-set quality parameters.

KIC, www.kicthermal.com

Fine-L-Kote high viscosity AR acrylic conformal coating reportedly widens the process window and flexibility. Can use as-is for dipping or thin down for spray systems. Is for selective spray systems both atomized and airless. Designed with high solids content. For high-speed coating of automotive electronics, consumer electronics, etc.

Techspray, www.techspray.com

NC273LT solder paste for Bi-containing alloys is designed for low-temperature applications. Activator system said to improve wetting performance of bismuth alloys to RoHS-compliant plating and surface finishes. Reportedly offers excellent transfer efficiencies, long stencil life and minimizes solder balling.

AIM, aimsolder.com

NC520 no-clean, halogen-free solder paste is for high-density electronics assemblies. Is said to offer excellent wetting, improved printing and reduce voiding. Results in bright, smooth and shiny solder joints. Consistent transfer efficiencies reduce head-in-pillow defects even when component/substrate coplanarity is not optimal.

AIM, aimsolder.com

CI-1062 conductive silver ink, for circuitry fabrication on wearable substrates, is said to cure in three minutes at 120°C. Provides print performance, and is compatible with many TPU and similar wearable films.

Engineered Material Systems, www.conductives.com

Parallel Link Robot is an easy-to-program, automated six-axis robot for various manufacturing applications including insertion, wiring, assembling, adhesive application, soldering, and labeling. Simple, direct teaching process uses hand-guided intuitive operation to replicate precise human motion. Doesn’t require typical engineering skills and computer work to program. Once programmed, can run 24 hours a day.

Panasonic Factory Solutions Company of America, www.panasonicfa.com

The Handbook of Electronic Assembly and A Guide to SMTA Certification, authored by Ronald Lasky, Ph.D., James Hall, Katherine Hickey and Jennifer Tate, Ph.D. is a reference manual for process engineers in electronics and those new to the industry. Provides in-depth view of the entire electronic assembly process. Chapter topics include soldering and materials, printed wiring boards, components, paste-print stencil, component placement, assembly line design and optimization, solder reflow, wave soldering, dispensing, and inspection and test. Originally conceived as a supplement to the SMTA Certification Program. 81 pages.

SMTA, www.smta.org

ACP 120 series anti-oxidation solderable coatings replace nanofilm gold. Are for anti-corrosion and anti-rusting on solderable surfaces on which solder paste, solder preform or a solder ball can be soldered.

Yincae Advanced Materials, www.yincae.com

LEN66AL optoelectric die attachment adhesive is UV curable and said to be fast bonding. Reportedly provides bubble-free optical coverage and moisture resistance. Bonding flexibility dissipates thermal stress from different CTE substrates. Meets MIL-I46058C and IPC-CC-830 and RoHS compliant. Is specifically for chip attachment.

Yincae Advanced Materials, www.yincae.com

SMT256 Solder Joint Encapsulant replaces traditional underfill on printed circuit boards. Is said to create a bond stronger than using existing soldering/underfilling methods. Is for board- and package-level high-speed and high-durability applications.

Yincae Advanced Materials, www.yincae.com

LCR Control Module is a closed-loop system that reportedly eliminates the risk of placing wrong passive components on printed circuit boards.  In combination with the Offline Job Setup or Line Setup Control module, the software is integrated with an electrical LCR meter. Verifies the measured values – inductance, capacitance, and resistance – are within the tolerances specified for the component part number. Verification can be done at any time prior to mounting the reel on the placement machine.

Cogiscan Inc., www.cogiscan.com

Cool-Pad CPR7154 thermal interface material dispenses like a thermal pad, but is said to show characteristics of a grease or gel when device temperatures increase to above 45°C. Is optimized to accommodate large areas with different heights and gaps of less than 3 mils along its interfacing area. Is filled with a modified oxide mixture and is electrically insulating at normal voltage. It is designed to have high compressibility. "Melt flows" at 45°C to fill trapped air along interface between device and heat-sink or heat-spreader. Is semi-tacky on both sides for thermal transfer performance. Thermal conductivity and Tg characteristics are said to impose minimum thermal stress on bonded parts during thermal cycling or shock testing. Is not designed for bonding.  Will fill in uneven height differentials and warps between the mating surfaces. For outdoor LED luminaire applications, CPU and GPU in Xbox360, Play Station, and other game consoles, and CPU modules and graphic card interfaces in laptops and desktops.

AI Technology, www.aitechnology.com