535-10M-49 UV cured epoxy adhesive was formulated for disk drive, camera module, optoelectronic and circuit assembly applications. Contains a secondary thermal cure initiator that cures as low as 110°C for shadowed areas. Is ultra-low stress, low shrinkage, and ionically clean, with low glass transition temperature. Designed to eliminate warpage of components in disk drive assemblies, lens bonding in camera modules, chip encapsulation in smart cards and general bonding applications in photonics assembly.  Cures rapidly when exposed to high-intensity UV light.

Engineered Material Systems, www.emsadhesives.com

Vision Inspection Cell is a test solution for vision inspection of display and camera functionalities of wireless devices. Is fully integrated and based on parallel testing option and adjustable camera quantity. Can be configured to various device sizes by changing cameras and lenses. Can be used to configure benchmark and deploy a system that addresses vision applications from pattern matching to code reading and presence detection.

JOT Automation, www.jotautomation.com

Trident ZDO fully automatic cleaner/defluxer is completely zero discharge, and automatically washes, rinses, verifies cleanliness, and fully dries assemblies within a single compact machine. Requires no separate water recycling systems as both the wash-solution recycling system and the rinse-water recycler are built into the machine. Contains effective shadow mitigation technology for cleaning fine-pitch, low-profile components. Built-in cleanliness verification capability ensures assemblies are cleaned to pre-selected cleanliness levels. Wireless barcode scanner permits all assemblies being cleaned to have their serial numbers scanned and entered into the machine's SQL database. All process data, including set and actual cleanliness results are stored and are searchable in a multi-query format for the most powerful SPC available on any cleaning system.

Aqueous Technologies, www.aqueoustech.com

FX-940 inline AOI features 9-MP color camera imaging. Includes top-down viewing camera, four side-viewing cameras and 3D inspection. Inspects solder joints and component assembly for solder defects, lead defects/lifted leads, component presence and position, correct part/polarity, through-hole parts, and coplanarity of chips, BGAs and other height-sensitive devices. Configurable for all line positions. Can be used for paste, pre / post-reflow and final assembly inspection. Intuitive offline programming. Real-time SPC monitoring. Uses a standard package library to simplify training and ensure program portability across manufacturing lines.

Nordson YesTech, www.nordsonyestech.com

Tilt 12KN in-circuit tester with integrated Tilt fixturing from Everett-Charles. employs a "tilt-pin" design and software originally developed for bare printed circuit board test fixtures, and can access 0.38mm (0.015") targets on centers of 0.6mm (0.024") on printed circuit board assemblies. Eliminates wired ICT fixtures. Are rugged and maintainable, easy to store, and reusable. Provides built-in dual-level capabilities for combining in-circuit and functional test, together with easy fixture changeover and comprehensive operator safety features. Comes with 2500 or 5000 in-circuit test pins in a probe field of 58.4 x 43.4cm.

CheckSum, www.checksum.com

SCS Precisioncoat now comes with a noncontact, high-speed jet valve for dispensing fluids quickly and accurately. Enables delivery of materials with viscosities up to 400,000 cps at speeds up to 300 drops/sec. Dispenses materials between and under components, as it requires only 300µm clearance.

Special Coating Services, http://www.scscoatings.com

GT-24040 4mm Emboss Tape Feeder processes 4mm wide embossed tape used for 0402mm (01005) and 0603mm (0201) parts. The 4 x 1mm dual tape feeder is designed for 4mm wide tape and reel feeding to Sigma Series modular mounters. Generates less dust from packaging materials, the pocket, and less dust under the tape cut.

Hitachi High Tech Instruments, www.hitachi-hta.com

Bath Analyzer 30 provides measurements for cleaning agents, such as Hydron WS 400, used at low concentrations.

Zestron, www.zestron.com

Hydron WS 400 is a Fast Technology-based cleaning agent designed to remove water-soluble flux residues at low concentration in spray-in-air inline and batch cleaning applications. Has been formulated to penetrate the capillary spaces underneath low standoff components, applied at low concentrations of 3% to 5%.

Zestron, www.zestron.com

SMT PC Board Jumpers are said to quickly and easily setup and provide low-profile circuit linkage and minimal footprint for high-density, high current PCB packages on power and aluminum backplanes.  All PCB soldering applications, including reflow, may be utilized. Manufactured from copper with silver plating, and come in three different SMT jumper styles: compact, micro-miniature and miniature.

All tape-and-reel parts are packaged per ANSI/EIA-481 standard for compatibility with most vacuum and mechanical pick and place assembly systems.

Keystone Electronics, www.keyelco.com

Xpedition PCB layout platform, the first announced phase of the new Xpedition flow, addresses placement planning for performance and reuse; efficient routing of complex, dense topologies; and electromechanical optimization. Features Sketch Router, an auto-assisted routing process said to deliver hand-routed-quality in dramatically less time.

XSDC desiccant storage cabinets feature <1% RH and below ambient temperature control. Provide closed loop desiccant regeneration. Have insulated enclosures that maintain set point temp. to within 2°C.

Super Dry, www.totech.eu..com