Supplemental bar alloys for Indalloy 291 wave solder pots are designed to maintain recommended solder pot specifications.

EP4S-80 one-component silver-filled epoxy meets NASA low outgassing requirements.

EVS 11KLFHS solder recovery system reportedly recovers up to 80% of pure solder.

Apogee 90 x-ray inspection system is at-line NDT solution for manual or semi-automated inspection of printed circuit boards, components and assemblies.

ThermoActive Suite 7.15.16 auto profiling software provides PID control capability for auto-profiling and process control.

i-Con Trace soldering station enables traceability during manual soldering.

Matrix automatic SMT support tooling system includes pneumatic connections for product changeover using Smart Touch operator interface with on-screen operator instructions and access to downloadable process apps.

VE Cam compact digital microscope is available in two variants with differing fields of view: VE Cam 50 (50mm FOV) and VE Cam 80 (80mm FOV).

TF43SW series hybrid flexible printed circuit/flat flexible connector has power contacts capable of handling 12A and 0.5A signal contacts.

ATEasy 2021 integrated test executive and development software can be used to automate test and evaluation of electronic devices, boards, subassemblies and systems.

CW-305 halogen-free flux-cored wire offers cleaning in which post-soldering residue can be removed by using warm water wash.

Sarcon SPG-70A thermal interface material is a high flow rate, high heat transferring compound that exhibits a thermal conductivity of 7.0W/m°K and has lowest thermal resistance among Fujipoly’s dispensable SPG products.