XJFlash module automatically generates custom programming to overcome speed limitations generally associated with using boundary scan to program flash memories connected to FPGAs. Relieves JTAG chain of unnecessary traffic (usually generated by repetitive functions such as shifting in control, address and data bits). By doing so, programming speeds close to the device’s theoretical maximum can be achieved. Supports a range of flash and FGPA configurations, and can now be used as part of an XJDeveloper boundary scan test project to create a programming solution. Reportedly erases, programs and verifies any flash memory provided there is access to it from an FPGA on the target board, all within the XJTAG software.

XJTAG, www.xjtag.com

Automated Flash Program Generator (AFPG) supports all in-system programming options. Is a tool for automatic generation of scripts for universal in-system programming of non-volatile memory such as flash devices, and also microcontrollers with integrated flash and via boundary scan. ISP programs mounted devices directly in native environment. Supports universal in-system programming of NAND flash devices, phase change memories, OneNAND components, FPGA embedded instruments, connected processors and via boundary scan. Provides a graphical definition of the command sequence, various possibilities for bad block handling, multi-site support and a block library.  

Goepel electronic, www.goepel.com

SMT 88 series underfills enable a faster cure while at room temperature. Are adhesives that reportedly combine advantages of fast cure in UV adhesives and reliability of capillary underfill. Can be underfilled at room temperature without preheating a substrate. Advantages include void-free underfill, easy rework, easy dispensing, outstanding reliability, and excellent mechanical resistance. Can be used for chip scale packaging, ball grid array devices, package-on-package, land grid array, and flip chip applications. Suitable for bare chip protection in packages such as memory cards, chip carriers, hybrid circuits and multichip modules.

Yincae Advanced Materials, www.yincae.com  

MDP-300 combines flip chip, thermosonic, and thermocompression bonding in a single, small footprint. Includes synchronous head motion that enables bond head and dispenser to work in parallel. Is said to increase bond quality and enhance overall throughput. Supports up to 300mm (12”) wafer substrates. Connects to SMT machines.

Panasonic Factory Solutions Co. of America, www.panasonicfa.com

Vision Mini Xi industrial compact smart camera with embedded Ethernet is for close-range industrial auto ID, inspection, and other machine vision applications. Is reportedly the smallest fully-integrated smart camera with embedded Ethernet, measuring 25.4mm x 45.7mm x 53.3mm. Weighs 3.2oz. Features serial connectivity, a 24-volt interface, and optically isolated I/O. Can handle dot peen marks on power-train components, laser markings on medical devices or printed circuit boards, and printed barcodes on packaging and labels.

Microscan, www.microscan.com

Horus 3D measurement system measures volume and dimension of nearly any type of substance, part, component, or die. Can measure transparent and shiny materials and difficult-to-measure objects at production speeds. Is for semiconductor applications and electronics manufacturing and assembly applications, including board-level SMT. Can measure flux and solder balls using wide field of view optics. Can be used as inline inspection machine.

Koh Young Technology, www.kohyoung.com  

2004D multi-purpose dispensers combine 3-axis robots with digital dispense controllers for SMT assembly tasks. Provide point-to-point, linear, or curved-arc application of solder pastes, solder masks, conductive epoxies, and other adhesives. Benchtop units weigh fewer than 100lbs.; can store up to 10,000 different dispensing routines created through the use of a handheld teach pendant. Can import CAD and graphics file formats and 3D interpolation of arc and line data points. Feature high-torque drive mechanism for speeds to 800mm/sec. and linear guide rails for a repeatability of ±0.01mm per axis.  Have 100mm of z-axis stroke and braking system that can hold up to a 6kg payload without power.

Manncorp, www.manncorp.com

MV-9 SIP is configured with Omni-Vision 2D/3D technology for semiconductor inspection. Combines 25Mp CoaXPress 2D ISIS vision system with digital multi-frequency quad Moiré 3D system for inspection of semiconductor assemblies. Features four 10Mp side-view cameras and 25Mp top-down camera. MP-7 Micro is designed for BGA ball inspection. Is configured with 15Mp ISIS vision system, a 6µm telecentric compound lens and color strobe LED lighting.

Mirtec, www.mirtec.com

CION Module SO-DIMM204-3/ECC is for boundary scan test of DDR3-DIMM sockets.

Sigma G5JS single-beam mounter implements overdrive technology for utilization of front and rear resources via a single placement head. Head can be high-speed (up to 44mm square single shot recognition) or multifunction. Head is rated at 37,500 cph; multi-function head is rated at 7,000 to 9,000 cph for chip components, excluding transition time of approx. two sec. Can choose from three different tray feeders.

Hitachi High Tech Instruments, http://www.hitachi-hta.com

SM3320S-S single table, SM3350S-D twin table and SM4520L-D twin table floor-mounted printed circuit board depaneling routers feature built-in high-res color CCD cameras with 20x magnification. Program cutting path with controls that are saved, edited and copied. Vision system is included to check fiducials before cutting starts or can be turned off. Precision ball-screw and linear guides maintain repeatability of ±0.03mm. Offer dust collection from the bottom with a built-in ionizer and a safety shield.

Fancort Industries Inc., www.fancort.com

Amtech VS-213 no-clean, lead-free solder paste formula is halogen-free based on all testing methods, including oxygen bomb combustion and ion chromatography. Is said to be environmentally friendly and fully compliant with ROHS 2011/65/EU. Helps prevent voiding when soldering LGA, BGA, CSP and QFN packages. Wets easily, has long stencil-life, and 16-hour abandonment time. Thermally stable at temperatures up to 300oC. Meets highest IPC 7095 voiding performance classification of Class 111. ROL0 flux classification. Post-reflow residue said to be nonconductive and noncorrosive.

SMT International, www.amtechsolder.com