SMT 158 series of underfill is customizable in color, filler concentration, and particle sizes. Is said to cure fast and at low temperatures. For bare chip protection in advanced packages like memory cards, chip carriers, hybrid circuits and multichip modules. Is said to eliminate cleaning. Is compatible with lead-free processes and for ultra-low bump applications such as chip-scale packages, ball grid arrays, PoP, land grid arrays, and some flip-chip applications. 

Yincae Advanced Materials,  http://www.yincae.com/technical-information.html 

i-CON Pico and i-CON Nano soldering stations have a footprint of 145mm x 80mm. i-CON Pico is intended for hobbyists; i-CON Nano reportedly meets all criteria for ESD protection and is intended for industrial use. Both stations can be configured using a microSD card. 80W soldering stations use ultra-light i-Tool soldering iron; available with a range of soldering tips. i-CON 1 and i-CON 2 are professional industrial soldering stations powering  150W i-Tool. Both stations are operated using a text display and i-Op control knob. Other soldering and de-soldering tools can be connected to i-CON 2. Are available with optional interface for an IR preheating plate or a solder fume extraction unit. i CON Vario 2 and i-CON Vario 4 are multichannel soldering and de-soldering stations equipped with i-Tool Air S, a 200W hot air soldering iron. One additional tool is connectable to Vario 2; three soldering and de-soldering tools can be operated in addition on Vario 4, which is reportedly ideal for soldering tasks in development, production, rework and maintenance. Both stations are equipped with standard control interfaces to an IR preheating station and a solder fume extraction unit.

Kurtz Ersa North America, www.ersa.com

No. 887 is a gas-fired 1000°F cabinet oven used for curing metal coatings onto parts. Workspace dimensions measure 38” x 38” x 38”.  175,000 BTU/HR installed in a modulating natural gas burner provide heat, while a 2,000 CFM, 2-HP stainless steel recirculating blower furnishes a horizontal airflow across the workload. Features an aluminized steel exterior, Type 304, 2B finish stainless steel interior, plus inner and outer door gaskets that seal against the door plug and front face of the oven. Has 8” thick insulated oven walls, consisting of 2” of 1900°F block and 6” of 10 lb/cf density rockwool insulation. Safety equipment is onboard as required by IRI, FM and NFPA Standard 86 for gas-heated equipment, including a 325 CFM, 1/3-HP powered forced exhauster. Digital indicating temperature controller is provided.

The Grieve Corp., www.grievecorp.com

Explorer real-time monitoring uses DataMan barcode reader. Incorporates scalable architecture, a web-based performance statistics interface, and novel vision technology. Trends read rates, evaluates images from packages that were not read and classifies those images. Connects to a network of DataMan readers and regularly pulls read rate information and images from packages. When a process error results in a package with an unread barcode, images are sent; automatically evaluates and categorizes each image and stores them in a database.

Cognex Corp., http://www.cognex.com

PSV3000 automated programming system uses FlashCORE III programming engine; combines programming technology with intelligent system integration. Includes pick-and-place technology and vision system. Is reportedly capable of delivering up to 1000 parts per hr. in tape and tray configurations. Supports up to 16 individual programming sockets and all device types, including FPGAs, CPLDs, microcontrollers, and flash memories, including serial flash, eMMC, NAND and NOR devices.   

Data I/O, www.dataio.com/PSV3000 

Multi-Phi laser soldering robot can be adjusted for each soldering pattern. Variable diameter laser beam optimizes energetic conversion into heat. Components reportedly can be soldered from any direction without interference. Has fixed z-axis distance; variable is 0.004-0.12". Unix-413S mid-size soldering robot and Unix-414S wide-area soldering robot come with clean cut feeder and lock-on mechanism.

Japan Unix Co., www.japanunix.com 

MC7885-UFS flip-chip underfill has a Tg of >240°C and stress-absorbing capabilities. Underfills large-area flip-chip components and reportedly cures without voids and internal stresses. For use in chip-on-board underfill and standard flip-chip underfill component applications. Reportedly withstands temperatures up to 350°C without thermal degradation. Cured underfill has less than 20ppm/°C in coefficient of thermal expansion and higher than 6 GPa in modulus. Most curing can be done at 120°C; can increase temp. to 150°C.

AI Technology, www.aitechnology.com

Genealogy software module is capable of tracking, tracing and controlling printed circuit boards throughout assembly to the finished product. Captures the identity of each individual PCBA, subassembly or other item, and links information directly to the serial number of the finished product. Enables drill-down to multiple levels of subassembly, identifying which component lot numbers were used to build a specific PCBA in a specific product serial number. Traceability database is backwards-searchable to identify which product serial numbers were built using a specific component lot number. Permits multi-level box build traceability and improves inventory control with real-time visibility of all materials in process (WIP). Is said to reduce manufacturing, warranty and customer service costs, and improve product quality with automated quality control.

Cogiscan, www.cogiscan.com

SI 7.47 software release has improved downlink function for solder paste inspection (SPI), automated AOI assurance, and includes new µBGA analysis, among other features. Has closed-loop interfaces to MPM and Panasonic printers and extended connections to DEK and Ekra printers. Now supports print process without barcodes. Integrated Verification facilitates simple assurance of AOI inspection program quality by automatically saving all defect images acquired at the verification station and making them available for future optimization or generation of new inspection plans. Extends µBGA inspection by an analysis with features combination that conjoins and evaluates completely different features. New converter changes all relevant parameters of the inspection pattern automatically, at the press of a button. 

Viscom, www.viscom.com

Solder saver is for use with SnPb and Pb-free wave soldering machines. Design changes include a separate activation switch; user can hold it in one hand and activate it with the other. Has an adjustable handle to reach solder pots in wave soldering machines. Can recycle dross; scoops hot dross from surface of the wave solder pot. Dross oxides are separated from the solder by high-speed rotary process system. Works on a continuous process basis.

Aprotec Instrumentation, aprotecinstrumentation.co.uk
 

Chemask HT is a fast curing, peelable temporary spot mask formulated for long-term heat protection at elevated temperatures. May be used to protect pins, posts, contacts and edge connections in the solder reflow oven or during conformal coating processes. Chemask Aqua solder masking agent is a high-temp. temporary spot mask that protects component-free areas from molten solder during wave soldering. Is water-soluble, designed to be removed with open and closed loop aqueous cleaning systems, low foaming, and has no effect on deionized water system resin beds.

Chemtronics, www.chemtronics.com

Solder Ball Placement Kit, part of the convection rework accessory range, enables repeatable and consistent rework of small components. Includes tools necessary to rework small chip components:

* 2000 each of 0.04mm, 0.06mm, 0.08mm, and 0.10mm solder balls with container.
* Four ESD-safe carbon fiber reinforced oilers; black 0.2mm, blue 0.3mm, green 0.5mm, and red 0.8mm.
* One part positioning matrix and squeegee.
* One PEEK spudger.
* One bent tweezers.
* One half tweezers.
* One 5000 grit sharpening stone.

About Metcal, www.metcal.com/sbpkit