Flex Line 3-D inline x-ray system has variable belt conveyor that can transport small/light and large/heavy assemblies.

Edison II ACT (Automatic Changeover Technology) printer provides progressive stages toward full automation.

SCARA robots provide high-performance robot control, motion control, and machine automation from single controller.

vPolyTan T50 surface-mount polymer tantalum molded chip capacitors are for high-temperature, high-humidity operating conditions.

Micronox MX2120 multi-metal safe power module cleaner is an aqueous, single-phase cleaner designed to remove tough flux residue from power modules that use nickel and most copper DBC as substrates.

WSW Solder Wire is designed for hand and robotic soldering. Reduces tip consumption.

MYPro I series 3-D AOI offers redesigned ergonomics, as well as new programming tools that reduce programming time by up to 30%.

Bonding system is designed to bond replacement circuit patterns such as surface mount pads, BGA pads, and plated hole pads to PCBs.

BGA-006 optical inspection unit provides side-view BGA inspection.

Sustained ring soldering module permits preassembled solder rings to be placed on and around THT pins, which are then melted by laser, piston or induction soldering, or IR emitters, hot air or thermodes.

RMCA series is AEC-qualified and has excellent long-term reliability for automotive applications.

EO-B-016 no-clean, alcohol-based flux has been developed for selective soldering.