Micronox MX2120 multi-metal safe power module cleaner is an aqueous, single-phase cleaner designed to remove tough flux residue from power modules that use nickel and most copper DBC as substrates.

WSW Solder Wire is designed for hand and robotic soldering. Reduces tip consumption.

MYPro I series 3-D AOI offers redesigned ergonomics, as well as new programming tools that reduce programming time by up to 30%.

Bonding system is designed to bond replacement circuit patterns such as surface mount pads, BGA pads, and plated hole pads to PCBs.

BGA-006 optical inspection unit provides side-view BGA inspection.

Sustained ring soldering module permits preassembled solder rings to be placed on and around THT pins, which are then melted by laser, piston or induction soldering, or IR emitters, hot air or thermodes.

RMCA series is AEC-qualified and has excellent long-term reliability for automotive applications.

EO-B-016 no-clean, alcohol-based flux has been developed for selective soldering.

iPure-1 high-capacity fume extraction system was developed for high-capacity dispensing and conformal coating line applications and adsorption of harmful volatile organic compounds emitted during these processes.

GF600 thermal gap filler provides thermal performance of 6.0W/m.K. Is designed to provide greater stability than traditional thermal interface materials.

UVCLX UV cure coating Xtra is solvent-free bio coating in which 75% of organic content is obtained from renewable sources.

FH75 series automotive flexible printed circuit/flat flexible connector supports MIPI D-PHY specifications.