Fischerscope X-ray XDLM237 combines high-intensity beam of a micro-focus tube with a small aperture and large detector window. Advantages include non-destructive measurements without damage to tools; fast measurement times; measurement spot of 50μm. Layer thickness reportedly can be measured on the finest cutting edges of high-end tools. Can determine base tools’ metallic composition. Has programmable XY-stage and Z-axis for automated measurements.

Fischer Technology, www.fischer-technology.com  

FlexTRAK-S plasma system has large capacity plasma chamber for semiconductor and electronics packaging. Integrates with a variety of process equipment.  Has 5.5l plasma chamber and high-power RF generator. Is configurable and has high-throughput. Universal architecture remains the same if elongated. Accommodates substrates and material handling configurations to support a variable-size form factors, including boats, carriers, Jedec/Auer boats, strips, and laminates. Can be configured for magazine-to-magazine processing of single and multiple strips or lead frames, reel-to-reel, and as a standalone for island-based production environments. Width is 382mm. Service components are accessed from the front. Can be configured to apply three different modes of plasma treatment: direct, downstream, and ion-free. Smart Tune management system provides closed-loop plasma control; optimizes RF system and minimizes tuning time. Automatically recycles to a plasma-ready state.

Nordson March,  www.nordsonmarch.com

Sigma X 3D inline solder paste inspection machine features dual-laser technology to eliminate shadowing; application bandwidth that is compatible with all PCB colors and finishes, including HASL; measurement height range of  +/- 1mm (0.040”) standard and optional  +/- 2mm (0.080″); and identification features including via holes, edge of board and routing to reduce false calls. Industry’s best PCB warp-management system with real-time Z axis that tracks to the PCB surface. Novel jet defect repair  adds paste to pads with insufficient deposits, eliminating rework and board scrap. Accommodates PCBs up to 580 x 510mm (23″ x 20″). Height repeatability: 3 Sigma <1µm. Volume repeatability: 3 Sigma <1%. Height accuracy: 2µm. Paste size 100 x 100 µm minumum; 20 x 20mm maximum.

Parmi, http://parmi.com/spi-application-products-overview/sigma-x/http://parmi.com/spi-application-products-overview/sigma-x/

OM/C thermal stress system cycles to temperatures as cold as ?75C, in line with requirements for aerospace, defense and automotive applications. 
Achieves negative cycling temperatures through use of liquid nitrogen (LN2) as the coolant. Single setup assembly reflow simulation and thermal cycling with one setup. Convection assembly reflow simulation based on IPC-TM-650, Method 2.6.27 (230C and 260C profiles). Built on existing air-to-air thermal shock methodology (reference IPC-TM-650, Method 2.6.7.2B). Single chamber air-to-air thermal shock cycling from -75C to +230C. Continuous resistance temperature detector (RTD) monitoring, feedback and control. Simultaneously tests 12 HATS, 24 IPC-2221B D-type, 12 IST, or multiple custom designed coupon configurations. Automatic data analysis and report generation.

Conductor Analysis Technologies, www.cat-test.info

KISS-101IL inline selective soldering system includes an automated two-point fiducial alignment and skew correction system, high-speed Z-axis, heated nitrogen system, a witness camera and automated spray fluxer.  Options include a drop-jet fluxing system, additional witness camera, dual LED monitors, topside preheating, an inline fluxing and preheating module, offline programming and a 75mm wide wave nozzle. Is SMEMA-compatible. Equipped with Super Quick processing speeds. When equipped with a drop-jet flux applicator, it can handle a range of flux chemistries, including low pH fluxes down to 2.0 and fluxes with solids content as high as 35%. Has SWAK-OS machine operating software.

ACE Production Technologies, www.ace-protech.com

SMT 158 series of underfill is customizable in color, filler concentration, and particle sizes. Is said to cure fast and at low temperatures. For bare chip protection in advanced packages like memory cards, chip carriers, hybrid circuits and multichip modules. Is said to eliminate cleaning. Is compatible with lead-free processes and for ultra-low bump applications such as chip-scale packages, ball grid arrays, PoP, land grid arrays, and some flip-chip applications. 

Yincae Advanced Materials,  http://www.yincae.com/technical-information.html 

i-CON Pico and i-CON Nano soldering stations have a footprint of 145mm x 80mm. i-CON Pico is intended for hobbyists; i-CON Nano reportedly meets all criteria for ESD protection and is intended for industrial use. Both stations can be configured using a microSD card. 80W soldering stations use ultra-light i-Tool soldering iron; available with a range of soldering tips. i-CON 1 and i-CON 2 are professional industrial soldering stations powering  150W i-Tool. Both stations are operated using a text display and i-Op control knob. Other soldering and de-soldering tools can be connected to i-CON 2. Are available with optional interface for an IR preheating plate or a solder fume extraction unit. i CON Vario 2 and i-CON Vario 4 are multichannel soldering and de-soldering stations equipped with i-Tool Air S, a 200W hot air soldering iron. One additional tool is connectable to Vario 2; three soldering and de-soldering tools can be operated in addition on Vario 4, which is reportedly ideal for soldering tasks in development, production, rework and maintenance. Both stations are equipped with standard control interfaces to an IR preheating station and a solder fume extraction unit.

Kurtz Ersa North America, www.ersa.com

No. 887 is a gas-fired 1000°F cabinet oven used for curing metal coatings onto parts. Workspace dimensions measure 38” x 38” x 38”.  175,000 BTU/HR installed in a modulating natural gas burner provide heat, while a 2,000 CFM, 2-HP stainless steel recirculating blower furnishes a horizontal airflow across the workload. Features an aluminized steel exterior, Type 304, 2B finish stainless steel interior, plus inner and outer door gaskets that seal against the door plug and front face of the oven. Has 8” thick insulated oven walls, consisting of 2” of 1900°F block and 6” of 10 lb/cf density rockwool insulation. Safety equipment is onboard as required by IRI, FM and NFPA Standard 86 for gas-heated equipment, including a 325 CFM, 1/3-HP powered forced exhauster. Digital indicating temperature controller is provided.

The Grieve Corp., www.grievecorp.com

Explorer real-time monitoring uses DataMan barcode reader. Incorporates scalable architecture, a web-based performance statistics interface, and novel vision technology. Trends read rates, evaluates images from packages that were not read and classifies those images. Connects to a network of DataMan readers and regularly pulls read rate information and images from packages. When a process error results in a package with an unread barcode, images are sent; automatically evaluates and categorizes each image and stores them in a database.

Cognex Corp., http://www.cognex.com

PSV3000 automated programming system uses FlashCORE III programming engine; combines programming technology with intelligent system integration. Includes pick-and-place technology and vision system. Is reportedly capable of delivering up to 1000 parts per hr. in tape and tray configurations. Supports up to 16 individual programming sockets and all device types, including FPGAs, CPLDs, microcontrollers, and flash memories, including serial flash, eMMC, NAND and NOR devices.   

Data I/O, www.dataio.com/PSV3000 

Multi-Phi laser soldering robot can be adjusted for each soldering pattern. Variable diameter laser beam optimizes energetic conversion into heat. Components reportedly can be soldered from any direction without interference. Has fixed z-axis distance; variable is 0.004-0.12". Unix-413S mid-size soldering robot and Unix-414S wide-area soldering robot come with clean cut feeder and lock-on mechanism.

Japan Unix Co., www.japanunix.com 

MC7885-UFS flip-chip underfill has a Tg of >240°C and stress-absorbing capabilities. Underfills large-area flip-chip components and reportedly cures without voids and internal stresses. For use in chip-on-board underfill and standard flip-chip underfill component applications. Reportedly withstands temperatures up to 350°C without thermal degradation. Cured underfill has less than 20ppm/°C in coefficient of thermal expansion and higher than 6 GPa in modulus. Most curing can be done at 120°C; can increase temp. to 150°C.

AI Technology, www.aitechnology.com