StencilWasher-ZDO zero discharge ultrasonic stencil cleaning system is designed to remove all solder paste types, including no-clean, rosin, and water-soluble, as well as all uncured SMT adhesives. Is equipped with a filtered and recirculated wash system and a fully closed-loop rinse system. All rinse water is captured, filtered, re-deionized, and reused. There is no connection to drain.

Aqueous Technologies, www.aqueoustech.com

Zero-Ion is designed to test electronics assemblies for ionic contamination. Automatically removes and detects contamination on an electrical assembly or bare board; provides quantitative contamination measurements. Provides automatic regeneration of test solution. Meets requirements of military and commercial cleanliness testing standards, including MIL 2000A, IPC test method 001, MIL-C-28809, MIL-P-55110 and IPC TM650-2.3.26.

Aqueous Technologies, www.aqueoustech.com

Trident Duo is a high-yield automatic defluxing and cleanliness testing system. Reportedly operates on a fraction of the power, water, and chemicals of a traditional inline cleaning system. Is equipped with two autonomous defluxing chambers. Each chamber is controlled by a dedicated computer controller; may be operated with different defluxing chemistries. Each defluxing chamber is equipped with independent cleanliness testing capabilities and recallable SPC data records.

Aqueous Technologies, www.aqueoustech.com

Camalot NanoShot pump is jetting technology that offers speeds up to 600Hz. Has ultra-fine resolution with dot sizes <300µm. Features motion control technology, simple maintenance and quick changeover.

Speedline Technologies, www.speedlinetech.com

LineMaster dual-mode inspection incorporates SPI and AOI. Validates variables associated with component placement and solder paste printing. Detects absence/presence, polarity, OCV, misalignment, RDI and solder joint inspection for AOI and repeatable 3D volumetric measurements for SPI. Features include real-time SPC, customized data reports, offline CAD/Gerber programming and defect repair station. Software includes onboard real-time SPC, customized data reports, and GerberPro conversion programming software.

ASC International, www.ascinternational.com

McDry DXU-401DP pass through dry cabinet features double-sided doors for access on either side of SMT line. Conforms to IPC/JEDEC J-STD 033C and IPC 1601 standards. ESD safe design adheres to IEC-61340-5-1 (ESD) standard. Dehumidifies ICs to prevent micro-cracking. An alternative to baking, moisture barrier bags and nitrogen storage.

Seika Machinery, www.seikausa.com

SAM-CT23W twin table router features a two-way flexible setting twin-table design; accommodates two boards up to 9.8" x 13". Can be converted into one large size fixture table that accommodates one PCB up to 13" x 20".

Sayaka, www.sayaka.co.jp/english/index.html
Seika Machinery, www.seikausa.com

Hioki FA1240 flying probe tester provides jig-less inspection for quick setup and testing of mismounted components, faulty components, and poor contacts. Assesses solder joints through resistance testing, while thwarting board damage through use of soft-landing. Uses UA1780 fit-line inspection data creation system.

Hioki, www.hiokiusa.com
Seika Machinery, www.seikausa.com

Lzero3 electronic storage and retrieval cabinet delivers up to 2,083 SMT reels. Provides for humidity control systems to maintain RH less than 5%; humidity and temperature are tracked in real-time based on user-controlled set-points. Includes integrated barcode scanner registration, multiple loading and retrieval, reel/tray/ traceability, absolute FIFO prioritization retrieval, job order management and functional touch-screen software. Monitors storage location, traces real-time stock movements and provides features that reallocate reels that are already in production.

Europlacer, www.europlacer.com

SMT production centre can jet solder paste and mount components in one machine. Setup is performed directly from CAD data using an integrated paste library. Is fully automated; solder paste application and component placement are integrated. Solder jet printer performs up to 80,000 dots/hr.; 51µm @3σ; suitable for 0201 components. Range of pastes includes most type 4, 5, 6 or 7 pastes. Solder jet valve can be installed on existing machines. Cleaning of valve takes 5-10 min.

Essemtec, www.essemtec.com

Material Disclosure platform software now comes with Conflict Minerals tracking compliance module. Organizes data for SEC Dodd Frank S 1502 reporting requirements and other global Conflict Mineral rulings.   Performs regulatory assessments for REACH, RoHS, WEEE, EPA TSCA, and California Prop 65 and more. Centrally warehouses and manages conflict mineral data across enterprise, along with data for REACH, RoHS, WEEE, etc. Protects bill of material (BoM) supply chain data by keeping details of supplier identity, locations and substance types and quantities confidential from other suppliers. Parses and centralizes critical uploaded data from suppliers. Helps ensure compliance with Dodd Frank, REACH, RoHS, WEEE, US EPA mandates, DfE, TSCA, California reporting and labeling requirements and regulatory requirements in Asia, Africa and South America.  Tracks conflict minerals (and origins) and other substances in a supply chain.

Actio, actio.com

Cybersolv C8882 is a fast-acting stencil cleaning solvent designed for the under-stencil on printer wipe cleaning process. Reportedly instantly dissolves all flux types within the solder paste, including water-soluble, rosin and low residue no-clean fluxes. Dries quickly. Available in one, five and 55 gal. containers. Is available in 16 oz. spray bottle containers and pre-saturated wipes.

Kyzen, www.kyzen.com