E4990A impedance analyzer now has an enhanced measurement speed option. Low-frequency models now reportedly as fast as 120MHz E4990A model. Can use the option with the 10MHz (Opt. 010), 20MHz (Opt. 020), 30MHz (Opt. 030) or 50MHz (Opt. 050) low-frequency options. Reportedly increases measurement speed up to 10x. Analyzer has a frequency range of 20Hz to 10/20/30/50/120MHz and provides 0.045% basic accuracy, with a 40V built-in DC bias source. Equivalent circuit analysis function supports seven different multi-parameter models and enables simulation of equivalent component parameter values.

Keysight Technologies, www.keysight.com  

LAS 160 extraction and filtration system features a new filter combination said to significantly increase filtration efficiency. Also has low-noise system operation. Can be equipped with suitable capturing elements, such as hoods or extraction arms, or connected to external systems for automated operation via a D-Sub interface. Removes airborne substances occurring during material processing and marking by means of laser technology. 

ULT AG, www.ult.de

Zestron Eye CM full scale concentration management or short CM system provides precise, real-time concentration measurement of the cleaning stage based on Zestron Eye 3P-Technology, as well as closed-loop dosage of cleaning agent concentrate or DI-water. Constantly monitors media concentration and maintains defined concentration level for continuous good cleaning results. Designed as a standalone module, can be integrated within production lines and connected to newly implemented or existing cleaning processes independently of the machine type and manufacturer. 

Zestron, zestron.com

 Flexcon SA1000 offers clean removability, performance at temperatures as high as 400°F, and clarity. Can be used to affix films to smooth surfaces and provides consistent, clean, quiet removability. Can be reapplied or used more than one time in some cases. Comes in two VBS product constructions, a 2 mil and a 5 mil clear polyester with a polyester liner for excellent adhesive wet-out.

Flexcon, https://www.flexcon.com

Balver Tip activator is an easy-to-use tool for cleaning oxidized iron soldering tips for SnPb and Pb-free processes. In the simple process, the solder tip is dipped into the solid activator, which becomes liquid and immediately starts removing oxides from the solder tip. After this de-oxidation sequence, the solder tip can be tinned and is ready to create solder joints. Is low smoke and low odor.

Balver Zinn, www.balverzinn.com

CL-100 depaneler for LED boards can handle single-sided, metalized, or FR-4 panels of any length. Uses three sets of round knives positioned at different heights to separate in three sequential steps. Is motor-driven and uses a starting and ending table to lay the panel; operator can feed panel into and through the knives. Table comes in a standard length of 7.8', with 3.5' at the front and 3.5' at the rear. Other length tables are available on request. Can separate boards from 0.8 to 3.5mm in thickness. Max. speed is 400mm/sec. Weighs 45kg.  

Fancort Industries, www.fancort.com

xQR41 MicroDot needle valve features a 60% smaller form factor than standard valves, an exchangeable modular design for greater customization and process control, and a quick release clasp. Is 66mm x 23.7mm and enables multiple valves to be mounted closer together. Reportedly ideal for automated assembly processes, the needle valve can dispense in tighter spaces and at more complex angles. Weighs 141.4g and can be fed from a variety of reservoirs, syringe barrels, external cartridges, or tanks. QR clasp secures fluid body to air actuator and can be removed with a turn of a thumbscrew. Applies micro-deposits as small as 150µm of low- to high-viscosity fluids onto a substrate. Can be configured with stroke adjustable or non-adjustable cap, BackPack valve actuator, low-profile mounting block, and 90° air and fluid inlet fittings. Fluid body can be aligned and locked at 360° intervals to accommodate mounting, positioning, and fluid inlet alignment needs.

Nordson EFD, www.nordsonefd.com

SBX02 alloy has a melting point below 140°C and can be used with peak reflow profiles between 155° and 190°C. Permits through-hole components requiring low peak temperature to be soldered by pin-in-paste low-temperature reflow, eliminating wave soldering. Features mechanical strength, the ability to absorb impact energy and improved drop shock resistance over SnBi0.4Ag alloy. Low voiding in BGA solder joints.

Alpha, alpha.alent.com/en/Solutions/Process/Low-Temperature-Alloys

Automated Normalization software addresses time required for PCB region-based tolerance tightening. Two-stage system is said to optimize printing, automatically normalize results and set tighter tolerances to monitor product drift. 5D measurement, combining 2D and 3D measurements, reportedly ensures proper zero referencing. Normalization extraction takes user-selected average area, height and volume from previous inspections when being set. If a process change needs to be made, such as stencil or print settings, normalization extraction can be readily reset and applied again.

MEK, http://www.mek-europe.com/

K7000 circular linear blade depanelizer singulates pre-scored PCBs with tight component spacing. Linear blade is 12" (304mm) long and has a 0.030" (0.762mm) thin symmetrical cutting edge designed for PCBs with closely spaced components. Circular blade is 3.8" (71mm) in diameter and has the same cutting edge profile as the linear blade. -- 0.030" (0.762mm) Blade is mounted on a shaft with centerline of the cutting blade passing directly through the middle of the support bearing. By placing the score-line on the linear blade and pulling the circular blade carriage across the upper score-line the panels can safely be singulated with minimal effort. Additional tooling available for safe board placement and handling during singulation.

FKN Systek, www.fknsystek.com

J-STD-001F certification soldering kit, for hand soldering certification to the newest standard, allows the trainer to administer training in tin-lead and lead-free RoHS compatible solders. Exceeds minimum requirements of J-STD-001F for soldering. It said to be an effective, cost-effective way to train and evaluate students and employees. Contains a variety of standard surface mount and through-hole components with traces to simulate real world situations. Comes individually boxed with all components bagged and labeled for easy identification. Conforms to J-STD-001E standard for soldering. Training center and bulk discounts available.

BEST Inc., www.soldertools.net

The 4800 wafer level bondtester was developed for testing wafers from 200mm up to 450mm. Paragon software provides flexibility for the creation and mapping of wafers, enabling setup of test patterns. Virtual images for each test pattern reportedly enable easy editing.

Nordson Dage, www.nordsondage.com