Fine-L-Kote High Viscosity AR acrylic conformal coating is said to have a high viscosity for use as-is for dipping, or to thin for spray systems. Protects against moisture, thermal cycling, dust, debris, and other environmental contamination. Certified to IPC-CC-830B, MIL-I-46058C, and UL94 V-0, qualifying the final cured coat as nonflammable.

Techspray, a division of Illinois Tool Works, www.techspray.com

XM8000 wafer x-ray metrology platform reveals optically hidden and visible features of TSVs, 2.5D and 3D IC packages, MEMS and wafer bumps. Provides nondestructive, inline wafer measurement of voiding and fill levels, overlay and critical dimensions.

Nordson DAGE, www.nordsondage.com

Spherolyte RDL / Pillar 2 process for high-speed plating of copper pillars and redistribution layers (RDLs) is a sulfuric acid-based three additive copper electrolyte system. Nonuniformity value – within wafer, die or/and profile – of the deposited copper structures, even over a range of applied current densities, is up to 17.5 ASD  (3.9 µm/min). Process control is analyzable through an online system for all additives. Is for flip-chip applications for various sizes of copper pillars (including µ-Pillars), especially for handhelds such as tablets or smartphones.

Atotech, atotech.com

Kapton SMT plastic film stencils reportedly permit clean and precise hole patterns. Come in 4, 5 and 6 mil thicknesses. Present flat coplanar printing surfaces for solder paste printing. Are designed for prototype assembly, and the pitch of the components is one or above. Absorb heat of laser-cutting process without producing ridges.

BEST Inc., www.solder.net

RX-6 high-speed compact modular mounter places components ranging from subminiature components to large ICs or odd-shaped parts. Is equipped with head units that pick components and place them on PWBs on both the rear and front sides; head units on the front and rear sides repeat picking up and placing components. IC component height and PWB size are increased; can support production such as mounting of LEDs or PoPs. Includes placement monitor analyze function.
RX-7 mounter places subminiature components on PWBs at high speed. Includes two super rotary heads equipped with 16 nozzles for picking up/placing each component on a PWB. Achieves 75,000 cph. Parallel head configuration is used for the heads. Camera inside head detects tombstoning or component absence.

Juki, www.jukiamericas.com

Coolspan thermally and electrically conductive adhesive film is thermosetting, epoxy-based, and silver-filled. Is used to bond circuit boards to heavy metal backplanes, heat sink coins and RF module housings. Can be used as an alternative to fusion bonding, sweat soldering, mechanical, or press fit metal attachment. Is supplied in sheet form on a PET; is reportedly easy to handle when converting into preforms and when peeling from the carrier. Withstands Pb-free solder processing. Offers chemical resistance and high-temperature performance.

Rogers Corp., www.rogerscorp.com

Large/heavy PCB and backplane handling equipment features 10mm wide positive track ESD belts (capped to 3mm edge contact). Capable of transporting up to 40 lb. PCB and backplane panels ranging up to 30" in width and 36" in length. Options include vertical buffering, turns, accumulation and more.

Promation, www.Pro-mation-Inc.com

DF2400 C-SAM acoustic microscope reportedly has 2x to 7x faster throughput than previous systems. Is automated and convertible to perform laboratory analysis. Can inspect ICs and flip chips in JEDEC-style trays or in metal carriers; inspects lead frame strips, IGBT power modules and other components. Throughput is reportedly doubled by incorporating two transducers and two simultaneous scanning stages. Two inertially balanced linear motor scanners reduce vibration and achieve scanning of ±0.5µm. Perform reflection-mode and Thru-Scan mode imaging. Uses non-immersion technology to minimize water exposure; can continuously control quality of water. Software makes acoustic images of up to 100 selected depths within a sample during a single scan. SECS-II/GEM E30 and SMEMA compatible.

Sonoscan, www.sonoscan.com

PCBGRIP electronics assembly system holds printed circuit boards in place to aid in the speed of assembly. Flexible, modular design is said to simplify a variety of electronics assembly tasks, including holding through-hole components (even upside down) in place during soldering; holding SMT stencils during paste application, and holding components in place. Permits PCB to be rotated, tilted, swung around, or raised/lowered.

PCBGrip, www.pcbgrip.org

J-STD-001 inspection kit helps MITs and Certified IPC Trainers administer physical inspection requirements of Module 5 of the IPC-J-STD-001 training program. The kit includes a DVD; instructional video; board layout form; student terminal inspection worksheets; student printed circuit assembly inspection worksheet; instructor answer keys; encapsulated inspection samples; six printed PCA samples, and eight soldered terminal samples.

STI Electronics, www.stielectronicsinc.com

535-10M-45 UV cured epoxy adhesive is formulated for disk drive, camera module, optoelectronic and circuit assembly applications. Contains a secondary thermal cure initiator that cures as low as 90°C for shadowed areas. Is an ultra-low stress, low shrinkage, ionically clean, low glass transition temperature UV cure adhesive. Is designed to eliminate warpage of components in disk drive assemblies, lens bonding in camera modules, chip encapsulation in smart cards, general bonding applications in photonics assembly. Cures rapidly when exposed to high-intensity UV light. Low outgassing. Contain no antimony.

Engineered Material Systems, www.emsadhesives.com

EthermView liquid crystal thermographic analysis system provides optical temperature measurements of active PCBs and components. Uses the color response of thermochromic liquid crystals (TLC) for convenient, non-invasive thermal management studies. Includes solid-state color camera, for macroscopic inspection of boards and components treated with heat-sensitive TLC materials, featuring a flicker-free white light source for clear viewing of dark surfaces and partially concealed elements. Thermal analysis performed by thermSOFT software. Is not affected by ambient temperatures and reportedly is capable of temperature measurements within +/-0.1°C accuracy. ]

Advanced Thermal Solutions, www.qats.com