Echo ultrasonic generator is designed for ultrasonic spray processes. Provides high-frequency electrical energy to operate all frequencies of ultrasonic nozzles. Automatically locks onto ultrasonic nozzles’ operating frequency with phase-locked-loop technology. Offers connectivity inputs and outputs, triggering capabilities and fine-tuning spray controls, including load leveling or power leveling mode. Other features include load leveling that automatically compensates for changes in flow rate and liquid characteristics; power resolution of 0.01 watts; operation over a frequency range of 25 - 250 kHz; graphic user interface with intuitive wheel encoder, and ±4% accuracy.
Sono-Tek, www.sono-tek.com
FactView browser-based tool enables viewing of measurements such as employee daily activity, paperless dispatching of jobs, part/job work-in-process status, and machine performance showing the classic overall equipment effectiveness (OEE) measurements. Works with manufacturing execution systems (MES) to provide paperless manufacturing. Shows data in real-time via a laptop or mobile device.
Factivity, www.factivitycom
Sigma G5S modular mounter has a multi-function head that now features lead-clinching and tamping functionalities. Uses side-mounted lighting and machine vision to identify and locate through-hole component leads. During placement/insertion, clinching simultaneously takes place. Head provides tamping functionality to ensure through-hole component is properly placed, inserted, and seated; is helpful with long card edge connectors. Head picks up component with Gripper nozzle; places the connector via insertion pressure on the center of the component. Head can be programmed to tamp one end, then the other, with up to 10Kg pressure if needed.
Hitachi High Technology Instruments, www.hitachi-hta.com
Scorpion rework system now includes an automatic placement package capable of 50mm of motorized travel in the Z-axis and 360° in ϴ. Automatic placement package offers fine motor control in the Z-axis and ϴ during alignment of the component to the pad. Includes a force feedback control during the placement process, enabling the unit to pick and place components without disturbing the component or solder. Is now available in a Mobile version with a 1080p, high-def camera system that enables alignment and positioning of components before placement; is for use with smaller packages up to 25mm x 25mm. New digital controls have been implemented to control the light levels of the top and bottom LED lighting modules. Polarized filter feature is now standard. New upgrade kits include a side-view camera, contactless IR sensor, and thermal and airflow calibration kits.
Metcal, www.metcal.com
SCPH silver conductive adhesive offers electrical conductivity and adhesion to most substrates, especially indium tin oxide and color filter substrates. Is reportedly not dissolved by Tuffy conformal coatings, which are frequently applied to the electrodes of flat panel displays. Can be coated with Tuffy alternately to simplify the assembly process. Can be used with fast-action, automatic dispensing equipment and cures at ambient temperatures within 10 min. Is halogen- and antimony-free, and requires no special storage conditions. For assembly of cellphone display modules, tablets and similar products that incorporate flat screen displays.
Electrolube, www.electrolube.com
GLRS laser singulation system is configurable with a near IR laser (1032nm) for use with metal-core substrates or a green laser (532 nm) for use with ultra-thin and flexible substrates. Inert gas injection at the Laser point minimizes local oxidation concerns, Particle/Gaseous remediation is affected from beneath. Vacuum is provided via two 5HP blowers and a three-stage filtration system capable of handling particles as small as 20 microns.
Getech, www.getechsys.com
LineMaster DM inspection machine has dual mode capability; incorporates SPI and AOI. Validates overall variables associated with component placement and solder paste printing. Detects absence/presence, polarity, OCV, misalignment, RDI and solder joint inspection for AOI and accurate and repeatable 3D volumetric measurements for SPI. Features include real-time SPC, customized data reports, offline CAD/Gerber programming and a defect repair station.
ASC International, www.ascinternational.com
MC-301 benchtop reflow oven is for prototyping, manufacturability testing, and short-run batch production. Has an Android-based control app; permits surface mount assemblers and product developers to meet specifications for preheat, soak, reflow, and cooling phases. Heating and cooling rates in each stage are automatically calculated. Includes internal thermocouple to measure and record actual temperatures on the printed circuit board while soldering. Real-time feedback from the thermocouple can be used to control heater power and to establish temperature settings. Heating chamber is divided into multiple heating zones; each one is assigned to its own channel of the temperature control system. Ensures delta-T ±2 °C across 10" x 8" working area. Rapid cooldown is achieved with intake fans that draw air through the bottom of the unit and out through the 3" exhaust port. Measures 27" x 19" x 11" and weighs fewer than 100 lbs.
Manncorp, www.manncorp.com
Scope-Line MX 2.5D x-ray and analysis system features closed microfocus tubes and durable detectors and AOI/AXI/SPI repair station. Generates semiautomatic test programs. Comes with six-axis system for 70° angle view and 360° rotation of device-under-test. Includes topoVIEW visualization tool and test functions for automatic evaluation of BGAs and other solder joints.
Goepel, www.goepel.com
Scienscope, www.scienscope.com
ValveMate 9000 precision valve controller features microprocessor circuitry to ensure dispensing of precise, accurate, and repeatable amounts of adhesives, lubricants and other assembly fluids. Auto-Increment mode adjusts dispensing parameters after a certain number of shots or a specific elapsed time.Features include independent dual-valve control programming, each with 24W temperature controllers for J-type thermocouples. Each channel drives a remote high-speed solenoid valve up to 500Hz. "Spike-and-hold" function permits the controller to spike the voltage for a user-specified spike time and then throttle the voltage down to a user-specified hold voltage after spike time expires. Electronic pressure regulators provide stability in the fluid reservoir by maintaining consistent dispensing with full-to-empty pressure control. Remotely parameter setup.
Nordson EFD, www.nordson.com
BiAgX high-melting Pb-free solder paste is designed as a drop-in replacement for lead-containing solder pastes. Has passed MSL1 and thermal cycle testing. Works in environments in excess of 150°C; requires minimal process adjustments. Is Sb-free and does not contain specialty materials such as nanosilver or sintering aids. Comes in dispensing and printing forms. Fluxes are cleanable with standard cleaning chemistries and processes.
Indium, www.indium.com/BiAgX
Glide-Line offers multi-strand panel and pallet-handling conveyors. Configuration tool generates real-time part numbers and pricing. Has a modular design; conveyors and systems can be built and shipped in days. Automated configuration tools generate assembly information packages. Supports configured or customized solutions. Drive shaft is 14mm; end roller is 28mm; drive pulley is 5mm pitch; B14 flange motor is 218ft per min. Has a 24VDC direct drive option. All rolling elements are precision ball bearing supported. Uses T5 timing belts with steel tension members. Multiple mounting drive configurations are available: AC single, three phase options, and 24VDC options.
Glide-Line, www.glide-line.com