LEN66AL optoelectric die attachment adhesive is UV curable and said to be fast bonding. Reportedly provides bubble-free optical coverage and moisture resistance. Bonding flexibility dissipates thermal stress from different CTE substrates. Meets MIL-I46058C and IPC-CC-830 and RoHS compliant. Is specifically for chip attachment.

Yincae Advanced Materials, www.yincae.com

SMT256 Solder Joint Encapsulant replaces traditional underfill on printed circuit boards. Is said to create a bond stronger than using existing soldering/underfilling methods. Is for board- and package-level high-speed and high-durability applications.

Yincae Advanced Materials, www.yincae.com

LCR Control Module is a closed-loop system that reportedly eliminates the risk of placing wrong passive components on printed circuit boards.  In combination with the Offline Job Setup or Line Setup Control module, the software is integrated with an electrical LCR meter. Verifies the measured values – inductance, capacitance, and resistance – are within the tolerances specified for the component part number. Verification can be done at any time prior to mounting the reel on the placement machine.

Cogiscan Inc., www.cogiscan.com

Cool-Pad CPR7154 thermal interface material dispenses like a thermal pad, but is said to show characteristics of a grease or gel when device temperatures increase to above 45°C. Is optimized to accommodate large areas with different heights and gaps of less than 3 mils along its interfacing area. Is filled with a modified oxide mixture and is electrically insulating at normal voltage. It is designed to have high compressibility. "Melt flows" at 45°C to fill trapped air along interface between device and heat-sink or heat-spreader. Is semi-tacky on both sides for thermal transfer performance. Thermal conductivity and Tg characteristics are said to impose minimum thermal stress on bonded parts during thermal cycling or shock testing. Is not designed for bonding.  Will fill in uneven height differentials and warps between the mating surfaces. For outdoor LED luminaire applications, CPU and GPU in Xbox360, Play Station, and other game consoles, and CPU modules and graphic card interfaces in laptops and desktops.

AI Technology, www.aitechnology.com

TSR2000 Series benchtop dispensing robots is said to be easy to program, simple to operate, and compatible with all valve types and controllers. Are for dispensing dots of solder paste, form-in-place gasket, filling, potting, encapsulation, bonding, coating and other applications. Reportedly provide total control over fluid placement from beads, arcs and circles to repeated timed dots. Programming is via teach pendant. Come in three platforms:

• TSR2201: 200mm x 200mm working area
• TSR2301: 300mm x 300mm working area
• TSR2401: 400mm x 400mm working area

Techcon Systems, www.techconsystems.com

Gemini back-to-back printing system delivers modular processing on-demand. Based on Horizon iX series, including graphical user interface. Reportedly produces as many as 300 boards per hour. Print area 508 x 508mm in a smaller footprint.

DEK, www.dek.com

Cubus storage tower has user-adjustable shelves that can be varied in 5mm steps and are auto-configured. Reels range from 8mm to 72mm. Shelves occupy either two 7" reels or one 13" or 15" reel. Can store 5 to 6 reels per min. Comes in two sizes and houses 600 or 900 reels each. Automatically detects diameter and width of each reel.

Essemtec , www.essemtec-usa.com/

FactoryLogix mobile material logistics module inStock is a simple and intuitive handheld scanning tool that improves operational efficiency and accuracy in stockrooms that typically rely on fixed computer terminals or paper-based material management. Features a pocket-sized Motorola MC40 mobile computer with a modern, touchscreen interface to scan inventory into valid/approved stock locations, providing users with instant access to each part instance, quantity and location. Guides users through the kitting process with digital pick lists grouped by their destination on the factory floor, and sorted for efficient picking in the stock area. Once assigned to a kit, this material is removed from stock and its location is tracked through the entire manufacturing process, and available for immediate lookup.

Aegis Industrial Software, www.aiscorp.com

TR7600LL SII 3D AXI handles board edge-to-edge inspection up to 1000mm x 660mm. Features automated programming, multi resolution programs and advanced processing for image quality, automatic 2D + 3D slice image extraction using digital tomosynthesis (DT) and an x-ray tube with adjustable output up to 130 kV/300 µA

Is said to be capable of shadow-free inspection of multilayer boards with PoPs, µBGAs, QFNs and press-fit connectors.

Test Research Inc., www.tri.com.tw

TSR benchtop robot series handles a range of fluid dispensing applications, from inline to batch. Comes in three models (TSR2201, TSR2301 and TSR2401) to accommodate a range of working envelopes. Easy-to-program, and features dedicated fluid dispensing software, eliminating the need for complex robot language programming. Fully integrated positioning and fluid dispensing functions. Compatible with all Techcon Systems syringes, valves and jet dispensers.

Techcon Systems, www.techconsystems.com

PCBVac shop vac for printed circuit board repair cleaning cleans liquids and solids from a PCB. Is adjustable and includes a handheld tool. Teflon heat-resistant nozzles clean molten solder; nozzles can be trimmed to size for different vacuum pressures. Can clean solidified solder fines, scraped off solder mask or coatings, unreacted flux, flux cleaners, solvents and other liquids. Has a controller with ON/OFF and vacuum adjustment, a disconnect plug, flex input tubing and filtration, a handheld vacuum applicator inclusive of six ft. of flex hose and five tips. Hand piece includes trap system.

BEST Inc., www.solder.net

Loctite Eccobond EN 3810T and Loctite Eccobond EN 3838T are encapsulant formulations that can be selectively applied to environmentally-susceptible components. Deliver a barrier that is reportedly impervious to moisture and fluids. Are ideal for handheld and automotive applications.  Cure quickly at moderate temperature; are well-suited for high-volume manufacturing operations.  3810T is a non-flexible material and 3838T is a flexible, low Tg encapsulant.

Henkel, www.henkel.com/electronics