SMEF-Z52 enhanced solder joint encapsulation material flux combines abilities of conventional flux and underfill.

SM-100 smart mixer provides solder paste mixing with real-time quality control and materials traceability.

CC-100 thickness tester provides non-destructive and contactless conformal coating thickness measurements.

BD9xxN1 series automotive LDO regulator ICs have stable operation at nanoscale output capacitance.

Inspekto S70 autonomous machine vision software features recommendations center that guides users to create and maintain inspection profiles and improve process integration and accuracy of inspection. Incorporates profile center, including tools that guide users when adjusting profile.

Flicker-free HD-025-B UV LED ring light has homogeneous illumination at λ365nm wavelength range.

TCR for CSSK0612 four terminal current sense shunt resistors has been improved down to 100ppm for resistance range from 0.5mΩ to 5mΩ. 

Are reportedly ideal for power monitoring, management and control for a range of end products.

Stackpole Electronics
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Bowman A Series Micro XRF measures smallest features on semiconductors and microelectronics.

NC-809 halogen-free, ultra-low residue, flip-chip flux is designed to hold die or solder spheres in place without risk of die shift during assembly.

KW30 1mm-pitch wire-to-board connector is available in two to eight positions.

EP2 tantalum capacitor is available with radial through-hole terminations with stud-mount option in B and C case codes.

High Speed Alignment software reportedly can increase speed of six-axis robots 70% and improve accuracy 50%.