CC7090E and CC7130-E Prima Protect conformal coatings are for moisture and salt fog protection. Offer moisture, salt fog and direct immersion protection for electrical contacts, electronic circuits and devices, printed wiring boards, and structures made with metal, wood and plastics. Are molecularly flexible for good adhesion; resist abrasion. Have flexibility to withstand low temperature cracking, fungicide to provide protection in submerged environments, and are non-silicone and electrically insulating. Are designed to meet IPC-CC-830 requirements with UV inspection dye and fungi-resistance. Can be brushed, dipped or sprayed on.

AI Technology, www.aitechnology.com

MR Series placement machines include 4th generation linear motors, electronic eX feeders, and machine and NPI software. Feeder capacity is 120 slots; part capacity is 25mm. Smart eX feeders reportedly index six times faster than previous design. Series includes four models: two single gantry, single conveyor, and two dual gantry dual conveyor models. Include two versions of heads on the single or dual gantry drive system. Higher-speed machines have six module-type heads per gantry; flexible versions have four precision heads per gantry. ZHMD sensor electronically measures Z height of stick and tray parts.

Mirae, www.mirae.com

DeltaProbe is an add-on technology for periodic profile capture. Offers process control without the need for test boards. Uses Smartlink interface; can hold product and process recipe information. Measurement sensors capture process records without a test card or wires. Is fitted to an adjustable frame; can be changed to the width of the printed circuit board being measured. Matched sensors show performance problems across the width of the oven heater. There are independent limit settings per oven zone. Can be used once a temperature profile is captured from a real test PCB.

SolderStar, www.solderstar.com

20 GHz continuous wave signal generator features exceptional phase noise and 100 µs tuning time. Addresses blocking/interferer generation, high-performance intermodulation distortion test benches and electronic warfare applications.

National Instruments, www.ni.com/microwave/

The 26.5 GHz microwave vector signal analyzer delivers low noise floor, high linearity, and low phase noise. Has up to 765 MHz of instantaneous bandwidth. Can analyze radar pulses, LTE-advanced transmissions and 802.11ac waveforms. Can program FPGA with LabVIEW system design software.

National Instruments, www.ni.com/microwave/

Pro Series automated fluid dispensing system integrates vision and laser height sensing with closed-loop encoding to provide a complete automated solution that is quick to set up, easy to program and operate. Smart vision CCD camera captures detailed component part images and converts them into high resolution digital files. PRO4L Series includes fully integrated laser height sensing that detects height variations on the surface of a product and makes corrections to dispensing height to prevent uneven deposits and tip or workpiece damage. Novel DispenseMotion software simplifies setup and facilitates programming with an onscreen preview of dispensing path. Dispense tip can be driven to precise point needed. Eases importing and converting of DXF, CAD, and Excel files. True three-dimensional motion control allows easy programming of dots, lines, circles, arcs, compound arcs, and complex patterns. Comes in platform sizes of 200 x 200, 300 x 300, 400 x 400 and 500 x 500.

Nordson EFD, http://www.nordson.com/en-us/divisions/efd/pages/default.aspx

Supreme 12AOHT-LO one-component thixotropic paste is for bonding and sealing in aerospace, electronics and electro-optic applications. Fully passes ASTM E595 testing for NASA low outgassing and is suited for vacuum environments. Resists thermal cycling and shocks over a service temperature range of 4K to +500°F. Thermal conductivity is 9-10 BTU•in/ft²•hr•°F and is a competent electrical insulator. Bonds to metals, composites, glass, rubbers, ceramics and many plastics. High tensile lap shear, compressive and peel strengths exceed 3,500 psi, 22,000 psi and 5-10 pli, respectively. Is dimensionally stable and has low shrinkage upon cure. Is resistant to a variety of chemicals, particularly to water, oil, fuels and solvents. Requires no mixing. Said to have an unlimited working life at room temperature and cures rapidly at elevated temperatures. Comes in syringes, ½ pints, pints, quarts, gallons and 5 gallon containers.

Master Bond, 

Phoenix Datos|x 2.3  CT software comes with new highlights like a specific production mode for fully automated CT data acquisition, reconstruction and evaluation and supports high precision 3D measurements following VDI 2630 guidelines. New one-button-CT production mode automates entire CT process chain from scan to final evaluation report, speeding 3D metrology and failure analysis. Control functions such as detector calibration or tube conditioning run totally independent from operator influence in the background. Includes system performance monitoring procedures which follow ASTM 1695 guidelines. Minimizing operator time and influence and improving part throughput and evaluation result repeatability, helps raise productivity in industrial production. New metrology package option offers precise, reproducible 3D metrology for nominal/actual CAD comparison, wall thickness analysis and efficient tool correction tasks. 

GE Measurement & Control, ge-mcs.com/en/radiography-x-ray/ct-computed-tomography.html

Inspect-X 4.1 acquisition and analysis software for x-ray and CT systems provides improved real-time imaging and advanced BGA analysis. Real-time image enhancements provide easy-to-interpret images for fast online defect recognition. Image processing algorithms enable automated BGA analysis and reporting for stacked components and multilayer boards. Intelligently adapts to changing x-ray conditions and sample positions, automatically adjusting image controls, contrast and brightness to provide clear, sharp images to aid in defect recognition. Enhancements and filters can be chosen and stored as user profiles to suit different sample types or individual operator preferences. New BGA tool provides powerful image processing, fully automated analysis and detailed reporting to inspect complex packages such as package-on-package (PoP) or dual-layered boards. Features a user-friendly template creation GUI of each BGA package, detailing array dimensions, positions and geometries using a wizard or directly imported from file. Automatically inspects each ball using advanced void analysis featuring single and total void percentage per ball. Also checks ball count, circularity, under- or oversizing, bridging and misalignment defects. Built-in reporting features overlay the x-ray images with color-coded analysis for easy interpretation. Is for large batch inspection; can inspect multiple boards in one routine.

Nikon Metrology, www.nikonmetrology.com

3D sensing capabilities incorporate multi-reflection suppression technology and 3D algorithms. Enable high-quality 3D images at production speeds, using multi-view sensors. Multi-view 3D data are merged with algorithms and MRS that suppress reflection that can distort data. Sensor design captures and transmits data simultaneously and in parallel.

CyberOptics Corp., www.cyberoptics.com

XQuik combines x-ray imaging with AccuCount Technology image processing and inventory management to provide accurate counts of components stored in tape-and-reel. Is said to automatically completes the count of components as small as 01005 with better than 99% accuracy in seconds. Works without having to remove reels from moisture barrier or anti-static bags. Benchtop system with a footprint of 26 x 24" (66 x 62cm). Barcode reading, automatic label printing and MES system interface options available.

VJ Electronix, http://vjt.com/vje/vje/

TrueHeight Spacer Blocks non-collapse disc spacers are said to improve yields of assemblies with large BGA devices. Enables reflow soldering of some types of through-hole devices. Are said to mitigate corner solder bridging caused by BGA warping during SMT reflow. Come in tape-and-reel packaging for automatic placement. Aid in intrusive reflow applications where there is either no standoff function or inadequate clearance under through-hole components by raising the component off the PCB, permitting solder to reflow freely to achieve 100% hole fill.  Height control + 0.010mm.

Alpha, www.alpha.alent.com