Digital Position Setup Tool is designed for use on Ersa selective soldering machines such as Versaflow 3, Versaflow 4050 and Versaflow 5060. Can measure flux spray position up to 0.1mm position accuracy at the printed circuit board level. Deviations can be displayed on the machine or remotely. Machine verification is digitally controlled. Is designed for use with 3/6 nozzles; other nozzle options are available. Includes automatic calibration mode. Is compatible with other selective solder equipment depending on dimensions.

Kurtz Ersa North America, www.ersa.com

TestStation Multi-Site in-circuit test system features multiple test head support and concurrent test architecture to reportedly deliver two to four times productivity compared to conventional MDA/ICT systems. Inline automated handler is for high-speed, no-touch printed circuit board assembly test processing; supports panels up to 450 x 350mm, with up to 5,120 test points. Delivers mechanical board transport times of fewer than six sec.

UltraPin II 128HD channel card features 512 hybrid pins per card for high-complexity and high-density applications. Increases pin count to
15,360 pins. High-density channel card doubles system test point counts. Systems configured with 128HD can be configured to 15,360 test points.

LH ICT supports up to 4,096 test points. Multi-Site dual-site model supports two concurrently operating test heads in a footprint under 0.7 m².

Permit moving to automated no-touch manufacturing test. Handler has dual-site support in an 850mm wide footprint; is designed to replace two to four times as many automatic or manual MDA/ICT systems.

Teradyne, www.teradyne.com

JOT M10 Six Slider loads software on smartphones, either fully assembled products or at the board level. Box can be used as a standalone desktop unit or as part of a fully automated JOT M10 line, including integrated handlers and racks. Has a clear interface for customization and space for customized cabling and electronics. Is also applicable to dozens of other use cases besides software downloading.

JOT Automation, www.jotautomation.com

Dow Corning EA-7100 adhesive is based on silicone chemistry. Enables strong bonds to a variety of substrates. One-part, heat-cure adhesive cures rapidly and at lower temperatures from inside out. Forms strong bonds to metals, ceramics, glass, laminates, and plastics. Reportedly has up to 50% faster cure time than conventional heat-cure platinum catalyzed silicone adhesive systems; achieves full cure within 15 min. at 100°C. Designed for automotive electronics.

Dow Corning, https://www.dowcorning.com/

535-11M-7 UV cured epoxy was developed to pass the reliability requirements in disk drive, camera module, photonics and circuit assembly applications. Is an ultra-low stress, lower glass transition temp. version of 535-10M-1 UV cure adhesive. Can be used for lens bonding in camera modules, chip encapsulation in smart cards, and general bonding applications in photonics assembly. Reportedly cures rapidly when exposed to high-intensity UV light. Is a low outgassing, flexible, high-strength epoxy adhesive that does not contain antimony.

Engineered Material Systems, www.emsadhesives.com

PSV5000 automated programming system combines programming technology with intelligent system integration. Includes pick-and-place technology and vision system for precise alignment and placement. Supports integrated fiber laser marking. Rated for delivering up to 1300 parts per hour.  

Supports all device types, including FPGAs, CPLDs, microcontrollers and flash memories (including serial flash, eMMC, NAND and NOR devices) with tape and tray configurations with up to 6 programmers (24 individual sockets) in a compact footprint. Supports Serial Number Server software. 

Data I/O, dataio.com/PSV5000 

P-series, for atomic layer deposition of thin-film coatings, uses sequential, self-limiting and surface-controlled gas phase chemical reactions to apply ultrathin, uniform conformal coatings on printed circuit boards. Is production-scalable. Is said to deposit a dense, tight, uniform conformal coating.

Picosun, www.picosun.com

M8 no-clean solder paste, for high-density electronics assemblies, has been developed in combination with T4 and finer mesh Pb-free alloy powders. Reportedly provides stable transfer efficiencies. Novel activator system provides durable wetting action accommodating a range of profiling processes and techniques. Reportedly eliminates HiP defects on BGAs and reduced voiding on QFN/BTC components. Based on NC258 platform.

AIM Solder, www.aimsolder.com

Updated XJTAG software reportedly increases flexibility for easier access to JTAG capabilities of boards and maximum test coverage. Dynamic chain profiling helps initialize boards with multiple JTAG chains, in which a device in one JTAG chain controls power supplies or reset lines for JTAG devices in other chains. During flash programming, can be set up to clock only JTAG data through the chain needed for programming operation. Can remove need to clock hundreds of bits of data per scan; speeds testing/programming. Increases capabilities of XJLink2 JTAG controller.

XJTAG, www.xjtag.com

Tuff Trac ESD Lo-CHAR technology is a dual-layer, PVC-based electrostatic discharging mat for use on floors and work surfaces where static discharge may be harmful. Mats are designed for use in monitored environments to perform at range of 10⁶ to 10⁸. Are manufactured with PVC that includes a blend of flame-retardant and low smoke chemistry. Meet ASTM standards for both smoke and flame resistance per NFPA Life Safety Code 101. In tests, reportedly barely sustained flame after 4 min. of continuous exposure and self-extinguished at 6 min.

The Biltrite Corp., http://biltrite.com/lochar/

White solder resist Elpemer SD 2491 SG-TSW-R6-B has excellent yellowing resistance after Pb-free reflow soldering and high thermal loads. Has thermal cycling test resistance of 500 cycles between -40 and 125°C. Has a reflectivity of ≈ 90% at 460nm and a yellowing resistance of Db ≈ 1,2. Is for LED applications in automotive electronics.

Lackwerke Peters, www.peters.de

Solvent-free thick film coatings Elpeguard Twin-Cure FP 115-0304 and FP 115-0306 were developed for LED curing at a wavelength of 395nm, followed by air humidity crosslinking in shadow areas. After UV curing, FP 115-0304 is tack-free within one hr. and inline-capable. Is best suited for protecting assembled printed circuit boards. FP 115-0306, once UV cured, takes longer to be tack-free; is good for all lighting electronics applications. Both reportedly have outstanding chemical, climatic and mechanical resistance.

Lackwerke Peters, www.peters.de