Test and Inspection
Every test strategy has its challenges. Suggestions on how to cope with programming issues.
The network communication (netcomm) printed circuit board assembly is one the largest boards in terms of size, number of nodes/nets and components. It also has the most advanced technology in terms of speed and complexity. The quality of a product and its success depends on deploying an effective manufacturing test strategy to catch structural defects and prevent bad boards from flowing down to the functional station, box build or, at worst, into customers’ hands.
Press Releases
- NEOTech Significantly Improves Wire Bond Pull Test Process
- Sat Nusapersada Chooses Siemens' Process Preparation Software to Boost NPI and SMT Line Efficiency
- SIA Praises Finalization of CHIPS Investments for GlobalFoundries Manufacturing Projects
- KYZEN to Spotlight KYZEN E5631, AQUANOX A4618 and Process Control at SMTA Silicon Valley Expo and Tech Forum