HCT-910 hot air rework system is accurate and intuitive-to-use, with high thermal performance capable of meeting the full spectrum of application requirements needed for production and rework in electronics manufacturing.

Profiling Software 2G and SPS Smart Profilers now come with optional Dual Profiling, permitting up to 24 thermocouple locations in a single profile run for temperature profiling measurements.

PF918-S lead-free BGA spheres is formulated with SnAg4.0Bi3.0 alloy designed with high thermal impact reliability for long service life electronic products with high-reliability requirements.

HCSM2818 resisters are rated at 5W and now provide a 2mΩ resistance value with TCR of 100ppm.

Master Bond EP17TF one-part epoxy has paste consistency and can be dispensed evenly and uniformly.

CSNL2512-3W current sensing resistor now includes 0.2mΩ resistance value.

This interactive component search tool is available as a fixed navigation menu option on the Kyocera AVX website and accessible via computer, tablet or smartphone.

Panda 500 CE robotic soldering system is capable of processing 500mm x 500mm PCB or pallet and deploying vision for fine alignment.

Molex Quad-Row board-to-board connectors feature staggered-circuit layout.

SMEF-Z52 enhanced solder joint encapsulation material flux combines abilities of conventional flux and underfill.

SM-100 smart mixer provides solder paste mixing with real-time quality control and materials traceability.

CC-100 thickness tester provides non-destructive and contactless conformal coating thickness measurements.