Circuits Assembly Online Magazine

NEWS

PCEA Names 2025-26 Directors and Officers

PEACHTREE CITY, GA – The PCEA membership elected its board of directors for the next two years at its annual meeting in October. Read More...

Foxconn Breaks Ground on New Headquarters in China

ZHENGZHOU, CHINA – Foxconn has broken ground on a new headquarters building here in China's Henan province. Read More...

Ducommun Reports 3% Increase in Q4 Revenue

SANTA ANA, CA – Ducommun announced $197.3 million in fourth quarter revenue, up 2.7% over the fourth quarter of 2023. Read More...

Fleming Named First PCEA Training Tech Director

PEACHTREE CITY, GA – PCEA Training today named respected industry veteran Paul Fleming technical director, PCB design. Read More...

Apple Plans $500B in US Investments

CUPERTINO, CA – Apple will spend $500 billion in US investments in the next four years that will include a giant factory in Texas for artifi... Read More...

Semiconductor Manufacturing Industry Sees Solid Q4 Results, SEMI Reports

MILPITAS, CA – The global semiconductor manufacturing industry closed 2024 with strong fourth quarter results and solid year-over-year growt... Read More...

Electronics Industry Demand Rises in February

BANNOCKBURN, IL – Orders, capacity utilization, and backlogs all increased in the past month, pushing electronics industry demand higher acc... Read More...

Scanfil Reports 13.5% Decline in Annual Sales

OULU, FINLAND – Scanfil reported €779.8 million ($816.9 million) in full-year sales, a decrease of 13.5% compared to the previous year. ... Read More...

North American PCB Industry Sales Up 20% in January

BANNOCKBURN, IL – North American PCB shipments in January were up 19.9% compared to January 2024, IPC announced in findings from its North A... Read More...

FEATURES

Understanding Solder Paste Viscosity and Thixotropy

Selecting the right paste requires an understanding of its properties. A solder paste’s viscosity and thixotropic properties influence its performance in diffe... Read More...

How Squeegee Blade Profile Helps Improve the Screen-Printing Process

A factorial design investigating solder paste volume under varied squeegee pressure and squeegee types. It is generally agreed that, on average, 40% to 60% of ... Read More...

‘It’s Got to Work’

STI Electronics prides itself on reliability and training the next generation of workers. With its home just a few miles from a major military and aerospace te... Read More...

Comparing Coated vs. Uncoated Stencils

While cheaper to use, uncoated stencils can have a detrimental effect on printing performance. In a recent study focused on optimizing solder paste transfer ef... Read More...

Ensuring Optimal Performance of Solder Paste in Challenging Environments

Heat and cold can prematurely degrade incorrectly handled materials. Solder paste is an elaborate mixture of metal powders, acids, thixotropes, solvents and a ... Read More...

Filling the Gap: Underfill Materials Dispensing for Electronics

The benefits of capillary flow underfills on solder joint reliability. In electronics manufacturing, underfill refers to a material that is applied to fill the... Read More...

Keeping Electronics Cool

Types of TIMs and their application methods. As demand for high-performance electronic devices continues to grow, managing heat dissipation effectively has bec... Read More...

When to Downsize Solder Paste Powders

Smaller components do not always need a smaller paste. As components shrink in size, the demand for finer solder pastes increases. But the selection of solder ... Read More...

Royalty Flush

A noted solutions architect offers an audacious plan for AI acceptance. It just might work. The talk of AI-based printed circuit design – and the idea that art... Read More...