Aquanox A8830 is an ultra-low VOC, environmentally progressive  formulation that reportedly does not damage stencils; is effective at removing solder pastes (water soluble, rosin, and no-clean) from fine-pitch apertures. Is a low odor cleaner than can be used in open systems. Is reportedly ideal for areas where air emissions are regulated. Available in one, five and 55 gal. containers.

Kyzen, www.kyzen.com

0.031" and 0.039" fine pitch wire to board range headers offer small printed circuit board footprints and low-profile mounted heights. Are shrouded and polarized; come in vertical or horizontal orientation. Mating height is 0.155" (in 0.031" pitch). Right angle headers offer a 0.069" mated height, with a footprint depth of 0.154" (in 0.031" pitch). Rated currents are 1.0A for 0.031" pitch and 0.5A for 0.039" pitch, with a temperature range of -13° to 185°F. Come in a selection of colors for polarization purposes.

GradConn, http://www.gradconn.com/Wire-To-Board/

UVCL UV cure coating is a VOC-free, 100% solids coating said to cure in seconds with conveyorized UV lamps, or within 2 hr. at 80C° due to a "multi-cure" mechanism that facilitates cure in shadowed areas. Reportedly has a 12-month shelf life. Is a single-component, low-viscosity coating formulated for "sharp-edge" coverage with common selective coating methods. Shadowed areas will cure in under 3 days at ambient temperatures and humidity, or can be accelerated by a 30-min. bake at 80°C. Meets IPC-CC-830 requirements and is UL94 V-0 rated. UL746E pending. Is said to be resistant to common thermal shock cycling, solvent and fluid exposure, moisture vapor, salt spray and condensing environments.

Electrolube, a division of H.K. Wentworth Ltd., www.electrolube.com

USTFA acrylic conformal coating is VOC-free, low viscosity and said to facilitate and optimize selective coating. Improves adhesion on difficult substrates. UL94 V-0 flammability rated. Is fast drying and meets IPC-CC-830 requirements (UL746E pending). Also comes in bulk for manual application.

Electrolube, a division of H.K. Wentworth Ltd., www.electrolube.com

Factory Intelligence Monitoring Module allows users to leverage data available in the TTC platform to calculate and monitor key process indicators over time. Provides an understanding of how machines and assembly lines are running as well as information regarding causes for non-production and material losses.

Cogiscan, www.cogiscan.com

MicroLine 2000 SI laser depaneling system is for rigid and flexible printed circuit boards. Reportedly benefits from a low-stress UV laser beam. Is for removing bare or populated circuits from panels. Reportedly can process any board material, from FR4 to fired ceramics to flexible and rigid-flex substrates.

LPKF, www.lpkfusa.com

Leica DCM8 combined confocal and interferometric optical profiler is for nondestructive 3D surface profiling. Provides high-def confocal microscopy for high lateral resolution and interferometry to reach sub-nm vertical resolution. Provides lateral resolution up to 140nm and vertical resolution of up to 0.1nm. Employs confocal scanning technology without moving parts in the sensor head. Includes four LED light sources: blue (460nm), green (530nm), red (630nm), and white (centered 550nm); has an integrated CCD camera with XY topography-stitching mode.

Leica Microsystems, www.leica-microsystems.com/dcm8

BOMcheck conflict minerals web database provides an integrated tool for uploading EICC GeSI Conflict Minerals Reporting Templates with materials declarations for RoHS, REACH and other regulated substances. Validates data in EICC GeSI Conflict Minerals Reporting Template and provides immediate detailed feedback to correct data validation errors. Can be used to validate compliant smelters.

Environ, www.environcorp.com

CN-1735 underfill is designed to enhance thermal cycle performance of IC packages with pitches as fine as 0.3mm. Reportedly enhances ruggedness for drop and bend test performance. Has a CTE of 40 ppm/°C. Reportedly can be reworked using elevated temperature (170°C to 180°C) to remove underfill fillet.

Zymet, www.zymet.com

Quantum Q-6800 dispensing system for SMT, PCB packaging, and microelectronics assembly has a dispense area of 423 x 458mm. Novel software is said to optimize dispense-head motion to save time and increase units per hour (UPH) for jetted line applications. Optional dual-action or dual-simultaneous valve configurations maximize high-throughput applications and can reduce dispensing time by up to 50%. Dispenses fluid in dots, lines and patterns. Laser height sensor offers real-time, fast, noncontact dispense height measurement. Vision system incorporates high-brightness, three-color RGB LEDs for image contrast and detection. Automatically compensates for changes in fluid viscosity, ensuring volumetric repeatability and optimized line speed for closed-loop fluid dispensing reliability. Flow calibration feature uses weight-controlled dispensing and automatic calibration to continuously deliver consistent fluid amounts, especially for valve and pump dispensing. Supports most Nordson Asymtek jets, pumps and valves.

Nordson Asymtek, www.NordsonAsymtek.com

StatRez static control floors protect areas requiring static dissipative or conductive flooring. Prevent electrostatic damage to products and equipment, limit the ability of personnel to build up a charge and quickly remove a charge from a person or equipment. Said to be more durable than ESD tile and not dependent on relative humidity. Available flooring includes StatRez PC 350/350C two-coat 100% solids epoxy system, StatRez PC 225/225C three-coat, UV-stable polyurethane system,  and StatRez PC 925/925C two-coat epoxy novaloc system designed for extreme chemical resistance or complete protection from acids.

Arizona Polymer Flooring, www.apfepoxy.com

CA-180 conductive adhesive is for die-attach applications in smart cards, circuit assembly, photonics or camera modules. Is said to cure in 30 min. at 80°C or in seconds at 200°C. Glass transition temperature (Tg) and modulus are said to be moderate. Rheology optimized for needle dispensing by time-pressure, auger or positive displacement. Develops conductivity with short, low-temperature cures. After curing for 30 minutes at 80°C, its electrical conductivity is 0.00006 ohm-cm.

Engineered Materials Systems, www.emsadhesives.com.