MP-520 SiP inspection system combines precision linear drive motor technology with 25MP CoaXPress camera, 3D confocal measurement system and Omni-vision 3D digital multi-frequency moiré technology. Is configured with eight phase color lighting and four 10MP side-view cameras. For measurement and inspection of solder ball/bumps, bond wire, chip bonds, discrete devices, heat sinks, underfill, printed circuit boards, and packages. Results are stored in a central database, enabling remote access SPC data through Intellisys total quality management system software.

Mirtec, www.mirtecusa.com

Adjust-a-Vac vacuum tweezer is for handling very thin/delicate substrates, wafers, MEMS devices and other fragile components. Can adjust vacuum level from 1-10" of mercury. Integrated 10-segment bar graph display shows vacuum level present during operation. Bar graph shows minimum vacuum pressure until part is grasped, then displays vacuum level presented to the part being handled. Vacuum port integrates a user-replaceable inlet filter.

Virtual Industries, www.virtual-ii.com

Master Bond MasterSil 912Med is a room temperature vulcanizing silicone system for bonding, sealing and coating. Meets USP biocompatibility and ISO cytotoxicity standards and resists a variety of sterilization techniques such as gamma radiation, EtO and some types of liquid sterilants. A one-part material offers noncorrosive cure with a tack-free time of 15-30 min. at room temperature. Translucent color; serviceable over temperature range of -75°F to +400°F. Tensile strength 700-1,100 psi. Adheres to metals, composites, ceramics, glass, rubbers, plastics and other silicone substrates. Elongation 250-350%. Volume resistivity of >1015 ohm-cm. Comes in 80g tubes and has a shelf life of 6 months.

Master Bond, masterbond.com/tds/mastersil-912med

Laser shape rings aid selection of optimal laser spot shape to fit components and land shapes to reduce circuit board problems. Come in twin-spot, circle, square, ring and oval ring. Help avoid inadvertent burning of PCBs. Twin-spot enables simultaneous soldering of two joints.

Japan Unix, japanunix.com/en/products/laser/shapes.php

• Verification video showing how incorrect laser shapes burn components: youtube.com/watch?v=iqjpVepqWbU

• Twin beams working two components simultaneously: youtube.com/watch?v=vRWr80bnCfg

Pressure-Sensitive Cover Tape 2698 transparent, polyester film tape has synthetic, room-temperature, pressure-sensitive adhesive zones at its sides. Helps eliminate pick-and-place errors, minimize down-time and increase productivity. Is said to enable near-flawless placement of chips on circuit boards without sticking, static charge or contamination. Comes in standard widths and 600m reels designed to reduce changeover time and enable productivity improvements. Compatible with existing industry-standard equipment.

3M, http://www.3m.com/transport

THT-Line AOI for double-sided inspection of plated through-hole assemblies now comes with tape transport in addition to roller conveyor for work piece carriers. Inspects selective solder joints on assemblies transported without work piece carrier. Can be used both for actual manufacturing process in the upper area of the system as well as return transport in lower area of the machine. Also has laser measuring system for coplanarity control (e.g., for connectors) or for height measurements on various components. Up to two different and independently operating AOI modules can be integrated into a single system chassis. 

Goepel Electronics, www.goepel.com

EMS 618-15 is a room temperature cure two-part conductive adhesive for printed circuit board assembly applications. Is said to cure in 24 hr. at room temperature or rapidly at elevated temperatures. Has a 10-to-1 mix ratio and comes in a two syringe package designed for use with static mix heads. Forms high-strength, high-reliability conductive interconnects.

Engineered Material Systems, www.emsadhesives.com

Unix FS flash soldering series has a speed upgrade with an integrated optical laser configuration; is reportedly two times faster than a typical laser. Can integrate pre- and post-soldering processes such as surface mount and through-hole devices. Depending on conditions, 100 points can be soldered in fewer than 30 sec. at <0.25 sec./point. Integrates soldering process for solder paste and wire; has a coaxial camera that follows soldering work scenes. Soon will feature automatic correction and error detection. Is possible to integrate pre- and post-soldering.

Japan Unix, www.japanunix.com

ACT100Lite automatic wet scrubber for metal masks used in solder printing is said to reduce costs and space requirements by limiting metal masks’ size to small. Uses a novel small-area scrubbing method. Scrubbing and drying occur inside scrubber, eliminating contact with solvent and exposure to airborne cleaning solution for operator safety. The simple configuration minimizes maintenance costs and the need to replace consumables.

OKI Communication Systems, http://www.oki.com

TC-3040 thermally conductive gel is a thermal interface material (TIM-1) developed with the help of IBM. Reportedly offers more reliable
thermal management, reduced stress and excellent under-die coverage for flip chip applications. Is said to deliver nearly two times the thermal performance of other industry standard TIMs, as well as high thermal conductivity targeting 4W/mK with reliability. Offers broader design options for high-performing, reliable ICs.

Dow Corning, www.dowcorning.com

Multi-ɸ variable laser spot diameter system optimizes laser exposure diameters to fit any component size or board patterns. Laser beam spot diameters are adjustable without moving. Beam spot diameters adjustable within 0.1-3.0mm. Diameter range determined by optical fibers and lens configuration. Variable spot diameters accommodate diverse component shapes and land patterns. New feeding mechanism feeds solder wire from any direction. Mixed-component assembly PCBs now can be processed with just one machine. Replacement laser heads are now available for existing laser soldering customers.

Japan Unix, www.japanunix.com/en/products/laser/multi-phi.php

Place-n-Bond underfilm is now offered with glue dots preapplied to the strip as an alternative for tacky pads. Testing now integrates into a standard SMT feeder. A thinner version of underfilm helps improve LGAs during shock, drop, and thermal cycling testing. Is a preformed thermoplastic packaged in tape and reel that is picked and placed with an existing SMT feeder. Bonds during reflow process and can be used in BGA reliability, flex-circuit-to-rigid-board bonding, encapsulating, and sealing. No dispensing, additional cure time or cold storage is required.

Alltemated, www.alltemated.com