Circuits Assembly Online Magazine

NEWS

SIIX Reports 2% Decline in Annual Revenue

OSAKA, JAPAN – SIIX announced annual revenue of JPY302.3 billion ($2 billion), down 2.4% from 2023's total. Read More...

Report: Foxconn Impacted by Tightened China Tech Exports

TAIPEI – Foxconn is among the companies affected by efforts by China to control the outflow of its technology and keep key technologies with... Read More...

Gartner: Worldwide Semiconductor Revenue Grew 18% in 2024

STAMFORD, CT – Worldwide semiconductor revenue in 2024 totaled $626 billion, an increase of 18.1% from 2023, according to preliminary result... Read More...

Keytronic Plans $28M Expansion in Arkansas

SPOKANE VALLEY, WA – Keytronic plans to build a $28 million manufacturing facility in Springdale, AR, and anticipates creating more than 400... Read More...

Kitron Reports 19% Decrease in Q4 Revenue

BILLINGSTAD, NORWAY – Kitron's revenue for the fourth quarter was €160.6 million ($167.5 million), down 19.3% from 2023's fourth quarter. ... Read More...

Report: 7 EMS Transactions Recorded in Q4

CHICAGO – Seven EMS transactions were recorded in the fourth quarter of 2024, reflecting a decrease from eight in 2023's fourth quarter and ... Read More...

Keytronic to Expand Arkansas, Vietnam Operations

SPOKANE VALLEY, WA – Keytronic has announced plans to significantly increase production capacity in Arkansas and Vietnam. Read More...

PCEA Opens Registration for PCB Detroit Conference

PEACHTREE CITY, GA – Registration for PCB Detroit, a new technical conference and tabletop event, is now open, the Printed Circuit Engineeri... Read More...

Lacroix Sees 12% Drop in Annual Electronics Revenue

SAINT-HERBLAIN, FRANCE – Lacroix reported €494.3 million in annual revenue for its Electronics segment, down 12.1% from 2023's total. Read More...

FEATURES

Understanding Solder Paste Viscosity and Thixotropy

Selecting the right paste requires an understanding of its properties. A solder paste’s viscosity and thixotropic properties influence its performance in diffe... Read More...

How Squeegee Blade Profile Helps Improve the Screen-Printing Process

A factorial design investigating solder paste volume under varied squeegee pressure and squeegee types. It is generally agreed that, on average, 40% to 60% of ... Read More...

‘It’s Got to Work’

STI Electronics prides itself on reliability and training the next generation of workers. With its home just a few miles from a major military and aerospace te... Read More...

Comparing Coated vs. Uncoated Stencils

While cheaper to use, uncoated stencils can have a detrimental effect on printing performance. In a recent study focused on optimizing solder paste transfer ef... Read More...

Ensuring Optimal Performance of Solder Paste in Challenging Environments

Heat and cold can prematurely degrade incorrectly handled materials. Solder paste is an elaborate mixture of metal powders, acids, thixotropes, solvents and a ... Read More...

Filling the Gap: Underfill Materials Dispensing for Electronics

The benefits of capillary flow underfills on solder joint reliability. In electronics manufacturing, underfill refers to a material that is applied to fill the... Read More...

Keeping Electronics Cool

Types of TIMs and their application methods. As demand for high-performance electronic devices continues to grow, managing heat dissipation effectively has bec... Read More...

When to Downsize Solder Paste Powders

Smaller components do not always need a smaller paste. As components shrink in size, the demand for finer solder pastes increases. But the selection of solder ... Read More...

Royalty Flush

A noted solutions architect offers an audacious plan for AI acceptance. It just might work. The talk of AI-based printed circuit design – and the idea that art... Read More...