E-ssembly uses E-cell concept created with Taktomat.

VINcoSIM online simulation tool features topology modeling and temperature calculation engine.

Flex-to-Board RF mmWave Connector 5G25 meets 5G mmWave applications requiring signal integrity at higher frequencies up to 25GHz.

OmniCure S2000 Elite spot UV curing system is for medical devices, electronics, optical components and automotive products.

Brightware Studio software provides additional functionality to Microfactory, which combines intelligent software and modular building blocks to automate repetitive assembly and inspection tasks.

LED405FL3 is a one-component LED curing adhesive with optical clarity and a refractive index of 1.51.

IRB 920T Scara robot is designed for high-speed production.

VeriSpector is an AOI for use on manual and semiautomated SMD and THT assembly stations.

Draloric RCC1206 e3 thick-film chip resistor in 1206 case size now has higher power rating of 0.5W.

NexygenPlus 4.1 materials testing software is for testing physical properties of raw material prior to processing, and for development of new electronics design and functionality.

3880-II die bonder includes options to maximize productivity, reduce programming time by up to 95% and improve bonder productivity.

Thin film wraparound PHPA series resistors have power ratings of 1.0W and 2.5W in 1206 and 2512 case sizes, respectively, with a self-passivated tantalum nitride film for moisture resistance.