EP21NDCL two-component epoxy cures optically clear in thin sections. Has a one-to-one mix ratio by weight or volume. Ratio can be adjusted. Cures at room temp. or more quickly at elevated temp. Upon curing, has durable bonds with high tensile lap shear, tensile and compressive strength of 2,600-2,800 psi, 6,500-7,500 psi and 12,000-13,000 psi, respectively. Volume resistivity greater than 1014 ohm-cm. Resists water, oils, fuels, acids, bases and salts. Withstands thermal cycling over a temp. range of -60° to +250°F. Shelf life of a year at 75°F in original, unopened containers. Comes in container kits ranging from 0.5 pint to 5 gal.

Master Bond, www.masterbond.com

XF-731 (1 mil) and XF-732 (2 mil) label materials use a durable top coat chemistry that reportedly is resistant to harsh fluxes. Labels resist softening at elevated temperatures, do not yellow, and exhibit excellent abrasion resistance. Are thermal transfer printable, semi-gloss white polyimide label materials that use acrylic adhesive systems. Are designed to provide barcode tracking of printed circuit boards and electronic components.  

Polyonics, www.polyonics.com

RW1210 rework system contains selectable operating modes that fully automate removal, placement, and soldering sequences.  Includes enlarged board holder to handle printed circuit boards up to 430mm x 360mm. Comes standard with a 1.3 million pixel, split-vision CCD camera and a 15” 1080p high-res display. Joystick-controlled zoom with 230x magnification and high-brightness LED lighting provide superimposed views of component leads and PCB solder pads for alignment using ultra-fine X, Y, and Θ axis µm. Provides ±0.01mm placement accuracy for 0.3mm lead pitch µBGAs and delicate QFPs. Includes five hot air nozzles for components from 2 x 2mm to 55 x 55mm. Has 1200W upper and bottom heaters; 2700W, rapid IR underheater heats bottom surface of the PCB.  

Manncorp, www.manncorp.com  

VERSAMag high-magnification HD inspection system has a multi-axis, high-res camera that tilts and rotates for multiple angle inspection with an adjustable Z-height arm. Has magnification up to 96x and includes real-time video inspection, flexible working heights and intuitive controls. Is ergonomically designed and has measurement and annotation capabilities when paired with FSInspection software. FSInspection software enables operator to provide inspection, documentation and reporting. Operator can capture, annotate, store and share images.

FSInspection, www.fsinspection.com

PICO Toµch controller reportedly helps dispense exact, repeatable micro-deposits as small as 0.5nL at up to 500Hz continuous, with 1500Hz maximum bursts. Features intuitive touch screen interface for precise control of the valve. Can set precise operating parameters, such as ramp open and close and stroke control. Pulse time can be adjusted in increments as small as 0.01ms. Better slope control delivers more repeatable deposits, while preventing turbulence and air bubbles from entering the fluid.

Nordson EFD, www.nordsonefd.com

PICO Pµlse non-contact jet valve reportedly helps dispense exact, repeatable micro-deposits as small as 0.5nL at up to 500Hz continuous, with 1500Hz max. bursts. Can jet low- to high-viscosity fluids onto any surface, including uneven and tough-to-reach substrates. Has exchangeable parts; adaptable to a range of applications. Tool-free latch mechanism allows for easy removal of the fluid body.

Nordson EFD, www.nordsonefd.com

Disposable material path TS5624DMP diaphragm valve reportedly enables difficult fluids and pre-mixed two-part epoxies to be dispensed without frequent cleaning. Wetted area can be replaced in seconds, while the valve stays on the production line. Wetted parts are manufactured from black Polyethylene to prevent moisture and UV light from coming into contact with the dispense fluids. Dispenses low to medium viscosity fluids over a range of shot and bead sizes, down to a fraction of a µl. Has internal spring return; valves adaptable for use with Techcon Systems controllers. Seal-less valve design offers moisture-sensitive resistance. Diaphragm creates a barrier between the wetted parts and the air cylinder. Valve comes standard with a mounting bracket kit, valve air hose, luer lock fluid line, sample packet of DMP inserts and a dispensing tip selection pack.

Techcon Systems, www.techconsystems.com

StratoSphere Series plasma treatment equipment for wafer-level packaging and 3D packaging can now be configured in two, four or six chamber configurations for increased throughput and flexibility. Provide surface preparation and elimination of contamination for ashing, descum, bump, organic contamination removal, and wafer destress during semiconductor manufacturing operations, especially for applications such as 2.5D and 3D wafer-level fan-out. Handles semiconductor wafers up to 300mm (12") in diameter and supports automated handling and processing of round or square wafers. Processes thin wafers with or without a carrier, depending upon wafer thickness.

Nordson March, nordson.com

Vault Tooling Part Holder is available in a variety of standard sizes, pin lengths and densities; also can be configured for most applications and machines. Can be used in applications where the reduction of custom tooling, fixtures, molds or jigs is desired. Technology uses a high-density array of pins that automatically conform to the shape of any part. Once locked, it creates a “nest” to hold the part during the desired process. After completion, the tool is reset. Can be used on bench-tops, robots or integrated into machines or work cells.

Production Solutions, www.production-solutions.com

Martin MiniOven 05 BGA/CSP reballing and QFN prebumping system provides enhanced process capability with updated firmware and increased control and temperature stability. Hybrid heating technology heats electronic components similar to a standard reflow oven. A 4-button front display enables fast setup and management of multiple user-defined reballing and prebumping profiles. Profiles are generated using auto profile software and external thermocouple for real-time product temperature feedback. Easybeam Windows-based software enables profile management and backup. Supports inert atmospheres such as nitrogen and uses a gas distribution system.

Finetech, www.finetechusa.com

Gap Pad EMI 1.0 low stress thermal interface material unites thermal conductivity with EMI absorption capabilities. Offers heat and electromagnetic energy control. Has thermal conductivity of 1W/m-K and EMI absorption for frequencies above 1GHz. Thermal conductivity is enhanced by natural tack on one side. Has ability to conform to various topographies. Reduces in-field failures caused by solder joint stress and fractures. Comes in sheet and die-cut formats.

Henkel, www.henkel.com/electronics

Malcom VDM-2 video capture system is used in conjunction with Malcom reflow simulators, capturing video of the simulated reflow process. Includes video mixer that overlays the temp./time/profile data over the video. Receives real-time, temperature, wettability, profile and other data. Data is overlaid onto the video feeds taken by the video camera(s) in real-time. Built-in scale function measures displayed object. Up to two CCD cameras can be connected; displays up to two video feeds simultaneously.

Seika Machinery, www.seikausa.com