SLX is a zero-setup profiling system for reflow and wave solder applications.

Solderstar VP Nano captures thermal profiles of electronics assemblies that use numerous components or require higher mass PCB substrates.

ISO-Spector M2 inline 3-D AOI system with artificial intelligence is for high-end electronics assembly.

Draloric RCV-AT e3 thick-film chip resistors are AEC-Q200-qualified and have operating voltages up to 3kV in 2010 and 2512 case sizes.

Vivid Cure LCD edge bonding adhesives are for high-speed LCD display assembly and are compatible with HumiSeal face bonding products.

Intelli-Pro AI smart factory automation software and algorithm package is designed for improving performance of AOI machines.

Etimol SW 25/FD RAN cleaning agent is drying-optimized and has been developed for SMT stencil washing systems that have no or insufficient heating or drying.

EP5G-80 is a one-component, NASA low outgassing rated epoxy with temp. cure requirement of 80°C for 4 hr.

i-Cube10 (YRH10) hybrid placer has surface mounter functions for electronic components and a die bonder for wafer components.

Double-sided, molded ball grid array is for 5G RF module design, characterization and packaging technology.

UV500-2 high solids UV dual-cure elastomeric acrylate conformal coating is for automotive applications.

AHC series SMT hybrid electrolytic aluminum capacitors are available in five case sizes: 0608, 0609, 0810, 0812, and 1010.