Active Optical Xtreme is a small form-factor hybrid solution providing power, control and data transmission across longer distances required for use in machine vision systems, factory automation, robotics and intelligent sensing devices.

FactoryLogix 2022.1 and 2022.2 offer capabilities to eliminate redundancies, streamline error-prone processes, promote agility, increase quality and reduce waste.

FT230 XRF analyzer is designed to enable quality control by simplifying and accelerating testing of components and assemblies.

AOX755 flux-filled high-performance solder wires are based on two soft solder alloys filled with three cores of flux compound EO-FC-006.

Etimol defoamer DFL-100 and DFL-C anti-foaming agents can be used in machine-based cleaning to prevent uncontrolled foam development.

1911MK5-VR Nitrogen Vacuum Reflow Oven has 11 zones, a vacuum chamber, closed-loop nitrogen atmosphere control and Cool-Pipe flux management system, which traps flux so it can be removed and replaced while oven is running.

EO-Y-006 A and C fluxes consist of 60% alcohol and 40% water.

YRM20 high-speed modular mounter features high-speed rotary head that achieves up to 115,000cph. 

PF735-PQ10-10 low-melting-point lead-free solder paste is capable of reducing reflow temp. to below 190°C, decreasing PCB and substrate deformation.

Henkel Berquist Liqui Form TLF 10000 one-part, high thermal conductivity dispensable gel provides heat transfer for high-power electronic components, improving operational efficiency and extending lifetime system reliability.

Table Top Digital Fringe Projection 2.0 (TTDFP2) provides fast and accurate surface topography for discontinuous surfaces at room temp.

DA158N die attach thermal conductive and electrical insulating adhesives can be fast cured at low temp.