Xi3400 automated x-ray inspection system inspects solder joints and other hidden features found in electronic assemblies, printed circuit boards, and packaged semiconductors. Includes inline or offline operation. Monitors process information in real-time. Uses digital tomosynthesis technology to acquire multiple images in different slice heights in one inspection cycle. Images can discriminate between components on the top and bottom slices of double-sided boards for automated inspection.

Nordson Dage, www.nordsondage.com

Publish 3D for Quality Control software application contain clear illustrations of products, components and subassemblies combined with technical specifications, notes and care points that can be configured to auto-populate from databases and PLM systems.  Allows publishing of media rich documents with embedded 3D CAD models that. Tablet or PC friendly. Aids QC initiative development and communication. Can be tailored to suit specific requirements. Can hold QC instructions, engineering data, 3D CAD models, cost of quality information, SPC data, technical specifications, briefing notes and any information held in a folder or in a database. Interactive 3D data can be published directly from native CAD data held on PLM systems without CAD operator assistance. 

Theorem Solutions, www.theorem.com/dm/3dpdf-quality-stq.htm

i-Con Nano 80W industrial soldering station has a footprint of 145 x 80mm (5.7 x 3.1). Is ESD-safe. Uses 30g i-Tool soldering iron with 40 different tips i-Tip series 102 available. Reported 9 sec. heat-up time . Features sensor detection and temperature control of soldering tip, independent exchange of heating elements, and longlife tips. Standby and sleep functions. LCD display. Safe and simple configuration of three fixed temperatures, standby and other parameters also can be performed using a microSD card and PC software. 

Kurtz Ersa North America, www.ersa.com

Ecosonic conformal coating is powered by Nano-VpCI. Combines moisture intrusion prevention and corrosion resistance with vapor phase corrosion inhibitor technology. Contains optical identifier visible with UV light. Reportedly extends performance of new and repaired electronic assemblies, especially those under adverse corrosion conditions such as high heat, chemicals, salt spray, moisture and atmospheric humidity.

Cortec, www.cortecvci.com

W-Series Matrix connector reportedly eliminates the need to solder the LGA to the printed circuit board. Is silicone-based and embedded with 300 to 2,000 gold-plated wires per cm². Provides current carrying capacity of 500 mA/mm². Is available in sizes up to 50mm x 50mm and thicknesses of 0.50mm or 1.0mm.

Fujipoly America, http://www.fujipoly.com

RMA-155 Pb-free solder paste was designed for balanced performance; is reportedly ideal for high-complexity boards with a variety of component sizes. Compatible with SnPb and SAC alloys. Is said to deliver consistent transfer efficiencies, excellent response-to-pause, and a strong oxidation barrier. Is halogen-free, resists graping on small components and tiny deposits, prevents head-in-pillow defects, and minimizes voiding for BGAs and large thermal planes (QFNs). Conforms to RMA classification for QQ-S-571F.

Indium Corp., www.indium.com

CX150i conformal coating inspection system uses a UV strobed inspection module. Is designed with an 80mp sensor; offers white light illumination for component presence/absence inspection and UV illumination for conformal coating inspection. Is powered by AI2 autonomous image interpretation technology.

CyberOptics Corp., www.cyberoptics.com

Paraquda 2 combines solder paste jetting and SMD assembly. Reportedly provides changeover without downtime, component management, and the integration of jet printing of solder paste or glue. Solder jet printer has speeds up to 80,000 dots/hr., is 51µm @3σ, and is suitable for 0201 components. Solder paste jet valve can be installed on existing machines, such as the Scorpion high-speed jet dispenser or the Paraquda component placer.  Production is fully automated. Solder paste application and component placement are integrated.

Essemtec, www.essemtec.com

Fischerscope X-ray XDLM237 combines high-intensity beam of a micro-focus tube with a small aperture and large detector window. Advantages include non-destructive measurements without damage to tools; fast measurement times; measurement spot of 50μm. Layer thickness reportedly can be measured on the finest cutting edges of high-end tools. Can determine base tools’ metallic composition. Has programmable XY-stage and Z-axis for automated measurements.

Fischer Technology, www.fischer-technology.com  

FlexTRAK-S plasma system has large capacity plasma chamber for semiconductor and electronics packaging. Integrates with a variety of process equipment.  Has 5.5l plasma chamber and high-power RF generator. Is configurable and has high-throughput. Universal architecture remains the same if elongated. Accommodates substrates and material handling configurations to support a variable-size form factors, including boats, carriers, Jedec/Auer boats, strips, and laminates. Can be configured for magazine-to-magazine processing of single and multiple strips or lead frames, reel-to-reel, and as a standalone for island-based production environments. Width is 382mm. Service components are accessed from the front. Can be configured to apply three different modes of plasma treatment: direct, downstream, and ion-free. Smart Tune management system provides closed-loop plasma control; optimizes RF system and minimizes tuning time. Automatically recycles to a plasma-ready state.

Nordson March,  www.nordsonmarch.com

Sigma X 3D inline solder paste inspection machine features dual-laser technology to eliminate shadowing; application bandwidth that is compatible with all PCB colors and finishes, including HASL; measurement height range of  +/- 1mm (0.040”) standard and optional  +/- 2mm (0.080″); and identification features including via holes, edge of board and routing to reduce false calls. Industry’s best PCB warp-management system with real-time Z axis that tracks to the PCB surface. Novel jet defect repair  adds paste to pads with insufficient deposits, eliminating rework and board scrap. Accommodates PCBs up to 580 x 510mm (23″ x 20″). Height repeatability: 3 Sigma <1µm. Volume repeatability: 3 Sigma <1%. Height accuracy: 2µm. Paste size 100 x 100 µm minumum; 20 x 20mm maximum.

Parmi, http://parmi.com/spi-application-products-overview/sigma-x/http://parmi.com/spi-application-products-overview/sigma-x/

OM/C thermal stress system cycles to temperatures as cold as ?75C, in line with requirements for aerospace, defense and automotive applications. 
Achieves negative cycling temperatures through use of liquid nitrogen (LN2) as the coolant. Single setup assembly reflow simulation and thermal cycling with one setup. Convection assembly reflow simulation based on IPC-TM-650, Method 2.6.27 (230C and 260C profiles). Built on existing air-to-air thermal shock methodology (reference IPC-TM-650, Method 2.6.7.2B). Single chamber air-to-air thermal shock cycling from -75C to +230C. Continuous resistance temperature detector (RTD) monitoring, feedback and control. Simultaneously tests 12 HATS, 24 IPC-2221B D-type, 12 IST, or multiple custom designed coupon configurations. Automatic data analysis and report generation.

Conductor Analysis Technologies, www.cat-test.info