Weller MG100s fume extraction unit is designed for hand soldering, heavy duty and general soldering, gluing, cleaning, filing and other fine dust applications.

REGI-007 VOC is an alcohol-based, no-clean flux with organic activation system.

Two to 7W/m-K dispensable thermal interface gap fillers are suitable for thin bond line and gap filler applications.

R&S Spectrum Rider FPH handheld spectrum analyzers now include base models with frequencies up to 44GHz.

C.FL series coaxial connector serves 5G device market.

Vishay Techno CDMM high-voltage chip divider is now offered in a ribbed molded package with compliant surface-mount leads.

IHVR-4025JZ-3Z vertical-mount inductor comes in 10.25mm x 6.4mm x 10mm 4025 case size.

New software on 3Xi-M110 inline 3D-AXI system for printed circuit board inspection reduces cycle time up to 50%.

VT-S10 series 3D AOI uses multi-direction, multi-color imaging, MPS 3D hardware and AI to reduce false calls, improve first-pass yields and optimize defect detection.

Meister D+ True3D inspection system is for chiplets and system-in-package devices, including die and surface mount components.

Includes enhanced support for flex/rigid-flex and embedded component visualization in 2-D and 3-D environments.

Alpha WS-826 water-soluble solder paste is designed to provide excellent environmental stability in extreme operating conditions.