PF918-S lead-free BGA spheres is formulated with SnAg4.0Bi3.0 alloy designed with high thermal impact reliability for long service life electronic products with high-reliability requirements.
HCSM2818 resisters are rated at 5W and now provide a 2mΩ resistance value with TCR of 100ppm.
Master Bond EP17TF one-part epoxy has paste consistency and can be dispensed evenly and uniformly.
This interactive component search tool is available as a fixed navigation menu option on the Kyocera AVX website and accessible via computer, tablet or smartphone.
Panda 500 CE robotic soldering system is capable of processing 500mm x 500mm PCB or pallet and deploying vision for fine alignment.
SMEF-Z52 enhanced solder joint encapsulation material flux combines abilities of conventional flux and underfill.
SM-100 smart mixer provides solder paste mixing with real-time quality control and materials traceability.
CC-100 thickness tester provides non-destructive and contactless conformal coating thickness measurements.
BD9xxN1 series automotive LDO regulator ICs have stable operation at nanoscale output capacitance.
Inspekto S70 autonomous machine vision software features recommendations center that guides users to create and maintain inspection profiles and improve process integration and accuracy of inspection. Incorporates profile center, including tools that guide users when adjusting profile.