AeroJet noncontact jet dispenser offers a fast tact time (height adjustment not required) and a maximum speed of up to 333 shots per sec. Precise jetting mechanism is capable of super micro shot dispensing. Dispenses from side angles as well as uneven surfaces.

Musashi Engineering, www.musashi-engineering.co.jp

Seika Machinery, www.seikausa.com

NEO View visual inspection support system provides secondary, reliable inspection for AOI systems. Automatically tracks and captures defects as transferred by receiving data from AOI. Displays high-resolution, enlarged images with top view and angled view CCD cameras. Captures defects missed by AOI as each inspection site programmed is always confirmed.

Hitachi Giken, www.hgiken.co.jp

Seika Machinery, www.seikausa.com

SuperΣ dispensing system features a digital controller for automatic/manual dispensing. Provides continuous, precise and repeatable dispensing with no dripping. Automatically calculates correct dispensing volume and pressure and detects usage level of remaining dispensing liquid.

Musashi Engineering, www.musashi-engineering.co.jp

Seika Machinery, www.seikausa.com

DXU-580YF is designed for Yamaha feeder models YS and ZITA storage. Holds up to 21 feeders with tape and reel. Dehumidifies and stores MSDs in reels at a humidity level of 1%RH. Conforms to IPC-J-STD 033C.

McDry, www.mcdry.us

Seika Machinery, www.seikausa.com

M8 no-clean solder paste, developed in combination with T4 and finer lead-free alloy powders, provides stable transfer efficiencies. Novel activator system provides durable wetting action, accommodating a range of profiling processes and techniques. Is said to eliminate HiP defects on BGAs and reduce voiding on QFN/BTC components while producing bright shiny solder joints, leaving minimal, high purity residue engineered to be left in place. Based onl NC258 platform.

AIM Solder, www.aimsolder.com

Integra V1 boundary scan demo module detects integration specific faults. Demonstrates integration solutions with test methods such as functional test, in-circuit test, manufacturing defects analyzer and flying probe test. Contains various boundary scan structures, as well as non-boundary scan components. Production faults can be simulated by switch; signal states can be monitored. Additional test points allow testing of non-scannable partitions. Includes production-capable contacting options, such as test points, ribbon cable, GTAP, etc.

Goepel electronic, www.goepel.com

NPM-W2 placement machine reportedly has a 10% throughput boost and 25% more accuracy, plus a multi-recognition camera. Component range is 03015mm to 120x90mm and 150mm connectors. Features quick-change feeder carts, auto board support setup, and expanded nozzle capacity, along with an intelligent feeder.

Panasonic Factory Solutions Company of America, www.panasonicfa.com   

Ionograph SMD V contamination tester has been redesigned and features optional heating capabilities and is controlled by PowerView software. Ionograph BT series comes in small, medium or large versions. Has been modified to enhance safety and ease of maintenance. Both determine cleanliness of electronic components, assemblies with SMT devices, and bare and assembled printed circuit boards.

Specialty Coating Systems, www.scsequip.com

Replacement nozzles for Panasonic NPM placement machine heads come in high-speed (8-, 12- and 16-nozzle) and multifunctional (2-  and 3-nozzle) versions. Come in plastic, tool steel, and ceramic. Feature laser-marked factory barcodes. Have hard coating to provide waterproofing, prevent scratches, and increase tool life.

Count On Tools, www.cotinc.com

Stannostar HMM-1000 MSA-based, pure tin plating process is for deposition of reflowable, pure tin in medium- and high-speed equipment. Non-fluoborate process is formulated to produce matte to semi-bright pure tin deposits without oiling out of the organic compounds. Deposits are said to have consistent, stable surface morphology and are suitable as a “low whisker,” lead-free alternative finish. Pure tin deposits contain minimum organic inclusions that exhibit excellent covering power and a high degree of ductility. The deposits exhibit superb solderability and low carbon content over wide temperature and current density ranges, as well as high efficiency, low foam and uniform dissolution of anodes. For plating parts with complex geometries, including electronic housing and connectors. 

Enthone, an Alent Co., www.enthone.com

RW1200 SMT/BGA rework system includes high-def vision, IR underheating, and component alignment. Handles boards up to 16.1" x 14.6." Comes standard with a 1.3Mp split-vision CCD camera and 15" 1080p HD display. Joystick-controlled zoom with 230X magnification and high-brightness LED lighting provide superimposed views of component leads and printed circuit board solder pads for alignment using X, Y, and Θ axis µm. In conjunction with its Z-axis drive mechanism and automatic height sensing, it provides ±0.01mm placement accuracy for 0.3mm lead pitch µBGAs and QFPs. Heater nozzles for components from 2 x 2mm to 55 x 55mm direct up to 1200W of hot air from the upper heater to component. Adjustable hot air flow control. 1200W bottom heater is surrounded by a 2700W, rapid IR underheater.  

Manncorp, www.manncorp.com

Loftware Spectrum 2.5.2 enterprise labeling solution has unlimited label design capability. Features new cab and PCL 5c drivers for color printing; enhanced live data in design; new label image output options; added language support for global deployments, and Linux printer support. Cab driver enables support for the cab XC series two-color thermal printers and the A+ series, the EOS series, and Mach4 thermal printers. Can position fields and judge spatial relationships between objects on a label. New image device driver outputs label formats and saves image for validation or to email label images.

Loftware, www.loftware.com