Bi rework solder paste is designed for desoldering Pb-free components and for LED removal. Reduces risk of board damage during desoldering. With desoldering temp. of 180°C, it reduces desoldering temperatures and times. Is a no-clean, halide-free flux. Features easy dispensing and cleanup. Provides excellent removal of through-hole and SMT components. Is RoHS compliant.

The Balver Zinn Group, www.balverzinn.com

BP 256 solder joint encapsulant is for BGA, CSP, flip-chip, PoP, and other ball bumping applications. Is said to create a solder joint bond five to 10 times stronger than a conventional solder joint, enhancing reliability and eliminating cracking. For use in lead-free, SnPb and SnBi processes. Reworkable.

Yincae, http://www.yincae.com/technical-information.html 

iFlex T2 surface mount machine can place component heights up to 21mm. Includes tray and tube feeding capability. Is designed for high mix environments. Reportedly achieves first-pass yield production levels with defect levels of less than 1dpm.

Assembléon, www.assembleon.com

Quad 01005 ceramic nozzles enable placement for 0201 and 01005 micro-components. Measure 0.32mm OD with a 1mm ID.

Count On Tools, www.cotinc.com

Optymo 4.2 software is intended to help with design choices, component management, purchasing and inventory management. Reportedly simplifies workflow between design and operations. Offers three packages: Optymo Design, Optymo Essentials, and Optymo Advanced. Includes graphical exploration based on basic components; revision control for components; copy/paste function within and between applications; online help and application notes, and an export module of configurable data. Offers a tree view of component categories and subcategories.

Inlynk, www.inlynksoft.com

WR5000M, WR3000TS, WR3000SS, WR3000TA and WR3000SA rework systems offer application flexibility, productivity and process control, including 400W of power over three independently-controlled channels, up to 21 tool options, up to 200W of soldering power and hot air power, and up to 120W of desoldering power for ground plane and multilayer boards. Comes with all critical components and tips. Less than 5 sec. hot air time to temperature. No end of cycle hot air cool-down time. Tool air flow volume of 1-15 L/min. Rotary vane vacuum pump. PC connectivity and data logging capabilities. Temperature stability of ± 2°C / ± 4°F. ESD-safe, meets or exceeds MIL-STD and J-STD-001E industry specifications. 

Weller, Apex Tool Group, www.weller-tools.com

DataMan 8600 series of handheld direct part mark barcode readers combine novel algorithms and patented UltraLight technology for reading DPM codes on a range of materials and surfaces. Provide Ethernet communication with industrial protocols, enabling integration with factory automation equipment. Field-interchangeable communication modules permit readers to be configured to meet customer-specific communication requirements. Come with both corded and wireless communication modules. Supports industry-standard communications including USB, RS-232 and Bluetooth wireless communication to an intelligent base station.

Cognex, www.cognex.com/handheld-barcode-scanners.aspx 

25X Measuring Microscope Pen is a pocket-sized microscope with measuring reticle for precision measurements. Is for inspecting defects and measuring conductor and pad widths, plated holes, and other tiny features and components on circuit boards. Field of view is 3.3 mm, with a scale division of 0.05 mm.

CircuitMedic, www.circuitmedic.com/parts/115-3115.shtml

Wave Glide squeegee blade is said to custom-fit to any blade holder on the market using slots, not holes, eliminating the need to completely dissemble the blade holder when the blade needs replacement.  Integrated Paste Containment Wing reportedly requires no setup or operator involvement, virtually eliminating paste tram-lines or paste seeping out behind the guides. Easy to clean, with no nooks or crannies.

Lu-Con Technologies, www.lu-con.com

GT32 Series high-speed 1.5mm pitch connector employs pin-in-hole intrusive reflow method to improve PCB retention force and enable a one-time reflow process with other SMT components. Features positive locking structure that prevents partial locking, incomplete engagement and accidental disengagement. Offers enhanced EMI shielding and low near-end crosstalk. Supports LVDS, USB3.0 and HDMI 1.4a Type E, and comes in several versions including a 4-position model with transmission speeds up to 3Gbps/pair, a 10-position version with transmission speeds up to 5Gbps/pair, and a 19-position model with transmission speeds up to 2Gbps/pair. Resists vibration, physical and thermal shock (1000 cycles from -40° to +85°C), sulfur dioxide and heat up to 105°C. Lock strength 98 N. RoHS and ELV compliant. Rated voltage 30V AC, rated current of 1A, contact resistance 30m ohms maximum (shielded), and insulation resistance 100M ohms minimum at 500V DC.

Hirose, www.hirose.com/us

NPM-D3 multifunctional SMT placement machine features interchangeable, plug-and-play placement heads and integrates solder paste inspection (SPI), adhesive dispense (ADH), and post-placement inspection (AOI). Has a single-unit camera for alignment, thickness and coplanarity. Offers 3D multi-recognition, board warp detection, adaptive process control and auto board support. Flexible placement heads support a part range of 03015mm passives to 6" long connectors up to 28mm tall. Area placement rate 26,300cph per sq. m. Dual lane configuration, or converts to single-lane for boards up to 650 x 510mm (25 x 20").

Panasonic Factory Solutions Company of America, www.panasonicfa.com

NPM-D3 multifunctional SMT placement machine features interchangeable, plug-and-play placement heads and integrates solder paste inspection (SPI), adhesive dispense (ADH), and post-placement inspection (AOI). Has a single-unit camera for alignment, thickness and coplanarity. Offers 3D multi-recognition, board warp detection, adaptive process control and auto board support. Flexible placement heads support a part range of 03015mm passives to 6" long connectors up to 28mm tall. Area placement rate 26,300cph per sq. m. Dual lane configuration, or converts to single-lane for boards up to 650 x 510mm (25 x 20").

Panasonic Factory Solutions Company of America, www.panasonicfa.com