PF735-PQ10-10 low-melting-point lead-free solder paste is capable of reducing reflow temp. to below 190°C, decreasing PCB and substrate deformation.

Henkel Berquist Liqui Form TLF 10000 one-part, high thermal conductivity dispensable gel provides heat transfer for high-power electronic components, improving operational efficiency and extending lifetime system reliability.

Table Top Digital Fringe Projection 2.0 (TTDFP2) provides fast and accurate surface topography for discontinuous surfaces at room temp.

DA158N die attach thermal conductive and electrical insulating adhesives can be fast cured at low temp.

TR8100H SII high-density pin count in-circuit tester with vacuum fixture targets low-voltage testing market.

VR-6000 3D optical profilometer is designed with built-in motorized rotational unit.

Draloric TNPV0805 automotive-grade high-voltage thin-film flat-chip resistors combine operating voltages to 450V with tolerance of ±0.1% and TCR down to ±10 ppm/K.

X8011-III automated 3D MXI resembles exterior of iX7059 systems.

TS9800 series jet valve dispensing system is comprised of TS9800 Piezo-actuated jet valve and TS980 smart controller.

EO-Y-014A and EO-Y-014C are alcohol- and water-based fluxes that have been developed for use in wave and selective soldering.

Alpha OM-565 HRL3 high-reliability low-temp. solder paste is formulated for assemblies to mitigate warpage-induced defects in temperature-sensitive chip-scale packages.

EXOS 10/26 convection reflow soldering system has vacuum chamber of 600mm to handle PCBs with max. length of 600mm.