RS Metrics creates analysis reports of key performance indicators that go beyond the standard set of OEE measurements of availability, performance and quality. Provides user-friendly way to view real-time WIP tracking, better manage materials and improve production control. Is entirely customizable and enables paperless functionalities. Enhances Lean manufacturing and value steam mapping of a factory floor.

Factivity, www.factivity.com

TNV25-508EMII-P convection reflow oven features a new flux collection system, an 8 degree per sec. cooling capability, and reduced nitrogen consumption (equal to or less than 500ppm: 100NL/min; equal or less to 200ppm: 180NL/min). Is 4996 x 1368 x 1690mm. Handles boards up to 250mm (width) x 330mm (length).

Tamura Systems, www.tfz-tamura.com

Auto-Dip systems feature touch-screen controlled models with programmable preheat and dip height settings and an adjustable, finger-type printed circuit board holder that grips the edges of the board throughout the soldering cycle. Is useful for heavy component-laden assemblies; can accept customized pallets of small, irregularly-shaped PCBs. An interchangeable version of the pin-type PCB holder is included; permits simultaneous soldering of multiple PCBs, randomly placed on the fixture-less bed-of-nails loading platform. Have titanium solder pots with high-precision temperature controllers for use with Pb-free SAC or SnPb solders. Include automatic dross skimmer and collection trough and startup timer. Largest model can handle PCBs up to 600 x 350mm; has a 100kg solder pot. EZ-Flux 500A spray fluxing system included. For short-run batch applications.

Manncorp, http://www.manncorp.com/Auto-Dip.html

MicReD industrial power tester 1500A combines power cycling and thermal transient measurements with structure function analysis while providing data for real-time failure-cause diagnostics. For power cycling and thermal testing of electronics components to simulate and measure lifetime performance. Tests components without removing them from the test environment. Analyzes thermally-induced mechanical failures such as die-attach wire bond separations, die and package stack-up delamination and cracks, and solder fatigue. Is based on T3Ster advanced thermal tester platform. Performs power cycling tests of metal-oxide semiconductor field-effect transistors (MOSFETs), insulated-gate bipolar transistors (IGBTs) and power diodes. Has user-friendly touch-screen interface. Record range of information during test, such as current, voltage and die temperature sensing; and detailed structure function analysis to record changes in the package’s thermal structure.

Mentor Graphics, www.mentor.com

VHX-5000 digital microscope instantly captures any area in complete focus, without the user adjusting focus. Provides high-resolution, large depth-of-field imaging and integrated 2D/3D measurement, without specialized training. Comes with CMOS camera capable of imaging at 50 frames per second. Automatically scans throughout the focal range and generates an image in focus. Enhances contrast and reduces over/under saturated areas on a target. Software describes implementation of each function of the VHX. Magnification range 0.1x - 5000x. Supports bright and dark field, transmitted, polarized, and differential interference observation.

Keyence, www.keyence.com

MY600 jet printer has 50% higher throughput, reportedly reaching speeds of 1.1 million dots per hour. Handles flexible substrates, board cavities, package-on-package, QFNs and new components with small process windows. Controls dot volume, diameter and deposit repeatability. Adjusts solder paste volume and shape for each individual pad on the printed circuit board. Is entirely software-based, and can be programmed stand-alone or connected to certain pick-and-place machines.

Micronic Mydata AB, www.mydata.com

KISS-103ILDP dual pot inline selective soldering system concurrently solders two printed circuit boards using two solder pots, each equipped with an X-Y-Z axis positioning system. SMEMA compatible. Solders PCBs up to 18" x 24". Can be configured with novel inline fluxer and preheating unit. Permits SnPb and Pb-free solder pots to reside within the same machine. Both solder pots can be equipped with a dual-solder nozzle pump assembly that permits four different solder nozzle shapes.

ACE Production Technologies, www.ace-protech.com

RS-600 six zone air and nitrogen reflow ovens offer the same features as the larger 8- and 10-zone ovens, such as a top and bottom Independent air velocity controlling system and a four-way air recycling system in each zone. The six zone oven has a total heated length similar to ovens that are 7-, 8-, and 9-zones. KIC AFP (auto-focus power) is now a standard feature on reflow ovens.

Juki Automation Systems, www.jukiamericas.com

MPM Momentum BTB (back-to-back) printer is 200mm shorter than the standard Momentum, with an overall length of 2.8m for the two machines. Is configured for back-to-back processing; enables dual-lane processing with the combined output of two machines. Is designed with all-front access to electrical system, solvent reservoirs, etc. Wet Print accuracy is 20µm@6ó, Cpk ≥ 2.

Speedline Technologies,  www.speedlinetech.com

Unitech UC-250M-CV PCB board cleaner is built on the platform of the UC-250M and adds dual-cleaning using a combination of a brush roller with silicone/adhesive cleaning rollers; is a combination dual dust removal system. Cleans top surface of printed circuit boards, and chip components attached to bottom side. Features an antistatic bar (ionizer) to neutralize static and prevent dust from collecting on board surface. Offers forward and reverse conveyor modes and multiple auto-passes.

Unitech, http://www.ute.com/index.php?rbu=5

OvenProbe is designed to measure a conventional reflow oven’s performance. Is designed for use after machine maintenance to benchmark the machine’s thermal transfer performance. Offers three matched thermal masses at the top and bottom that measure oven uniformity across the conveyor width, allowing the top and bottom heaters’ effects to be measured. Large thermal masses quantify the heating capability of the oven. Air temperature sensors permit heater and speed measurements.

SolderStar, www.solderstar.com

YCP10 stencil printer features 3S head and stencil suction mechanism, said to reduce changeover time and enable stable and high-precision printing. Handle large PCBs (up to 510 x 460mm) and a variety of stencil frame sizes, including global inch-size stencil frame (736 x 736; 29") an M-size stencil frame. Camera alignment. Servo motors result in printer tact time of 13.5 sec. CE mark compliance. Printing accuracy is (3σ)±0.025mm.

Yamaha Motor, yamaha-motor.com