Profiling Software 2G and SPS Smart Profilers now come with optional Dual Profiling, permitting up to 24 thermocouple locations in a single profile run for temperature profiling measurements.

PF918-S lead-free BGA spheres is formulated with SnAg4.0Bi3.0 alloy designed with high thermal impact reliability for long service life electronic products with high-reliability requirements.

HCSM2818 resisters are rated at 5W and now provide a 2mΩ resistance value with TCR of 100ppm.

Master Bond EP17TF one-part epoxy has paste consistency and can be dispensed evenly and uniformly.

CSNL2512-3W current sensing resistor now includes 0.2mΩ resistance value.

This interactive component search tool is available as a fixed navigation menu option on the Kyocera AVX website and accessible via computer, tablet or smartphone.

Panda 500 CE robotic soldering system is capable of processing 500mm x 500mm PCB or pallet and deploying vision for fine alignment.

Molex Quad-Row board-to-board connectors feature staggered-circuit layout.

SMEF-Z52 enhanced solder joint encapsulation material flux combines abilities of conventional flux and underfill.

SM-100 smart mixer provides solder paste mixing with real-time quality control and materials traceability.

CC-100 thickness tester provides non-destructive and contactless conformal coating thickness measurements.

BD9xxN1 series automotive LDO regulator ICs have stable operation at nanoscale output capacitance.