Black and TrueWhite laser markable labels are tested to GMW14573 and GM6121M performance requirements for automotive label applications. Can be ablated by a variety of low power lasers, provide flexible, high-temperature alternatives to polyester and acrylic laser markable labels and are durable. Include high-temperature polyimide films, durable cross-linked polymer coatings, low surface energy pressure-sensitive adhesives and liners for handling and die cutting. Can be ablated by most low-power CO₂, YAG, fiber, UV and Vanadate lasers. Adhere to metals, plastics, glass, ceramics and resins.

Polyonics, www.polyonics.com

VisionMaster 6.0 software, for desktop SPI systems, performs 3D measurements and plots printed circuit board features. Upgrades include negative height measurements, pad array creation with an intuitive user interface, and improved processing algorithms. Touchscreen support for Windows 8/10 has been extended and updated. Features charting. Built-in SPC support provides process capability data range selection and better upper and lower limit control, and color palette-based threshold entry. Removes unwanted data points for charts, expands support for external SPC packages, like Siemens' Criterion and Minitab, and performs multiple 2D measurements. Measures object width, height and diameter. Draws measurement templates on any object in the field of view of the sensor.

VisionMaster, www.visionmasterinc.com

Optymo 4.4 BoM and parts management software features enhanced quotation module that allows fast sending of RFQs and price and lead-time comparisons. "Min/max" feature now rapidly computes unit and total costs for various quantities of a given BoM, calculates excess costs and remaining components, depending on volumes and packaging. Presents results in graph format. Integrates a relational datase based on a client/server structure. Includes faster data transfer. 

Inlynk, www.inlynksoft.com

XP series syringe adapters use 5/32" OD tubing for ease of handling and maneuvering. Permit pressurization of a syringe to dispense a metered amount of material ergonomically and with precision. Come in 3, 5 10, 30, 50cc sizes as well as an option for 6' tubing length. Fits all Jensen Global air syringes as well as many other manufacturers' syringes. Come with standard black quick connect barb fitting or white quick connect fitting that plugs right into novel digital dispenser systems.  

Jensen Global, www.jensenglobal.com

Hybrid 3 chip placer has a placement accuracy of less than 10µm, for wafer-level packaging, FOWLP, SiP, MCM, flip-chip, modules and embedded components. Places both die and passive components. Based on high-speed AX/iX product family.

Kulicke & Soffa, www.kns.com

PCB Rax printed circuit board holder is for repair, prototyping and assembly. Is designed to hold odd-shaped boards, even round ones. Accessory slots (open T-slots, allow the addition of various accessories. Customizable. Uses standard connecting hardware. 

PCB Rax, www.kickstarter.com/projects/1428014401/pcb-rax-an-easy-to-use-circuit-board-holding-syste

RACS (reducing agent: coke substitute) waste reprocessing technology processes contaminated trash into a carbon-rich reducing agent used to make pure metals and profits from dross and oxides. Waste stream is generally comprised of understencil wipes, spent paste, tubes and jars, gloves, rags, finger cots, and other similar items.

Conecsus, www.conecsusllc.com

CA-180 low-temperature cure conductive adhesive is for die attach and general circuit assembly applications. Cures in 30 min. at 80°C, three min. at 100°C, or 10 sec. at 150°C with an electrical conductivity of 4 x 10^-5ohm-cm. Reportedly ideal for applications in which components are temperature-sensitive and require high conductivity interconnects. Has a 48-hr. work life and a 12,000 cP viscosity at 5 rpm. Was developed to pass reliability requirements in die attach, disk drive, camera module, photonics and circuit assembly applications.

Engineered Material Systems, www.emsadhesives.com

phoenix x|aminer x-ray inspection system now comes with CMOS-flat panel detector.  With computed tomography (CT) capability and a CT-dedicated software package, is said to generate high-quality imaging for 3D and 2D inspection. Reportedly reduces time and costs in failure analysis, process control in printed circuit board assemblies and component inspection, and in research and development. Combines CT capability with CMOS imaging for improved signal-noise ratio and sharpness. New software package for CT applications further enhances nondestructive inspection (NDT) processes. Controls and monitors all components of the CT system, including microfocus x-ray tube, flat panel detector and work-piece manipulator, for greater control of projection data set creation, volume reconstruction and the visualization of volumes and projections. Performs simple and fast CT scanning with virtually instantaneous data acquisition or reconstruction.

GE Measurement & Control, www.gemeasurement.com/inspection-ndt/radiography-and-computed-tomography/phoenix-xaminer

Supreme 10HTF-1 single-part adhesive/sealant is for aerospace, electronics, optical and other applications. Is said to have an unlimited working life at room temperature and cures rapidly at elevated temperatures. Typical cure schedules are 5 to 10 min. at 300°F or 15 to 20 min. at 250°F. Delivers physical strength values for tensile lap shear, tensile and T-peel of >3,200 psi, 6,500-7,500 psi and 20-25 psi, respectively. Bonds to metals, composites, glass, ceramics, rubbers and many plastics. Has low shrinkage upon curing, is dimensionally stable and has a Shore D hardness >70. Withstands rigorous thermal cycling and mechanical shock and vibration. Offers cryogenic serviceability over the temperature range of 4K to +400°F. Resists water, fuels, acids, bases and many solvents. Is a reliable electrical insulator. Volume resistivity is 1013ohm-cm.

Master Bond, www.masterbond.com

Digital Position Setup Tool is designed for use on Ersa selective soldering machines such as Versaflow 3, Versaflow 4050 and Versaflow 5060. Can measure flux spray position up to 0.1mm position accuracy at the printed circuit board level. Deviations can be displayed on the machine or remotely. Machine verification is digitally controlled. Is designed for use with 3/6 nozzles; other nozzle options are available. Includes automatic calibration mode. Is compatible with other selective solder equipment depending on dimensions.

Kurtz Ersa North America, www.ersa.com

TestStation Multi-Site in-circuit test system features multiple test head support and concurrent test architecture to reportedly deliver two to four times productivity compared to conventional MDA/ICT systems. Inline automated handler is for high-speed, no-touch printed circuit board assembly test processing; supports panels up to 450 x 350mm, with up to 5,120 test points. Delivers mechanical board transport times of fewer than six sec.

UltraPin II 128HD channel card features 512 hybrid pins per card for high-complexity and high-density applications. Increases pin count to
15,360 pins. High-density channel card doubles system test point counts. Systems configured with 128HD can be configured to 15,360 test points.

LH ICT supports up to 4,096 test points. Multi-Site dual-site model supports two concurrently operating test heads in a footprint under 0.7 m².

Permit moving to automated no-touch manufacturing test. Handler has dual-site support in an 850mm wide footprint; is designed to replace two to four times as many automatic or manual MDA/ICT systems.

Teradyne, www.teradyne.com