Macaos Enterprise v. 4.0 PCB management, panelization, stencil creation and online ordering software includes assembly data manager for adding or modifying pick-and-place data, bill of materials data, and graphical remarks for PCB. Expands support for sending an RFQ to EMS providers. Enhanced stencil creation module offers greater flexibility in the placement of data within the stencil frame, additional options for splitting a large opening into smaller openings or
changing the shape of an opening, and improved support for stencil creation scripts. Additional annotations have been added to panel drawings to show X and Y step distance and size and shape of all fiducials and bad marks. Now supports boards with up to 30 copper layers, Gerber files in the X2 format, and improved support for ODB++ files.

Macaos Software, www.macaos.com

Squink prints conductive ink and places components on circuit boards. Prints and assembles parts on flexible or rigid substrates. Is for prototyping. Allows design sharing and locates schematics online. Can access through USB, Ethernet cable, or Wifi. Accepts Gerber and .png files.

BotFactory, https://www.kickstarter.com/projects/botfactory/squink-the-personal-electronic-circuit-factory 

Nu/Clean 800 X2L inline cleaner has a dual tank system. Runs an independent chemical wash with chemistry of choice, an independent DI water wash, or a full chemical wash with a full DI water wash. Both tanks heated independently. Parameters controlled via touch-screen software. Dedicated, recirculating isolation rinse prevents cross contamination from chemistry wash tank to water-only wash tank. Every liquid is either recirculated or sent to an evaporator via closed-loop sump system for zero discharge disposal. Chemical wash tank drains to sump tank and then to evaporator, which separates water from residues. Water-only wash tank is recirculated through a DI water system to remove contaminants and returned to water-only wash tank. Isolation rinse is closed loop with dedicated DI System. Final rinse tank cascades into rinse tank. Water from rinse tank is sent to a second DI system to be cleaned and returned to final rinse.

Technical Devices Co., www.technicaldev.com

SHP-K & SHP-KM soldering iron handpiece can be used in OKI/Metcal soldering systems, designated PS-800, PS-900, MFR-PS1100, and MFR-PS2200. SHP-K is compatible with connector on PS-800/900 systems; SHP-KM is compatible with connector on MFR-PS1100/PS2200 systems. Permit use of EasyBraid EK series cartridges that do not need heating elements necessary with OKI/Metcal design.

EasyBraid, www.EasyBraidco.com

SMT 88UH reportedly can be underfilled at room temperature without preheating substrate. Advantages reportedly include void-free underfill, easy rework, easy dispensing, outstanding reliability, and excellent mechanical resistance. Can be stored in a regular refrigerator or freezer. Can be used for chip-scale packaging, ball grid array devices, package-on-package, land grid array, and certain flip-chip applications. Suitable for bare chip protection in memory cards, chip carriers, hybrid circuits and multichip modules.

Yincae Advanced Materials, http://yincae.com/board-level-assembly.html

Loctite Eccobond NCP 5209 nonconductive paste is designed for fine-pitch flip-chips. Delivers underfill protection. Is pre-applied onto substrate, facilitating bump protection and interconnection. Formulated for Cu pillar bumps and Cu OSP substrate pad finishes, it reportedly offers bump reinforcement and safeguarding for devices with pitches of less than 100µm and gaps less than 40µm. Has stage life up to 2 hr. at 70°C. Passed MSL3 testing. Withstands up to 1,000 thermal cycles. Is capable of high-temperature storage of up to 1,000 hr. at 150°C.

Henkel Electronics Group, www.henkel.com/electronics
 

VuData statistical process analysis software for YesTech automated optical inspection systems  stores data with all faults related to assembly numbers, board serial numbers, system operator and time. Collects performance data in terms of line speeds, timing and throughput. Generates comprehensive reports showing yield rates in both board and opportunity format, as well as current and historical failure rates with types and trends. Management reports are also available for inspection and review timing, false and genuine fault rates and other line metrics. Live charting directly shows yields and part failure rates, with common failures and rankings. Generates and emails performance alarms. Exports to Excel, pdf, jpg or other formats. Fail pictures presented in a fault picture viewer, and any data can be used to generate live charts, graphs and reports as circumstances demand. AOI performance can be tracked through reports related to time, user, board, fault, false call, assembly, job and serial numbers. Data can be searched, sorted, filtered and grouped without need for external software. Provides yield and throughput monitoring as well as other management statistics. 

Cupio Yestech Europe, www.cupio.co.uk

XJFlash module automatically generates custom programming to overcome speed limitations generally associated with using boundary scan to program flash memories connected to FPGAs. Relieves JTAG chain of unnecessary traffic (usually generated by repetitive functions such as shifting in control, address and data bits). By doing so, programming speeds close to the device’s theoretical maximum can be achieved. Supports a range of flash and FGPA configurations, and can now be used as part of an XJDeveloper boundary scan test project to create a programming solution. Reportedly erases, programs and verifies any flash memory provided there is access to it from an FPGA on the target board, all within the XJTAG software.

XJTAG, www.xjtag.com

Automated Flash Program Generator (AFPG) supports all in-system programming options. Is a tool for automatic generation of scripts for universal in-system programming of non-volatile memory such as flash devices, and also microcontrollers with integrated flash and via boundary scan. ISP programs mounted devices directly in native environment. Supports universal in-system programming of NAND flash devices, phase change memories, OneNAND components, FPGA embedded instruments, connected processors and via boundary scan. Provides a graphical definition of the command sequence, various possibilities for bad block handling, multi-site support and a block library.  

Goepel electronic, www.goepel.com

SMT 88 series underfills enable a faster cure while at room temperature. Are adhesives that reportedly combine advantages of fast cure in UV adhesives and reliability of capillary underfill. Can be underfilled at room temperature without preheating a substrate. Advantages include void-free underfill, easy rework, easy dispensing, outstanding reliability, and excellent mechanical resistance. Can be used for chip scale packaging, ball grid array devices, package-on-package, land grid array, and flip chip applications. Suitable for bare chip protection in packages such as memory cards, chip carriers, hybrid circuits and multichip modules.

Yincae Advanced Materials, www.yincae.com  

MDP-300 combines flip chip, thermosonic, and thermocompression bonding in a single, small footprint. Includes synchronous head motion that enables bond head and dispenser to work in parallel. Is said to increase bond quality and enhance overall throughput. Supports up to 300mm (12”) wafer substrates. Connects to SMT machines.

Panasonic Factory Solutions Co. of America, www.panasonicfa.com

Vision Mini Xi industrial compact smart camera with embedded Ethernet is for close-range industrial auto ID, inspection, and other machine vision applications. Is reportedly the smallest fully-integrated smart camera with embedded Ethernet, measuring 25.4mm x 45.7mm x 53.3mm. Weighs 3.2oz. Features serial connectivity, a 24-volt interface, and optically isolated I/O. Can handle dot peen marks on power-train components, laser markings on medical devices or printed circuit boards, and printed barcodes on packaging and labels.

Microscan, www.microscan.com